Patents by Inventor Sebastian Wittmann

Sebastian Wittmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200266370
    Abstract: In various aspects, an optoelectronic device is provided. The device may include a first substrate having a first non-planar shape, wherein the first substrate comprises a first shape memory material, a second substrate having a second non-planar shape, wherein the second substrate comprises a second shape memory material, and at least one optoelectronic component, arranged between the first substrate and the second substrate, wherein the first substrate is arranged in a coplanar or substantially coplanar manner with respect to the second substrate.
    Type: Application
    Filed: May 7, 2020
    Publication date: August 20, 2020
    Inventors: Sebastian Wittmann, Arne Fleissner, Erwin Lang, Nina Riegel
  • Publication number: 20200227683
    Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a first electrode layer, an organic light-emitting layer stack abutting the first electrode layer, a second electrode layer abutting the light-emitting layer stack and a multilayer encapsulation abutting the second electrode layer, wherein the multilayer encapsulation comprises a barrier layer and a planarization layer, wherein the planarization layer abuts the second electrode layer, and wherein the planarization layer is arranged between the second electrode layer and the barrier layer.
    Type: Application
    Filed: March 25, 2020
    Publication date: July 16, 2020
    Inventors: Sebastian Wittmann, Arne Fleissner, Erwin Lang
  • Publication number: 20200212343
    Abstract: A component module includes a component holder having a curved upper side, and a radiation-emitting component arranged in a curved shape on the upper side, wherein the component holder includes a heat-distributing region on the upper side, a neutral fiber running inside the component, an adhesive is planar and arranged between the radiation-emitting component and the upper side, and the adhesive fixes the radiation-emitting component on the upper side.
    Type: Application
    Filed: March 10, 2020
    Publication date: July 2, 2020
    Inventors: Erwin Lang, Thomas Wehlus, Arne Fleißner, Sebastian Wittmann
  • Patent number: 10693088
    Abstract: In various embodiments, a method for producing an optoelectronic device is provided. The method may include in the following order: providing a substrate, having a first state having a non-planar shape, reshaping the substrate into a second state. The second state has a planar or substantially planar shape. The method may further include forming at least one optoelectronic component on the substrate and reshaping the substrate into a third state. The third state is identical or substantially identical to the first state.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: June 23, 2020
    Assignee: OSRAM OLED GMBH
    Inventors: Sebastian Wittmann, Arne Fleissner, Erwin Lang, Nina Riegel
  • Patent number: 10644262
    Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment the multilayer encapsulation includes a layer sequence having at least one barrier layer and at least one planarization layer. The barrier layer and the planarization layer together have a lower water permeability than the barrier layer.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: May 5, 2020
    Assignee: OSRAM OLED GmbH
    Inventors: Sebastian Wittmann, Arne Fleißner, Erwin Lang
  • Patent number: 10637005
    Abstract: A method of producing a component module includes providing a component holder having a curved upper side and a radiation-emitting bendable component, and bending and fastening the component to the upper side so that the component has a curved shape.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: April 28, 2020
    Assignee: OSRAM OLED GmbH
    Inventors: Erwin Lang, Thomas Wehlus, Arne Fleißner, Sebastian Wittmann
  • Publication number: 20200066845
    Abstract: In accordance with an embodiment, a method for producing a graphene-based sensor includes providing a carrier substrate; forming a carrier structure on the carrier substrate, wherein one or more separating structures are formed on an upper side of the carrier structure; and performing a wet chemical transfer of a graphene layer onto the upper side of the carrier structure that comprises the separating structures, where the separating structures and a tear strength of the graphene layer are matched to one another such that the graphene layer respectively tears at the separating structures during the wet chemical transfer.
    Type: Application
    Filed: August 22, 2019
    Publication date: February 27, 2020
    Inventors: Christoph Glacer, Stephan Pindl, Werner Weber, Sebastian Wittmann
  • Publication number: 20190173044
    Abstract: A method of producing a component module includes providing a component holder having a curved upper side and a radiation-emitting bendable component, and bending and fastening the component to the upper side so that the component has a curved shape.
    Type: Application
    Filed: August 25, 2017
    Publication date: June 6, 2019
    Inventors: Erwin Lang, Thomas Wehlus, Arne Fleißner, Sebastian Wittmann
  • Patent number: 10312460
    Abstract: An optoelectronic device includes a flexible organic light-emitting diode having a main extension plane, a first retaining element having a first major surface formed in accordance with a bent surface, and a second retaining element, wherein the OLED is arranged between the first retaining element and the second retaining element, and the OLED is mechanically fixed by the first retaining element and/or the second retaining element such that the main extension plane of the OLED is formed in accordance with the bent surface.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: June 4, 2019
    Assignee: OSRAM OLED GmbH
    Inventors: Daniel Riedel, Nina Riegel, Thomas Wehlus, Arne Fleißner, Armin Heinrichsdobler, Sebastian Wittmann
  • Patent number: 10263214
    Abstract: In various embodiments, an optoelectronic component is provided. The optoelectronic component includes an optically active layer structure on a surface of a planar substrate. The surface in a predefined region is free of optically active layer structure. The optoelectronic component further includes an encapsulation structure having an inorganic encapsulation layer. The inorganic encapsulation layer is formed on or above the optically active layer structure and the surface of the substrate in the predefined region. The inorganic encapsulation layer at least in the predefined region is formed in direct contact with the surface of the substrate. The surface of the substrate at least in the predefined region includes a structuring. The structuring is configured to increase the roughness of the surface. The substrate at least in the predefined region at the surface thereof includes or is formed from an inorganic material.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: April 16, 2019
    Assignee: OSRAM OLED GMBH
    Inventors: Nina Riegel, Sebastian Wittmann, Erwin Lang, Arne Fleissner
  • Publication number: 20190081278
    Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment the multilayer encapsulation includes a layer sequence having at least one barrier layer and at least one planarization layer. The barrier layer and the planarization layer together have a lower water permeability than the barrier layer.
    Type: Application
    Filed: March 29, 2017
    Publication date: March 14, 2019
    Inventors: Sebastian Wittmann, Arne Fleißner, Erwin Lang
  • Publication number: 20180151833
    Abstract: In various embodiments, an optoelectronic component is provided. The optoelectronic component includes an optically active layer structure on a surface of a planar substrate. The surface in a predefined region is free of optically active layer structure. The optoelectronic component further includes an encapsulation structure having an inorganic encapsulation layer. The inorganic encapsulation layer is formed on or above the optically active layer structure and the surface of the substrate in the predefined region. The inorganic encapsulation layer at least in the predefined region is formed in direct contact with the surface of the substrate. The surface of the substrate at least in the predefined region includes a structuring. The structuring is configured to increase the roughness of the surface. The substrate at least in the predefined region at the surface thereof includes or is formed from an inorganic material.
    Type: Application
    Filed: November 28, 2017
    Publication date: May 31, 2018
    Inventors: Nina Riegel, Sebastian Wittmann, Erwin Lang, Arne Fleissner
  • Publication number: 20180106436
    Abstract: In various embodiments, a method for producing an optoelectronic device is provided. The method may include in the following order: providing a substrate, having a first state having a non-planar shape, reshaping the substrate into a second state. The second state has a planar or substantially planar shape. The method may further include forming at least one optoelectronic component on the substrate and reshaping the substrate into a third state. The third state is identical or substantially identical to the first state.
    Type: Application
    Filed: October 18, 2017
    Publication date: April 19, 2018
    Inventors: Sebastian Wittmann, Arne Fleissner, Erwin Lang, Nina Riegel
  • Patent number: 9911934
    Abstract: An OLED and a method for producing an OLED are disclosed. In an embodiment, the OLED includes a substrate and an organic layer stack with at least one active light-generating layer, which is suitable for generating electromagnetic radiation, wherein the organic layer stack is arranged between a first electrode and a second electrode. The OLED further includes a buffer layer arranged between the substrate and the first electrode, wherein the buffer layer includes an organic material, wherein a polymeric planarization layer is in direct contact with the substrate, wherein the buffer layer is in direct contact with the polymeric planarization layer, and wherein the first electrode is in direct contact with the buffer layer.
    Type: Grant
    Filed: February 1, 2017
    Date of Patent: March 6, 2018
    Assignee: OSRAM OLED GmbH
    Inventors: Sebastian Wittmann, Arne Fleissner, Erwin Lang
  • Publication number: 20180006249
    Abstract: An optoelectronic device includes a flexible organic light-emitting diode having a main extension plane, a first retaining element having a first major surface formed in accordance with a bent surface, and a second retaining element, wherein the OLED is arranged between the first retaining element and the second retaining element, and the OLED is mechanically fixed by the first retaining element and/or the second retaining element such that the main extension plane of the OLED is formed in accordance with the bent surface.
    Type: Application
    Filed: June 9, 2017
    Publication date: January 4, 2018
    Inventors: Daniel Riedel, Nina Riegel, Thomas Wehlus, Arne Fleissner, Armin Heinrichsdobler, Sebastian Wittmann
  • Publication number: 20170244053
    Abstract: An OLED and a method for producing an OLED are disclosed. In an embodiment, the OLED includes a substrate and an organic layer stack with at least one active light-generating layer, which is suitable for generating electromagnetic radiation, wherein the organic layer stack is arranged between a first electrode and a second electrode. The OLED further includes a buffer layer arranged between the substrate and the first electrode, wherein the buffer layer includes an organic material, wherein a polymeric planarization layer is in direct contact with the substrate, wherein the buffer layer is in direct contact with the polymeric planarization layer, and wherein the first electrode is in direct contact with the buffer layer.
    Type: Application
    Filed: February 1, 2017
    Publication date: August 24, 2017
    Inventors: Sebastian Wittmann, Arne Fleissner, Erwin Lang