Patents by Inventor Sebastian Wittmann

Sebastian Wittmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • µ-LED, µ-LED DEVICE, DISPLAY AND METHOD FOR THE SAME
    Publication number: 20220123046
    Abstract: The invention relates to various aspects of a ?-LED or a ?-LED array for augmented reality or lighting applications, in particular in the automotive field. The ?-LED is characterized by particularly small dimensions in the range of a few ?m.
    Type: Application
    Filed: October 29, 2021
    Publication date: April 21, 2022
    Inventors: Martin BEHRINGER, Andreas BIEBERSDORF, Ruth BOSS, Erwin LANG, Tobias MEYER, Alexander PFEUFFER, Marc PHILIPPENS, Julia STOLZ, Tansen VARGHESE, Sebastian WITTMANN, Siegfried HERRMANN, Berthold HAHN, Bruno JENTZSCH, Korbinian PERZLMAIER, Peter STAUSS, Petrus SUNDGREN, Jens MUELLER, Kerstin NEVELING, Frank SINGER, Christian MUELLER
  • µ-LED, µ-LED DEVICE, DISPLAY AND METHOD FOR THE SAME
    Publication number: 20220102583
    Abstract: The invention relates to various aspects of a ?-LED or a ?-LED array for augmented reality or lighting applications, in particular in the automotive field. The ?-LED is characterized by particularly small dimensions in the range of a few ?m.
    Type: Application
    Filed: January 29, 2020
    Publication date: March 31, 2022
    Inventors: Thorsten BAUMHEINRICH, Martin BEHRINGER, Andreas BIEBERSDORF, Ruth BOSS, Michael BRANDL, Peter BRICK, Jean-Jacques DROLET, Hubert HALBRITTER, Laura KREINER, Erwin LANG, Andreas LEBER, Tobias MEYER, Alexander PFEUFFER, Marc PHILIPPENS, Jens RICHTER, Thomas SCHWARZ, Paul TA, Tansen VARGHESE, Xue WANG, Sebastian WITTMANN, Julia STOLZ, Karsten DIEKMANN, Karl ENGL, Siegfried HERRMANN, Berthold HAHN, Stefan ILLEK, Bruno JENTZSCH, Korbinian PERZLMAIER, Ines PIETZONKA, Andreas RAUSCH, Kilian REGAU, Tilman RUEGHEIMER, Simon SCHWALENBERG, Christopher SOELL, Peter STAUSS, Petrus SUNDGREN, Hoa VU, Christopher WIESMANN, Georg BOGNER, Patrick HOERNER, Christoph KLEMP, Jens MUELLER, Kerstin NEVELING, Jong PARK, Christine RAFAEL, Frank SINGER, Kanishk CHAND, Felix FEIX, Christian MUELLER, Eva-Maria RUMMEL, Nicole HEITZER, Marie ASSMANN, Christian BERGER, Ana KANEVCE
  • METHOD OF PRODUCING A PLURALITY OF RADIATION-EMITTING COMPONENTS, RADIATION-EMITTING COMPONENT, METHOD OF PRODUCING A CONNECTION CARRIER, AND CONNECTION CARRIER
    Publication number: 20220013699
    Abstract: A method of producing a plurality of radiation-emitting components includes providing a composite with a plurality of connection carriers, wherein each connection carrier includes a light-transmissive matrix in which vias are arranged extending therethrough from a first main surface of the connection carrier to a second main surface of the connection carrier, and the connection carriers are spaced from each other by frames surrounding each connection carrier, arranging a radiation-emitting semiconductor chip on two vias, and separating the components by removing all or part of the frames.
    Type: Application
    Filed: November 11, 2019
    Publication date: January 13, 2022
    Inventors: Sebastian Wittmann, Korbinian Perzlmaler
  • MULTILAYER ENCAPSULATION, METHOD FOR ENCAPSULATING AND OPTOELECTRONIC COMPONENT
    Publication number: 20210359268
    Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a first electrode layer, an organic light-emitting layer stack abutting the first electrode layer, a second electrode layer abutting the light-emitting layer stack and a multilayer encapsulation abutting the second electrode layer, wherein the multilayer encapsulation comprises a barrier layer and a planarization layer, wherein the planarization layer abuts the second electrode layer, and wherein the planarization layer is arranged between the second electrode layer and the barrier layer.
    Type: Application
    Filed: June 1, 2021
    Publication date: November 18, 2021
    Applicant: OSRAM OLED GmbH
    Inventors: Sebastian Wittmann, Arne Fleissner, Erwin Lang
  • Method for producing a graphene-based sensor
    Patent number: 11081551
    Abstract: In accordance with an embodiment, a method for producing a graphene-based sensor includes providing a carrier substrate; forming a carrier structure on the carrier substrate, wherein one or more separating structures are formed on an upper side of the carrier structure; and performing a wet chemical transfer of a graphene layer onto the upper side of the carrier structure that comprises the separating structures, where the separating structures and a tear strength of the graphene layer are matched to one another such that the graphene layer respectively tears at the separating structures during the wet chemical transfer.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: August 3, 2021
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Christoph Glacer, Stephan Pindl, Werner Weber, Sebastian Wittmann
  • Multilayer encapsulation, method for encapsulating and optoelectronic component
    Patent number: 11043654
    Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a first electrode layer, an organic light-emitting layer stack abutting the first electrode layer, a second electrode layer abutting the light-emitting layer stack and a multilayer encapsulation abutting the second electrode layer, wherein the multilayer encapsulation comprises a barrier layer and a planarization layer, wherein the planarization layer abuts the second electrode layer, and wherein the planarization layer is arranged between the second electrode layer and the barrier layer.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: June 22, 2021
    Assignee: OSRAM OLED Gmbh
    Inventors: Sebastian Wittmann, Arne Fleissner, Erwin Lang
  • COMPONENT MODULE HAVING A RADIATION-EMITTING CURVED COMPONENT
    Publication number: 20210151708
    Abstract: A component module is disclosed that includes a component holder having a curved upper side, and a radiation-emitting component arranged in a curved shape on the upper side. In some implementations, the radiation emitting component includes a substrate. In some implementations, a neutral fiber runs outside the substrate.
    Type: Application
    Filed: January 27, 2021
    Publication date: May 20, 2021
    Applicant: OSRAM OLED GmbH
    Inventors: Erwin Lang, Thomas Wehlus, Arne Fleißner, Sebastian Wittmann
  • µ-LED, µ-LED DEVICE, DISPLAY AND METHOD FOR THE SAME
    Publication number: 20210104574
    Abstract: The invention relates to various aspects of a ?-LED or a ?-LED array for augmented reality or lighting applications, in particular in the automotive field. The ?-LED is characterized by particularly small dimensions in the range of a few ?m.
    Type: Application
    Filed: September 30, 2020
    Publication date: April 8, 2021
    Inventors: Martin BEHRINGER, Andreas BIEBERSDORF, Ruth BOSS, Erwin LANG, Tobias MEYER, Alexander PFEUFFER, Marc PHILIPPENS, Julia STOLZ, Tansen VARGHESE, Sebastian WITTMANN, Siegfried HERRMANN, Berthold HAHN, Bruno JENTZSCH, Korbinian PERZLMAIER, Peter STAUSS, Petrus SUNDGREN, Jens MUELLER, Kerstin NEVELING, Frank SINGER, Christian MUELLER
  • Component module having a radiation-emitting curved component
    Patent number: 10944081
    Abstract: A component module includes a component holder having a curved upper side, and a radiation-emitting component arranged in a curved shape on the upper side, wherein the component holder includes a heat-distributing region on the upper side, a neutral fiber running inside the component, an adhesive is planar and arranged between the radiation-emitting component and the upper side, and the adhesive fixes the radiation-emitting component on the upper side.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: March 9, 2021
    Assignee: OSRAM OLED GmbH
    Inventors: Erwin Lang, Thomas Wehlus, Arne Fleißner, Sebastian Wittmann
  • METHOD FOR PRODUCING AN OPTOELECTRONIC DEVICE, AND AN OPTOELECTRONIC DEVICE PRODUCED BY THE METHOD
    Publication number: 20200266370
    Abstract: In various aspects, an optoelectronic device is provided. The device may include a first substrate having a first non-planar shape, wherein the first substrate comprises a first shape memory material, a second substrate having a second non-planar shape, wherein the second substrate comprises a second shape memory material, and at least one optoelectronic component, arranged between the first substrate and the second substrate, wherein the first substrate is arranged in a coplanar or substantially coplanar manner with respect to the second substrate.
    Type: Application
    Filed: May 7, 2020
    Publication date: August 20, 2020
    Inventors: Sebastian Wittmann, Arne Fleissner, Erwin Lang, Nina Riegel
  • Multilayer Encapsulation, Method for Encapsulating and Optoelectronic Component
    Publication number: 20200227683
    Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a first electrode layer, an organic light-emitting layer stack abutting the first electrode layer, a second electrode layer abutting the light-emitting layer stack and a multilayer encapsulation abutting the second electrode layer, wherein the multilayer encapsulation comprises a barrier layer and a planarization layer, wherein the planarization layer abuts the second electrode layer, and wherein the planarization layer is arranged between the second electrode layer and the barrier layer.
    Type: Application
    Filed: March 25, 2020
    Publication date: July 16, 2020
    Inventors: Sebastian Wittmann, Arne Fleissner, Erwin Lang
  • COMPONENT MODULE HAVING A RADIATION-EMITTING CURVED COMPONENT
    Publication number: 20200212343
    Abstract: A component module includes a component holder having a curved upper side, and a radiation-emitting component arranged in a curved shape on the upper side, wherein the component holder includes a heat-distributing region on the upper side, a neutral fiber running inside the component, an adhesive is planar and arranged between the radiation-emitting component and the upper side, and the adhesive fixes the radiation-emitting component on the upper side.
    Type: Application
    Filed: March 10, 2020
    Publication date: July 2, 2020
    Inventors: Erwin Lang, Thomas Wehlus, Arne Fleißner, Sebastian Wittmann
  • Method for producing an optoelectronic device, and an optoelectronic device produced by the method
    Patent number: 10693088
    Abstract: In various embodiments, a method for producing an optoelectronic device is provided. The method may include in the following order: providing a substrate, having a first state having a non-planar shape, reshaping the substrate into a second state. The second state has a planar or substantially planar shape. The method may further include forming at least one optoelectronic component on the substrate and reshaping the substrate into a third state. The third state is identical or substantially identical to the first state.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: June 23, 2020
    Assignee: OSRAM OLED GMBH
    Inventors: Sebastian Wittmann, Arne Fleissner, Erwin Lang, Nina Riegel
  • Multilayer encapsulation, method for encapsulating and optoelectronic component
    Patent number: 10644262
    Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment the multilayer encapsulation includes a layer sequence having at least one barrier layer and at least one planarization layer. The barrier layer and the planarization layer together have a lower water permeability than the barrier layer.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: May 5, 2020
    Assignee: OSRAM OLED GmbH
    Inventors: Sebastian Wittmann, Arne Fleißner, Erwin Lang
  • Method of producing a component module and component module
    Patent number: 10637005
    Abstract: A method of producing a component module includes providing a component holder having a curved upper side and a radiation-emitting bendable component, and bending and fastening the component to the upper side so that the component has a curved shape.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: April 28, 2020
    Assignee: OSRAM OLED GmbH
    Inventors: Erwin Lang, Thomas Wehlus, Arne Fleißner, Sebastian Wittmann
  • Method for Producing a Graphene-Based Sensor
    Publication number: 20200066845
    Abstract: In accordance with an embodiment, a method for producing a graphene-based sensor includes providing a carrier substrate; forming a carrier structure on the carrier substrate, wherein one or more separating structures are formed on an upper side of the carrier structure; and performing a wet chemical transfer of a graphene layer onto the upper side of the carrier structure that comprises the separating structures, where the separating structures and a tear strength of the graphene layer are matched to one another such that the graphene layer respectively tears at the separating structures during the wet chemical transfer.
    Type: Application
    Filed: August 22, 2019
    Publication date: February 27, 2020
    Inventors: Christoph Glacer, Stephan Pindl, Werner Weber, Sebastian Wittmann
  • METHOD OF PRODUCING A COMPONENT MODULE AND COMPONENT MODULE
    Publication number: 20190173044
    Abstract: A method of producing a component module includes providing a component holder having a curved upper side and a radiation-emitting bendable component, and bending and fastening the component to the upper side so that the component has a curved shape.
    Type: Application
    Filed: August 25, 2017
    Publication date: June 6, 2019
    Inventors: Erwin Lang, Thomas Wehlus, Arne Fleißner, Sebastian Wittmann
  • Optoelectronic device, arrangement having an optoelectronic device and method of producing an optoelectronic device as well as lamp for a motor vehicle
    Patent number: 10312460
    Abstract: An optoelectronic device includes a flexible organic light-emitting diode having a main extension plane, a first retaining element having a first major surface formed in accordance with a bent surface, and a second retaining element, wherein the OLED is arranged between the first retaining element and the second retaining element, and the OLED is mechanically fixed by the first retaining element and/or the second retaining element such that the main extension plane of the OLED is formed in accordance with the bent surface.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: June 4, 2019
    Assignee: OSRAM OLED GmbH
    Inventors: Daniel Riedel, Nina Riegel, Thomas Wehlus, Arne Fleißner, Armin Heinrichsdobler, Sebastian Wittmann
  • Optoelectronic component and method for producing an optoelectronic component
    Patent number: 10263214
    Abstract: In various embodiments, an optoelectronic component is provided. The optoelectronic component includes an optically active layer structure on a surface of a planar substrate. The surface in a predefined region is free of optically active layer structure. The optoelectronic component further includes an encapsulation structure having an inorganic encapsulation layer. The inorganic encapsulation layer is formed on or above the optically active layer structure and the surface of the substrate in the predefined region. The inorganic encapsulation layer at least in the predefined region is formed in direct contact with the surface of the substrate. The surface of the substrate at least in the predefined region includes a structuring. The structuring is configured to increase the roughness of the surface. The substrate at least in the predefined region at the surface thereof includes or is formed from an inorganic material.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: April 16, 2019
    Assignee: OSRAM OLED GMBH
    Inventors: Nina Riegel, Sebastian Wittmann, Erwin Lang, Arne Fleissner
  • Multilayer Encapsulation, Method for Encapsulating and Optoelectronic Component
    Publication number: 20190081278
    Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment the multilayer encapsulation includes a layer sequence having at least one barrier layer and at least one planarization layer. The barrier layer and the planarization layer together have a lower water permeability than the barrier layer.
    Type: Application
    Filed: March 29, 2017
    Publication date: March 14, 2019
    Inventors: Sebastian Wittmann, Arne Fleißner, Erwin Lang