Abstract: An optoelectronic device comprises a layer stack, which includes a carrier layer, a cover layer, and a first layer. The first layer is in particular an intermediate layer, arranged between the cover layer and the carrier layer. At least one electronic or optoelectronic element, in particular an optoelectronic light source, is arranged on the first layer and at least one layer of the layer stack and preferably all layers of the layer stack are at least partially transparent. The layer stack comprises at least one layer which comprises particles with a high thermal conductivity and/or at least one thermally conductive layer which is arranged between two adjacent layers of the layer stack.

Abstract: An optoelectronic device comprises an at least partially transparent intermediate layer, in particular a transparent foil, and a plurality of optoelectronic light sources arranged on or embedded in the intermediate layer, and at least one of the following: a preferably non-transparent top layer, in particular a coloured foil, arranged on an upper surface of the intermediate layer, the top layer comprises a plurality of apertures which are aligned with the light sources, so that light from a light source can be radiated to the front through the aperture which is aligned with the light source, a filtering layer, in particular configured to operate as a neutral density filter, arranged on an upper surface of the top layer or the upper surface of the intermediate layer, a non-transparent or at least partially transparent background layer, in particular a coloured foil, arranged on a bottom surface of the intermediate layer.

Abstract: An optoelectronic lighting device includes a transparent pane, in particular a glass pane, on which a first at least partially transparent intermediate layer is arranged. The optoelectronic lighting device also includes at least one optoelectronic fiber arranged on the first intermediate layer and including at least one electrical line extending in a longitudinal direction and connected to a plurality of optoelectronic semiconductor components. The optoelectronic fiber includes a flexible support substrate on which the at least one electrical line and the plurality of optoelectronic semiconductor components are arranged. The optoelectronic lighting device further includes a second at least partially transparent intermediate layer, the second intermediate layer being arranged on the first intermediate layer and covering the at least one optoelectronic fiber.

Abstract: An optoelectronic apparatus comprises a transparent first cover, at least two carriers mounted on the first cover, wherein a plurality of optoelectronic elements configured to emit light are attached to each of the at least two carriers, and a second cover mounted on the at least two carriers, wherein the second cover has at least partially a lower optical transmittance than the first cover and/or the at least two carriers.

Abstract: In an embodiment a method includes providing a carrier, applying a plurality of semiconductor chips to the carrier, the semiconductor chips being spaced apart from one another such that cavities are formed between the semiconductor chips, introducing a photo-exposable material, at least the cavities being filled with the photo-exposable material, exposing the photo-exposable material, wherein parts of the photo-exposable material, which are downstream of the semiconductor chips with respect to an exposure remain unexposed, removing unexposed parts of the photo-exposable material, wherein recesses are formed, applying a functional layer to the semiconductor chips, and removing the exposed photo-exposable material.

Abstract: Optoelectronic arrangement is proposed for use in a transparent glazing element of a vehicle, for example. The arrangement comprises at least one substantially transparent carrier layer, at least one conductor layer comprising conductor paths provided on at least one side of said carrier layer, at least one light emitting element arranged on the carrier layer and electrically coupled to conductor paths on said conductor layer and at least one proximity and/or touch sensor arranged on at least one of said carrier layers, the arrangement further being couplable to a control module for controlling the operation of said at least one light emitting element in response to information from said at least one proximity and/or touch sensor.

Abstract: In an embodiment a semiconductor device includes a semiconductor body configured to generate light of a first main wavelength, wherein the semiconductor body has a first main side having at least one contact region and a second main side opposite the first main side having a light-emitting surface and a coating arranged on the second main side, wherein the coating is substantially transparent to light in a wavelength range of the first main wavelength and is absorbent or reflective to light in a wavelength range of a second main wavelength, wherein the wavelength range of the second main wavelength is below the wavelength range of the first main wavelength and below 450 nm, and wherein the coating includes a multilayer coating sequence of materials of different refractive indices.

Abstract: An optoelectronic device, in particular an at least semi-transparent pane for example for a vehicle, comprises: a cover layer, a carrier layer, an intermediate layer between the cover layer and the carrier layer, wherein at least one and preferably a plurality of optoelectronic light sources, in particular ?LEDS, is arranged on at least one surface of the intermediate layer and/or is at least partially embedded in the intermediate layer, wherein the intermediate layer is adapted such that light emitted by the optoelectronic light sources at least partially spreads in and along the intermediate layer and exits the intermediate layer within and/or at a pre-set distance to the respective optoelectronic light source in a direction through the cover layer and/or through the carrier layer.

Abstract: An optoelectronic device, in particular a display device, comprises: at least one optoelectronic light source, an at least partially transparent front layer, an at least partially transparent support layer, wherein the light source is arranged between the front layer and the support layer, wherein a front side of the light source faces the front layer and a rear side of the light source faces the support layer, and wherein a limiting device is provided in a circumferential direction around the light source, wherein the limiting device limits a spatial region, in which the light source emits light such that total internal reflection of the emitted light, in particular at an interface between the front layer and the outside, is avoided or at least reduced.

Abstract: An optoelectronic device comprises a plurality of layer segments, in particular intermediate layer segments, arranged between a cover layer and a carrier layer. At least one optoelectronic component is arranged on at least one of the plurality of layer segments and a first and a second layer segment of the plurality of the layer segments are overlapping each other along a first direction each forming a respective boundary region. The first layer segment comprises at least one first contact pad and the second layer segment comprises at least one second contact pad, wherein the at least one first and second contact pad are arranged in the respective boundary region facing each other and being mechanically and electrically connected. The at least one first and second contact pad each comprises a plurality of nanowires which are at least partially made of conductive material such as for example copper, gold, or nickel.

Abstract: In an embodiment a device for transferring at least one semiconductor component from a carrier substrate to a target substrate includes at least one lighting device configured to emit a first light pulse onto the semiconductor component to release it from the carrier substrate and to move it towards the target substrate, the semiconductor component comprising at least one contact surface, which corresponds to at least one contact surface on the target substrate and at least one of the contact surfaces comprising a solder material and to emit a second light pulse after the first light pulse, the second light pulse configured to melt the solder material on the at least one of the contact surfaces before the semiconductor component reaches the target substrate.

Abstract: In an embodiment a target carrier for transferring semiconductor components includes a target substrate with at least two contact areas and a shrinkable collecting layer arranged around each of the at least two contact areas and projecting beyond the at least two contact areas, wherein a lateral distance between two opposite edges of the shrinkable collecting layer around each of the at least two contact areas is smaller than a lateral dimension of the at least one contact pad of the semiconductor components, wherein the shrinkable collecting layer around the at least two contact areas is designed such that its structuring is configured to penetrate into the shrinkable collecting layer with a substantially central alignment of the at least one contact pad relative to one of the at least two contact areas.

Abstract: In an embodiment an arrangement includes a plurality of optoelectronic semiconductor components arranged in a common plane, wherein each semiconductor component is laterally delimited by side faces, and wherein each semiconductor component has a semiconductor body with an active region configured to emit electromagnetic radiation, a radiation outlet side configured to couple out the electromagnetic radiation, a rear face opposite to the radiation outlet side, and a contact structure arranged on the rear face. The arrangement further includes an output element, an electrically insulating insulation layer and an electrical connection structure, wherein the insulation layer is arranged between side faces of adjacent semiconductor components and is absorbent or reflective of the electromagnetic radiation.

Abstract: An optoelectronic device, in particular an at least partially transparent pane for example of a vehicle, comprises a first layer, in particular an intermediate layer arranged between a cover layer and a carrier layer, at least one electronic or optoelectronic component, which is at least partially or completely embedded in the first layer and at least one structured conductor layer. A first portion of the conductor layer is arranged on an upper surface of the first layer and a second portion of the conductor layer is arranged on a top surface of the electronic or optoelectronic component and is in contact with an electric contact of the electronic or optoelectronic component. The electric contact, in particular a contact pad, is arranged on the top surface.

Abstract: A display device with a connection carrier and a plurality of pixels, which are drivable via row lines and column lines, is specified. The row lines and the column lines are arranged on the connection carrier. At least one row line is interrupted at an imaginary crossing point with a column line on the connection carrier. A bridging component is arranged on the connection carrier, which bridges the row line at the imaginary crossing point in an electrically conductive manner.

Abstract: In an embodiment an arrangement includes a plurality of optoelectronic semiconductor components arranged in a common plane, wherein each semiconductor component is laterally delimited by side faces, and wherein each semiconductor component includes a semiconductor body having an active region configured to emit electromagnetic radiation, a radiation outlet side configured to couple out the electromagnetic radiation, a rear face opposite to the radiation outlet side, and a contact structure arranged on the rear face, an output element, an electrically insulating insulation layer and an electrical connection structure, wherein the insulation layer is arranged between side faces of adjacent semiconductor components, wherein the output element is arranged at the radiation outlet sides of the semiconductor components, wherein the electrical connection structure is electrically conductively connected with the contact structure, and wherein the connection structure includes an adhesive layer, a growth layer and a co

Abstract: The invention relates to various aspects of a ?-LED or a ?-LED array for augmented reality or lighting applications, in particular in the automotive field. The ?-LED is characterized by particularly small dimensions in the range of a few ?m.

Abstract: In an embodiment a method includes providing a first carrier on which an electrical connection material or a flux material is arranged, providing a second carrier on which at least one optoelectronic component is arranged, positioning the first carrier relative to the second carrier such that the electrical connection material or the flux material is facing at least one electrical connection surface and is spaced from the at least one electrical connection surface, pulse irradiating the first carrier with laser light such that at least areas of the electrical connection material or the flux material are detached from the first carrier and fall onto the at least one electrical connection surface of the optoelectronic component, wherein the electrical connection material or the flux material is arranged in a structured manner on the first carrier, and wherein the first carrier is irradiated over a large area with the laser light in order to detach at least regions of the structured electrical connection materia

Abstract: It is provided a window of a vehicle, optoelectronic circuits, in particular optoelectronic circuits for a window of a vehicle and a method for manufacturing a window of a vehicle including at least one optoelectronic component. It is further provided a display comprising at least one display module each comprising at least one optoelectronic array with a plurality of optoelectronic components, each optoelectronic component forming a pixel comprising at least one subpixel, in particular a ?LED. In addition, a method for manufacturing a display module comprising at least one optoelectronic array with a plurality of optoelectronic components, each optoelectronic component forming a pixel comprising at least one subpixel, in particular a ?LED, is provided.

Abstract: A vehicle pane includes a light emitting arrangement including a plurality of optoelectronic components on a flexible foil. The vehicle pane also includes a structure including a first pane, a second pane arranged thereon, and at least one at least partially transparent connecting layer connecting the first pane and the second pane. The structure includes an at least partially transparent inner region and an edge region surrounding the inner region. The light emitting arrangement is arranged laterally in the edge region of the structure and the edge region with the light emitting arrangement is configured to direct light generated by the optoelectronic components along the at least partially transparent connecting layer into the at least partially transparent inner region.