Abstract: The present application can provide a battery module, a manufacturing method thereof, and a resin composition applied to the manufacturing method. The present application can provide a battery module having excellent power relative to volume, while being manufactured in a simple process and at a low cost, a manufacturing method thereof, and a resin composition applied to the manufacturing method.

Abstract: A thermally conductive resin composition is disclosed herein. The thermally conductive resin composition exhibits high thermal conductivity while having excellent handling properties. In an embodiment, a resin composition includes a resin component and 600 parts by weight or more of a thermally conductive filler relative to 100 parts by weight of the resin component. The thermally conductive filler comprise 30 to 50 wt % of a first thermally conductive filler having a D50 particle diameter of 35 ?m or more, 25 to 45 wt % of a second thermally conductive filler having a D50 particle diameter in a range of 15 ?m to 30 ?m, and 15 to 35 wt % of a third thermally conductive filler having a D50 particle diameter of 1 to 4 ?m, based on the total weight of the thermally conductive filler.

Abstract: The present application relates to an encapsulation film, a method of manufacturing the same, an organic electronic device including the same, and a method of manufacturing the organic electronic device using the same. The present application provides an encapsulation film which can be formed to have a structure in which moisture or oxygen flowing from the outside into an organic electronic device can be effectively blocked, has excellent handling properties and processability, and also has excellent bonding properties with an organic electronic element and durability.

Abstract: The present application relates to a curable composition, a cured product and uses of the curable composition and the cured product. By comprising the curable compound having a certain structure, the present application can provide a curable composition which can increase cohesiveness of the cured product without increasing viscosity of the composition before curing, also minimize the increase of the elastic modulus, and also minimize the ratio of a nonreactive oligomer with an effect of improving the interfacial adhesion. The curable composition can be applied to a variety of optical applications and can be usefully used, for example, for bonding various optical functional members in a display device, for example, for directly bonding a touch panel and a display panel.

Abstract: The present disclosure provides an adhesive composition including an aliphatic urethane (meth)acrylate, a thickener and a spacer. The adhesive composition has printability that printing can be effectively performed into a pattern with a thin width or the like, and is capable of forming an adhesive having excellent physical properties such as transparency, a gap maintaining ability capable of maintaining a constant cell gap between films and adhesive force. The adhesive composition is useful for constituting an optical element for HMDs.

Abstract: The present application relates to an encapsulation film, a method for manufacturing the same, a method for manufacturing an organic electronic device using the same, and an organic electronic device comprising the same, and provides an encapsulation film which allows forming a structure capable of effectively blocking moisture or oxygen introduced into the organic electronic device from the outside, and has excellent handleability and processability, and excellent bonding property between the encapsulation layer and the panel of the organic electronic device and endurance reliability.

Abstract: The present application relates to a resin composition, a battery module comprising a cured product of the resin composition, a manufacturing method thereof and a battery pack. According to one example of the present application, injection processability of the resin composition can be improved, overloading of injection equipment can be prevented, and the battery module having excellent insulation properties can be provided.

Abstract: A cross-linkable composition can be provided in the present application. In one embodiment, the cross-linkable composition can allow a membrane formed of the cross-linkable composition to have an excellent interfacial adhesion with another membrane and prevent the occurrence of a detachment phenomenon or the like.

Abstract: As a pressure-sensitive adhesive polarizing plate, for example, a pressure-sensitive adhesive polarizing plate allowing a pressure-sensitive adhesive layer in the polarizing plate to have an excellent interfacial adhesion with another layer and have no detachment phenomenon can be provided in the present application.

Abstract: The present application relates to a cross-linkable composition, and for example, to a cross-linkable composition which can form a membrane having an excellent interfacial adhesion with other layers and cause no detachment phenomenon when forming a membrane in a structure of a pressure-sensitive adhesive optical member or the like.

Abstract: The present application relates to an encapsulating film, a reliability assessment therefor, an organic electronic apparatus comprising the encapsulating film, and a method for producing an organic electronic apparatus which has used the encapsulating film, and provides: a reliability assessment method which can predict the reliability of the encapsulating film before same is applied to the organic electronic apparatus, the encapsulating film blocking moisture or oxygen from the outside entering the organic electronic apparatus; and the encapsulating film which can block moisture with high reliability.

Abstract: The present application relates to a composition for encapsulating an organic electronic element and an organic electronic device comprising the same, and provides the composition which forms an encapsulating structure capable of effectively blocking water or oxygen introduced from the outside into the organic electronic device, thereby securing the lifetime of the organic electronic device and implementing endurance reliability of the encapsulating structure at high temperature and high humidity, and has high shape retention characteristics, and an organic electronic device comprising the same.

Abstract: The present application provides an encapsulation film comprising an encapsulation layer, a metal layer, and a protective layer. The encapsulation film provides a structure capable of blocking moisture or oxygen introduced into an organic electronic device from the outside, minimizes the appearance change of the film due to excellent handling properties and processability, and prevents physical and chemical damage during encapsulation process.

Abstract: A compound applicable to various uses can be provided in the present application. In one embodiment, the compound can be included in a cross-linkable composition to serve as a crosslinking rate regulator. In another embodiment, the compound can be applied to a cross-linkable composition such that a membrane formed by the cross-linkable composition has excellent interfacial adhesion with another membrane, and also prevent the occurrence of leakage of the membrane formed by the cross-linkable composition.

Abstract: The present application relates to an organic electronic device, and provides the organic electronic device including an encapsulating structure capable of effectively blocking water or oxygen introduced from the outside into the organic electronic device, thereby securing the lifetime of the organic electronic device and implementing endurance reliability of the encapsulating structure at high temperature and high humidity, and having high shape retention characteristics.

Abstract: Provided are an adhesive composition and an organic electronic device (OED) including the same, and more particularly, an adhesive composition, which may form a structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, realize a top-emission OED, and exhibit excellent adhesive durability and reliability, and excellent reliability at high temperature and high humidity, and an OED including the same.

Abstract: A method for manufacturing a battery module is disclosed herein. In some embodiments, a method for manufacturing a battery module which comprises a module case, in which an internal space is formed by a bottom plate and sidewalls, and an injection port is formed in the bottom plate or the sidewalls; a plurality of battery cells existing in the internal space; and a resin layer in contact with the bottom plate or the sidewalls while being in contact with the battery cells, the method including attaching a tape to cover the injection port of the bottom plate or the sidewalls; mounting an injection device of a resin composition such that the injection device is mounted on the injection port while penetrating the tape, and injecting the resin composition into the mounted injection device. The method provides a simple process and at low cost without occurrence of a reverse discharge phenomenon.

Abstract: The present application relates to a composition, a battery module and a battery pack. According to one example of the present application, it is possible to provide a battery module and a battery pack which have improved heat dissipation properties, adhesive force, adhesion reliability and processability as well as excellent power to volume.

Abstract: The present application relates to an adhesive composition capable of fixing a battery cell in a battery module and a battery pack. According to one example of the present application, there is provided a two-component urethane-based adhesive composition which has excellent storage stability and processability and is capable of providing physical properties required in related uses in a short time.

Abstract: The present application relates to a composition, a battery module and a battery pack. According to one example of the present application, the related manufacturing process can be improved and a battery module having excellent insulation can be provided.