Abstract: A via includes a substrate and a porous electrically conductive material. The substrate includes a first surface and a second surface opposite to the first surface. The substrate includes a through-hole extending from the first surface to the second surface. The porous electrically conductive material extends through the through-hole. The porous electrically conductive material includes a first porosity in a central region of the through-hole and a second porosity less than the first porosity proximate the first surface and the second surface of the substrate.

Abstract: A method of manufacturing an electrode includes, printing a metal precursor ink onto a contact pad on a substrate; drying the metal precursor ink; printing a nanoparticle ink on the metal precursor ink; and consolidating the metal precursor ink and the nanoparticle ink such that metal from the precursor ink and metal from the nanoparticle ink fuse together. An electrode includes a metal precursor ink electrically contacting a contact pad; and a nanoparticle ink electrically contacting the metal precursor ink on the contact pad. An array substrate can include the electrode.

Abstract: A method of assembling a display area includes selecting a first tile from a plurality of tiles, each tile of the plurality of tiles includes a predetermined parameter and a plurality of microLEDs defining a plurality of pixels. The selecting the first tile based on a value of the predetermined parameter of the first tile. The method includes selecting a second tile from the plurality of tiles based on a value of the predetermined parameter of the second tile. The method further includes positioning the first tile and the second tile into an array defining at least a portion of the display area. A first edge of the first tile facing a second edge of the second tile. A display device including the display area assembled by the method is also provided.

Abstract: Apparatuses and methods are described for substrate materials and designs for controlling heat dissipation from semiconductor devices such as light-emitting diodes (LEDs). The embodiments may reduce temperature increases of semiconductor devices during operation. In some examples, a substrate structure is manufactured with a plurality of fins positioned along a first side. A plurality of heating sources, such as electronic components that generate heat, may be positioned along a second side of the substrate structure. The plurality of heat sources may be positioned to be laterally offset from the plurality of fins. In some examples, a plurality of LEDs are positioned along the first side of the substrate structure and at least partially laterally in line with the plurality of fins. In some examples, the plurality of LEDs are positioned along the first side of the substrate structure and laterally offset from the plurality of fins.

Abstract: Embodiments are related to systems and methods for forming vias in a substrate, and more particularly to systems and methods for reducing substrate surface disruption during via formation.

Abstract: A method of performing ion exchange of a thin, flexible glass substrate having an average thickness equal to or less than about 0.3 mm to chemically strengthen the glass substrate is disclosed. The chemically strengthened glass substrate comprises a first compressive stress layer having a first depth of layer, and a second compressive stress layer having a second depth of layer, the first and second stress layers being separated by a layer of tensile stress. A laminated article comprising the chemically strengthened glass substrate is also described.

Abstract: A method of assembling a display area includes selecting a first tile from a plurality of tiles, each tile of the plurality of tiles includes a predetermined parameter and a plurality of microLEDs defining a plurality of pixels. The selecting the first tile based on a value of the predetermined parameter of the first tile. The method includes selecting a second tile from the plurality of tiles based on a value of the predetermined parameter of the second tile. The method further includes positioning the first tile and the second tile into an array defining at least a portion of the display area. A first edge of the first tile facing a second edge of the second tile. A display device including the display area assembled by the method is also provided.

Abstract: A ceramic waveguide includes: a doped metal oxide ceramic core layer; and at least one cladding layer comprising the metal oxide surrounding the core layer, such that the core layer includes an erbium dopant and at least one rare earth metal dopant being: lanthanum, cerium, praseodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, thulium, ytterbium, lutetium, scandium, or oxides thereof, or at least one non-rare earth metal dopant comprising zirconium or oxides thereof. Also included is a quantum memory including: at least one doped polycrystalline ceramic optical device with the ceramic waveguide and a method of fabricating the ceramic waveguide.

Abstract: A method of assembling a display area includes selecting a first tile from a plurality of tiles, each tile of the plurality of tiles includes a predetermined parameter and a plurality of microLEDs defining a plurality of pixels. The selecting the first tile based on a value of the predetermined parameter of the first tile. The method includes selecting a second tile from the plurality of tiles based on a value of the predetermined parameter of the second tile. The method further includes positioning the first tile and the second tile into an array defining at least a portion of the display area. A first edge of the first tile facing a second edge of the second tile. A display device including the display area assembled by the method is also provided.

Abstract: Various embodiments for a laminate glass article having an integrated switch therein and related methods are provided. The laminated glass article a force sensor configured within one or more layers of the laminate with sufficient spacer incorporation to provide a force sensing switch. Related methods are also provided.

Abstract: A glass substrate with improved microLED transfer characteristics is disclosed, the glass substrate comprising a first major surface, a second major surface opposite the first major surface, and a thickness therebetween. An electrically functional layer may be disposed on the first major surface. The glass wafer exhibits a waviness with a magnitude less than or equal to about 1 ?m in a spatial wavelength range from about 0.25 mm to about 50 mm.

Abstract: Display tiles comprising pixel elements on a first surface of a substrate connected by an electrode, a driver located opposite the first surface, and a connector wrapped around an edge surface of the substrate connecting the driver to the pixel elements. Displays comprised of display tiles and methods of manufacturing display tiles and displays are also disclosed.

Abstract: A functional laminated glass article includes: a backer substrate; a flexible glass substrate comprising a thickness of no greater than 300 ?m, and laminated to the backer substrate with an adhesive; a plurality of conductive traces disposed on one or both of the backer substrate and the flexible glass substrate; and a plurality of electronic device elements disposed between the backer substrate and the flexible glass substrate and in contact with the plurality of conductive traces. Further, the adhesive encapsulates the conductive traces and the electronic device elements between the backer substrate and the flexible glass substrate.

Abstract: A method of performing ion exchange of a thin, flexible glass substrate having an average thickness equal to or less than about 0.3 mm to chemically strengthen the glass substrate is disclosed. The chemically strengthened glass substrate comprises a first compressive stress layer having a first depth of layer, and a second compressive stress layer having a second depth of layer, the first and second stress layers being separated by a layer of tensile stress. A laminated article comprising the chemically strengthened glass substrate is also described.

Abstract: A method of performing ion exchange of a thin, flexible glass substrate having an average thickness equal to or less than about 0.3 mm to chemically strengthen the glass substrate is disclosed. The chemically strengthened glass substrate comprises a first compressive stress layer having a first depth of layer, and a second compressive stress layer having a second depth of layer, the first and second stress layers being separated by a layer of tensile stress. A laminated article comprising the chemically strengthened glass substrate is also described.

Abstract: A display device includes at least two adjacent display tiles having a seam therebetween, and an optical element at the seam to optically blur the seam between the adjacent display tiles, with each of the adjacent display tiles including a substrate, one or more light sources on a first surface of the substrate, and control electronics on a second surface of the substrate opposite the first surface.

Abstract: Embodiments of a method for making a contoured glass article and the resulting contoured glass article are disclosed. In one or more embodiments, the method includes cold bending a flat glass sheet having first and second opposing major surfaces, at least one region having a first thickness, and at least one region having a second thickness that is less than the first thickness, to produce cold bent glass sheet having at least one bend region along a portion of the at least one region having the second thickness; and restraining the cold bent glass sheet to produce the contoured glass article. One or more embodiments pertain to the resulting contoured glass article.

Abstract: An electronic apparatus includes a substrate including a first major surface, a second major surface, and an edge surface. The edge surface includes a radius of curvature extending between the first major surface and the second major surface. The electronic apparatus includes an opto-electronic device positioned on the first major surface. The electronic apparatus includes an electrical component positioned on the second major surface. The electronic apparatus includes a first electrically-conductive trace attached to the edge surface. The first electrically-conductive trace electrically connects a first portion of the opto-electronic device to the electrical component and defines a first current path. The electronic apparatus includes a second electrically-conductive trace extending through an opening in the substrate.

Abstract: An edge conductor includes a first portion electrically connected to a first conductor on a first surface of a substrate, a second portion electrically connected to a second conductor on a second surface of the substrate, a third portion extending between the first portion and the second portion along an edge of the substrate, and a coating covering at least a portion of the third portion of the edge conductor, where the second surface of the substrate is opposite the first surface of the substrate, and the edge of the substrate extends between the first surface of the substrate and the second surface of the substrate.

Abstract: A ceramic waveguide includes: a doped metal oxide ceramic core layer; and at least one cladding layer comprising the metal oxide surrounding the core layer, such that the core layer includes an erbium dopant and at least one rare earth metal dopant being: lanthanum, cerium, praseodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, thulium, ytterbium, lutetium, scandium, or oxides thereof, or at least one non-rare earth metal dopant comprising zirconium or oxides thereof. Also included is a quantum memory including: at least one doped polycrystalline ceramic optical device with the ceramic waveguide and a method of fabricating the ceramic waveguide.