Abstract: A magnetic levitation sliding structure is provided for a portable electronic device. The sliding structure includes a first slider member with a guide portion, a second slider member with a receiving portion that mates with the guide portion, a first magnet coupled with the guide portion and having magnetic poles arranged in a direction perpendicular to a sliding direction, and a spaced-apart pair of second magnets coupled with the receiving portion. The first magnet is configured in a central portion of the guide portion and is disposed between the spaced-apart pair of second magnets for facilitating relative sliding movement of the first and second slider members. A portable electronic device including the magnetic levitation sliding structure is also provided.

Abstract: A hydrodynamic fluid film bearing for supporting a rotation shaft of a turbo or rotary apparatus includes a sleeve having a circular inner opening for receiving a rotation shaft therein, at least one metallic foil member of arc shape having one end fixed to the inner surface of the sleeve and arranged along the inner opening of the sleeve, and at least one elastic member disposed at the sleeve between the sleeve and the foil member. A bearing housing for receiving a bearing of a rotary apparatus is further provided, in which the bearing housing includes a circular opening for receiving the bearing therein, and the circular inner opening of the bearing housing includes grooves for cooling air passage formed at regular interval in the axial direction on the inner surface of the bearing housing. The bearing received in the bearing housing is preferably a hydrodynamic fluid film bearing.

Abstract: A method of manufacturing a substrate for a circuit board includes forming a groove having a predetermined shape and pattern in at least one surface of a substrate formed of an insulating material, filling the groove with a conductive material, and forming a circuit pattern by hardening the conductive material filling the groove. The groove is preferably formed by impression with a die containing a pattern corresponding to the shape and pattern of the groove. A substrate and a smart label formed of the substrate are also disclosed.

Abstract: Provided is a method for fabricating a semiconductor package with a lead frame and the semiconductor package provided thereof. The method includes supplying a lead frame with a plurality of molding regions for molding a plurality of semiconductor packages, and attaching tape to at least one surface of the lead frame to prevent a molten molding material from contacting the lead frame on that surface. The tape comprises a plurality of vacant regions corresponding to the boundary of each molding region. This method distributes the tension and expansion stress of the tape caused by a heating roller when laminating the tape on the lead frame, thereby preventing bending of the strip.

Abstract: A wireless communication device is disclosed. The wireless communication device comprises a body; and an input/output port installed on a side of said body and electrically connected to an antenna connecting portion of a communication module installed in said body. Thus, the input/output port of the wireless communication device also functions as the antenna.

Abstract: A smart label includes an antenna formed with a narrow film or panel-like material rolled in a roll, the film having one face of conductive layer and an opposite face of nonconductive layer, and a semiconductor chip attached to a side surface of the rolled antenna, the semiconductor chip having a first connection terminal connected to the conductive layer at a location adjacent to an outermost winding of the antenna and a second connection terminal connected to the conductive layer at a location adjacent to an innermost winding of the antenna.

Abstract: An apparatus controlling a specific function is provided. The specific function controlling apparatus includes a signal generator and a recognizer. The signal generator transmits and receives a first signal of a specific frequency. The recognizer is installed in a specific function module having a specific function device for executing a specific function. The specific function module is installed in an electronic equipment. The recognizer includes an antenna part and a control part. The antenna part is responsive to the specific frequency of the signal generator. The control part is electrically connected to the specific function device and the antenna part to control the specific function according to the first signal.

Abstract: A hydrodynamic fluid film bearing for supporting a rotation shaft of a turbo or rotary apparatus includes a sleeve having a circular inner opening for receiving a rotation shaft therein, at least one metallic foil member of arc shape having one end fixed to the inner surface of the sleeve and arranged along the inner opening of the sleeve, and at least one elastic member disposed at the sleeve between the sleeve and the foil member. A bearing housing for receiving a bearing of a rotary apparatus is further provided, in which the bearing housing includes a circular opening for receiving the bearing therein, and the circular inner opening of the bearing housing includes grooves for cooling air passage formed at regular interval in the axial direction on the inner surface of the bearing housing. The bearing received in the bearing housing is preferably a hydrodynamic fluid film bearing.

Abstract: Provided is a method for fabricating a semiconductor package with a lead frame and the semiconductor package provided thereof. The method includes supplying a lead frame with a plurality of molding regions for molding a plurality of semiconductor packages, and attaching tape to at least one surface of the lead frame to prevent a molten molding material from contacting the lead frame on that surface. The tape comprises a plurality of vacant regions corresponding to the boundary of each molding region. This method distributes the tension and expansion stress of the tape caused by a heating roller when laminating the tape on the lead frame, thereby preventing bending of the strip.

Abstract: A method of manufacturing a substrate for a circuit board includes forming a groove having a predetermined shape and pattern in at least one surface of a substrate formed of an insulating material, filling the groove with a conductive material, and forming a circuit pattern by hardening the conductive material filling the groove. The groove is preferably formed by impression with a die containing a pattern corresponding to the shape and pattern of the groove. A substrate and a smart label formed of the substrate are also disclosed.

Abstract: A wireless communication device is disclosed. The wireless communication device comprises a body; and an input/output port installed on a side of said body and electrically connected to an antenna connecting portion of a communication module installed in said body. Thus, the input/output port of the wireless communication device also functions as the antenna.

Abstract: A smart label includes an antenna formed with a narrow film or panel-like material rolled in a roll, the film having one face of conductive layer and an opposite face of nonconductive layer, and a semiconductor chip attached to a side surface of the rolled antenna, the semiconductor chip having a first connection terminal connected to the conductive layer at a location adjacent to an outermost winding of the antenna and a second connection terminal connected to the conductive layer at a location adjacent to an innermost winding of the antenna.