Abstract: An organic electronic device including a substrate, an organic electronic element formed on the substrate, and an encapsulation film encapsulating the organic electronic element. The organic electronic element includes a transparent electrode formed on the substrate, and a light emitting organic material layer formed on the transparent electrode. The light emitting organic material layer includes a hole transport layer, an emitting layer and an electron transport layer. The encapsulation film includes a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer includes a pressure-sensitive adhesive composition or a crosslinked product thereof. The pressure-sensitive adhesive composition includes a polymer derived from butylene, and has a Mooney viscosity (?*) of 5000 Pa·s to 107 Pa·s measured by a shear stress using a planar jig having a diameter of 8 mm at a strain of 5%, a frequency of 1 Hz and any one temperature point in the range of 30° C. to 150° C.

Abstract: The present disclosure provides an adhesive composition including an aliphatic urethane (meth)acrylate, a thickener and a spacer. The adhesive composition has printability that printing can be effectively performed into a pattern with a thin width or the like, and is capable of forming an adhesive having excellent physical properties such as transparency, a gap maintaining ability capable of maintaining a constant cell gap between films and adhesive force. The adhesive composition is useful for constituting an optical element for HMDs.

Abstract: The present application relates to a resin composition, a battery module comprising a cured product of the resin composition, a manufacturing method thereof and a battery pack. According to one example of the present application, injection processability of the resin composition can be improved, overloading of injection equipment can be prevented, and the battery module having excellent insulation properties can be provided.

Abstract: The present application relates to a composition, a battery module and a battery pack. According to one example of the present application, there is provided a urethane-based heat dissipation material capable of providing excellent thermal conductivity and storage stability.

Abstract: Provided is a composition for encapsulating an organic electronic element, comprising an olefin-based resin having at least one reactive functional group, a multifunctional acrylic oligomer, and a monofunctional acrylic oligomer, wherein the monofunctional acrylic oligomer is present in an amount of 7 to 30 parts by weight relative to 100 parts by weight of the olefin-based resin. Also provided are an organic electronic device comprising the composition, and methods for preparing the organic electronic device.

Abstract: A battery module and a method of manufacturing the same are disclosed herein. In some embodiments, a battery module includes a module case having an internal space formed by a top plate, a bottom plate and sidewalls of the module case, a plurality of battery cells disposed in the internal space, a first filler-containing cured resin layer in contact with both the top plate and the plurality of battery cells, and a second filler-containing cured resin layer in contact with both the bottom plate and the plurality of battery cells. The battery module can have excellent power relative to volume, while being manufactured in a simple process and at a low cost.

Abstract: The present application provides an encapsulation film comprising an encapsulation layer, a metal layer, and a protective layer. The encapsulation film provides a structure capable of blocking moisture or oxygen introduced into an organic electronic device from the outside, minimizes the appearance change of the film due to excellent handling properties and processability, and prevents physical and chemical damage during encapsulation process.

Abstract: The present application relates to a composition, a battery module and a battery pack. According to one example of the present application, it is possible to provide a battery module and a battery pack which have improved heat dissipation properties, adhesive force, adhesion reliability and processability as well as excellent power to volume.

Abstract: The present application relates to an adhesive composition capable of fixing a battery cell in a battery module and a battery pack. According to one example of the present application, there is provided a two-component urethane-based adhesive composition which has excellent storage stability and processability and is capable of providing physical properties required in related uses in a short time.

Abstract: The present application relates to a composition, a battery module and a battery pack. According to one example of the present application, the related manufacturing process can be improved and a battery module having excellent insulation can be provided.

Abstract: A method for determining a dispensing apparatus for a heat-dissipating material and according to one aspect of the present invention is provided. The method for determining a dispensing apparatus for a heat-dissipating material includes detecting an internal material of a dispensing apparatus from a heat-dissipating material discharged from the dispensing apparatus; and determining suitability of the dispensing apparatus based on the detected amount of the internal material.

Abstract: An encapsulation film, a method for manufacturing the same, an organic electronic device comprising the same, and a method for manufacturing the organic electronic device using the same are provided, where the encapsulation film allows forming a structure capable of blocking moisture or oxygen penetrating into an organic electronic device from outside and prevents generation of bright spots in the organic electronic device.

Abstract: The present application relates to a composition for encapsulating an organic electronic element and an organic electronic device comprising the same, and provides the composition which forms an encapsulating structure capable of effectively blocking water or oxygen introduced from the outside into the organic electronic device, thereby securing the lifetime of the organic electronic device and implementing endurance reliability of the encapsulating structure at high temperature and high humidity, and has high shape retention characteristics, and an organic electronic device comprising the same.

Abstract: The present application can provide a battery module, a method for manufacturing method the same and a thermally conductive material applied to the manufacturing method. The present application can provide a battery module having excellent output relative to volume and heat dissipation characteristics, with being manufactured in a simple process and at a low cost, a method for manufacturing the same, and a thermally conductive material applied to the manufacturing method.

Abstract: Disclosed is related to an adhesive composition for encapsulating an organic electronic element and an organic electronic device comprising the same. The adhesive composition includes a curable compound having no carbon-carbon unsaturated group, a thermal initiator, and a photo-initiator. The adhesive composition can form a structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifetime of the organic electronic device, can realize a top emitting organic electronic device, and can prevent defects such as dark spots which may occur in the organic electronic device.

Abstract: The present disclosure relates to a composition for encapsulating an organic electronic element and an organic electronic device comprising the same, and provides an encapsulation composition which can form an encapsulation structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifespan of the organic electronic device and implementing endurance reliability of the encapsulation structure at high temperature and high humidity, and has high shape retainability, and an organic electronic device comprising the same.

Abstract: A method for manufacturing a battery module is disclosed herein. In some embodiments, a method for manufacturing a battery module which comprises a module case, in which an internal space is formed by a bottom plate and sidewalls, and an injection port is formed in the bottom plate or the sidewalls; a plurality of battery cells existing in the internal space; and a resin layer in contact with the bottom plate or the sidewalls while being in contact with the battery cells, the method including attaching a tape to cover the injection port of the bottom plate or the sidewalls; mounting an injection device of a resin composition such that the injection device is mounted on the injection port while penetrating the tape, and injecting the resin composition into the mounted injection device. The method provides a simple process and at low cost without occurrence of a reverse discharge phenomenon.

Abstract: The present application relates to an encapsulation film, a method for producing the same, an organic electronic device comprising the same, and a method for preparing an organic electronic device using the same, which allows forming a structure capable of blocking moisture or oxygen introduced into an organic electronic device from the outside, and can prevent occurrence of bright spots of the organic electronic device.

Abstract: The present application can provide a battery module, a manufacturing method thereof, and a resin composition applied to the manufacturing method. The present application can provide a battery module having excellent power relative to volume, while being manufactured in a simple process and at a low cost, a manufacturing method thereof, and a resin composition applied to the manufacturing method.

Abstract: The present disclosure relates to an encapsulation film and an organic electronic device comprising the same, which provides an encapsulation film having excellent resilience without causing plastic deformation, while having flexible and rollable characteristics, as well as implementing excellent moisture barrier characteristics, and an organic electronic device comprising the same. The encapsulation film includes an encapsulation composition which includes a block copolymer having a first block derived from a monomer having a glass transition temperature of 0° C. or higher, and a multifunctional oligomer, where, after the encapsulation film is stretched 200% (2 times the existing length) in the longitudinal direction under conditions of a temperature of 25° C. and 60% relative humidity and left for 24 hours, the degree of restoration at the time of removing the stretched force and measuring the length after 1 hour is within 110% of the existing length.