Abstract: A method for making an optical device with integrated optoelectronic components, including a) making a protective structure including a support in which at least one blind hole is made, an optical element being positioned in the blind hole, b) attaching the support to a substrate including the integrated optoelectronic components, the blind hole forming a cavity in which the optical element faces one of the optoelectronic components, c) achieving thinning of the substrate and making electric connections through the substrate, and d) making an aperture through the bottom wall of the blind hole, uncovering at least one portion of the optical field of the optical element.

Abstract: An optical device including: at least one deformable membrane; a first support; and actuating unit for loading the membrane to deform it, the membrane being provided with a anchoring zone for anchoring to the support which surrounds a part of the membrane including a substantially central zone that is reversibly deformable, the support and the membrane contributing to imprison a constant volume of a first fluid in contact with a face of part of the membrane, wherein the actuating unit includes control-activated main actuating unit for loading the membrane in a peripheral zone and control-activated supplementary actuating unit anchored at least to the membrane for loading the membrane in the central zone.

Abstract: A method for making a micro-device including at least one receiving site for components, formed in a thickness of a substrate. The method includes: a) making in at least one first substrate adhesively bonded to a second substrate via a discontinuous adhesive bonding interface, at least one first trench around at least one sacrificial block of the first substrate, by etching the first substrate so as to expose the adhesive bonding interface; and b) removing the sacrificial block so as to make at least one first cavity in the first substrate.

Abstract: The invention relates to a method for producing a device with a membrane used to encapsulate a fluid contained in a cavity, in which: two substrates (110, 120) are provided; a membrane (111) is placed on one and/or on the other of the substrates; one or more walls (113) are formed, helping to laterally define the cavity (114), in which said walls are located on or in one of the substrates and/or on or in the other of the substrates, and said cavity is intended to contain the fluid, the two substrates (110, 120) are assembled together by superimposing one on the other so as to complete the cavity, in which the or each membrane (111) also helps to define the cavity, the fluid (117) is encapsulated in the cavity between the substrates, and the or each membrane is soaked by the fluid, at least a portion of one of the substrates and/or the other of the substrates is removed insofar as one and/or the other of the substrates are equipped with a membrane, in order to release the membrane at least in the central po

Abstract: An optical device with a deformable membrane including an anchoring area on a support helping to contain a constant volume of liquid in contact with one of its faces, a substantially central area, configured to be deformed reversibly from a rest position, and an actuation mechanism displacing the liquid in the central area, stressing the membrane in parts situated between the central area and the anchoring area. The actuation mechanism includes plural thermal or piezoelectric actuators of micro-beam type, distributed at the periphery of the membrane, the micro-beams including at least one fixed part joined to the support and at least one moving part coming into contact, on an actuation, with the membrane in an area situated between the central area and the anchoring area.

Abstract: A method for metalizing at least one blind via formed in at least one substrate, including at least the following steps: a) arranging at least one solid portion of electrically conductive material in the blind via, b) performing a thermal treatment of the solid portion of electrically conductive material, making it melt in the blind via, c) cooling the electrically conductive material, solidifying it in the blind via, and wherein, before carrying out step a), at least part of the walls of the blind via is covered with a material able to prevent wetting of said part of the walls of the blind via by the melted electrically conductive material obtained during the performance of step b), the solidified electrically conductive material obtained after carrying out step c) being able not to be secured to said non-wetting part of the walls of the blind via.

Abstract: An interconnect structure including: at least one first substrate, whereof at least one first face is made integral with at least one face of at least one second substrate, at least one blind via passing through the first substrate and emerging at the first face of the first substrate and at a second face, opposite the first face, of the first substrate, at least one electric contact arranged against said face of the second substrate and opposite the blind via, and/or against the first face and/or against the second face of the first substrate, at least one channel putting the blind via in communication with an environment outside the interconnect structure and/or with at least one cavity formed in the interconnect structure, and extending substantially parallel to one of said faces of the first or second substrate.

Abstract: The invention concerns an interconnect device comprising a support (200) in which at least one hole is formed, the hole having walls forming a closed contour and being formed by a cavity (203) and one or several slots (205a-205b, 215a-215b) communicating with the cavity, the slots extending in a direction making a non-zero angle with the main plane of the support, several conducting elements (214) being positioned on at least one wall of the hole and passing through the latter part, the conducting elements each being intended to connect conducting areas to each other that are situated on either side of the support, at least one of said slots separating two of said conducting elements from each other.

Abstract: A method for making an optical device with integrated optoelectronic components, including a) making a protective structure including a support in which at least one blind hole is made, an optical element being positioned in the blind hole, b) attaching the support to a substrate including the integrated optoelectronic components, the blind hole forming a cavity in which the optical element faces one of the optoelectronic components, c) achieving thinning of the substrate and making electric connections through the substrate, and d) making an aperture through the bottom wall of the blind hole, uncovering at least one portion of the optical field of the optical element.

Abstract: A method for preparing a cover on a substrate in particular for the encapsulation of electronic, optical, optoelectronic components, of the electromechanical microsystems type, also known as Micro-Electro-Mechanical Systems (MEMS) or optoelectromechanical microsystems, also known as Micro-Opto-Elect-Mechanical systems (MOEMS), joined to the substrate.

Abstract: An optical device having a deformable membrane comprising a flexible film having at least one peripheral anchoring zone, a central zone and an intermediate zone between the central zone and the anchoring zone. The membrane also includes one or more movable parts of electrostatic actuating means, each movable part being formed from a leg terminating on one side in a foot mechanically fastened to a film-fastening region located in the intermediate zone and terminating on the other side in a free end. The legs incorporate a movable electrode, the free end having to be attracted by a fixed electrode of the actuating means. The free end is placed facing the free end so as to deform at least the central zone of the membrane.

Abstract: An optical device with a deformable membrane including an anchoring area on a support helping to contain a constant volume of liquid in contact with one of its faces, a substantially central area, configured to be deformed reversibly from a rest position, and an actuation mechanism displacing the liquid in the central area stressing the membrane in at least one area situated strictly between the central area and the anchoring area. The actuation mechanism is electrostatic and includes at least one pair of opposing electrodes, one of the electrodes of the pair being at the level of the membrane, the other being at the level of the support, the electrodes being separated by dielectric, the dielectric being formed at least by the liquid.

Abstract: An optical device with a deformable membrane including an anchoring area on a support helping to contain a constant volume of liquid in contact with one of its faces, a substantially central area, configured to be deformed reversibly from a rest position, and an actuation mechanism displacing the liquid in the central area, stressing the membrane in parts situated between the central area and the anchoring area. The actuation mechanism includes plural thermal or piezoelectric actuators of micro-beam type, distributed at the periphery of the membrane, the micro-beams including at least one fixed part joined to the support and at least one moving part coming into contact, on an actuation, with the membrane in an area situated between the central area and the anchoring area.

Abstract: This relates to an optical device comprising at least one deformable membrane (2), a support (1.5), actuating means (50, 51) for loading the membrane (2) to deform it, the membrane (2) being provided with a zone (2.3) for anchoring to the support (1.5) and a substantially central zone (2.1) suitable for deforming reversibly surrounded by an anchoring zone (2.3), the support (1.5) and the membrane (2) contributing to imprison a constant volume located at least in the interior of the anchoring zone (2.3) of a fluid (4.1) called first fluid, in contact with one of the faces of the membrane (2). The actuating means (50, 51) of the membrane (2) comprise main actuating means (50) which load the membrane in a peripheral zone (2.2) lying between the central zone (2.1) and the anchoring zone (2.3) in order to move it in a direction and to move the first fluid (4.1) towards the central zone (2.1) and supplementary actuating means (51) anchored at least to the membrane which load the membrane (2) in the central zone (2.

Abstract: The present disclosure relates to a fingerprint sensor device. The device comprises a sensor having a sensitive active region that is electrically connected to a substrate. The device further includes a first resin bump positioned proximate to the sensitive active region. The first resin bump forms a finger guide that positions the finger over the sensitive active region when the finger slides in contact with the first resin bump.

Abstract: A method for preparing a cover on a substrate in particular for the encapsulation of electronic, optical, optoelectronic components, of the electromechanical microsystems type, also known as Micro-Electro-Mechanical Systems (MEMS) or optoelectromechanical microsystems, also known as Micro-Opto-Elect-Mechanical systems (MOEMS), joined to the substrate.

Abstract: An embodiment of the present invention related to fingerprint sensors is described. The sensor comprises an integrated-circuit chip having a sensitive surface, a substrate provided with electrical connections and wire-bonding wires connecting the chip to the electrical connections. The sensor further includes a molded protective resin at least partly covering the substrate and the chip and completely encapsulating the wire-bonding wires. The resin forms, on at least one side of the chip and at most three sides, a bump rising to at least 500 microns above the sensitive surface, this bump encapsulating the wire-bonding wires and constituting a guide for a finger, the fingerprint of which it is desired to detect.

Abstract: An embodiment of the present invention related to fingerprint sensors is described. The sensor comprises an integrated-circuit chip having a sensitive surface, a substrate provided with electrical connections and wire-bonding wires connecting the chip to the electrical connections. The sensor further includes a molded protective resin at least partly covering the substrate and the chip and completely encapsulating the wire-bonding wires. The resin forms, on at least one side of the chip and at most three sides, a bump rising to at least 500 microns above the sensitive surface, this bump encapsulating the wire-bonding wires and constituting a guide for a finger, the fingerprint of which it is desired to detect.