Abstract: The invention relates to an electrically insulating composite material (1) comprising a polyepoxide matrix (2) of cycloaliphatic type or of diglycidyl ether type in a content of less than 40% by mass, from 20 to 75% by mass of one or several micrometric and/or mesometric filler(s) (3), and from 0.1 to 20% by mass of at least one ionic liquid (4), the masses being expressed relative to the total mass of the electrically insulating composite material (1). The invention also relates to a method for manufacturing such an electrically insulating composite material (1), as well as its use for an electrically insulating support (9) in a metal-enclosed substation (5).

Abstract: An attenuator having an impedance that is controllable by a first setpoint signal is coupled to a transmission line. A matching circuit having an impedance that is controllable by a second setpoint signal is also coupled to the transmission line. A transformer circuit block also coupled to the transmission line has a complex impedance. A control circuit sets the first and second setpoint signals so as to control a conjugate impedance relationship between the variable impedances presented by the attenuator and matching circuit relative to the complex impedance of the transformer circuit.

Abstract: An attenuator having an impedance that is controllable by a first setpoint signal is coupled to a transmission line. A matching circuit having an impedance that is controllable by a second setpoint signal is also coupled to the transmission line. A transformer circuit block also coupled to the transmission line has a complex impedance. A control circuit sets the first and second setpoint signals so as to control a conjugate impedance relationship between the variable impedances presented by the attenuator and matching circuit relative to the complex impedance of the transformer circuit.

Abstract: An attenuator having an impedance that is controllable by a first setpoint signal is coupled to a transmission line. A matching circuit having an impedance that is controllable by a second setpoint signal is also coupled to the transmission line. A transformer circuit block also coupled to the transmission line has a complex impedance. A control circuit sets the first and second setpoint signals so as to control a conjugate impedance relationship between the variable impedances presented by the attenuator and matching circuit relative to the complex impedance of the transformer circuit.

Abstract: A millimeter wave transceiver including a plate forming an interposer having its upper surface supporting an interconnection network and having its lower surface intended to be assembled on a printed circuit board by bumps; an integrated circuit chip assembled on the upper surface of the interposer; antennas made of tracks formed on the upper surface of the interposer; and reflectors on the upper surface of the printed circuit board in front of each of the antennas, the effective distance between each antenna and the reflector plate being on the order of one quarter of the wavelength, taking into account the dielectric constants of the interposed materials.

Abstract: An attenuator having an impedance that is controllable by a first setpoint signal is coupled to a transmission line. A matching circuit having an impedance that is controllable by a second setpoint signal is also coupled to the transmission line. A transformer circuit block also coupled to the transmission line has a complex impedance. A control circuit sets the first and second setpoint signals so as to control a conjugate impedance relationship between the variable impedances presented by the attenuator and matching circuit relative to the complex impedance of the transformer circuit.

Abstract: A wireless data transmitter including: a data modulator adapted to modulate a data signal based on a frequency signal; and at least one antenna adapted to wirelessly transmit the modulated data signal and the frequency signal independently.

Abstract: A coplanar waveguide electronic device is formed on a substrate. The waveguide includes a signal ribbon and a ground plane. The signal ribbon is formed of two or more signal lines of a same level of metallization that are electrically connected together. The ground plane is formed of an electrically conducting material which includes rows of holes.

Abstract: A millimeter wave transceiver including a plate forming an interposer having its upper surface supporting an interconnection network and having its lower surface intended to be assembled on a printed circuit board by bumps; an integrated circuit chip assembled on the upper surface of the interposer; antennas made of tracks formed on the upper surface of the interposer; and reflectors on the upper surface of the printed circuit board in front of each of the antennas, the effective distance between each antenna and the reflector plate being on the order of one quarter of the wavelength, taking into account the dielectric constants of the interposed materials.

Abstract: A millimeter wave transceiver including a plate forming an interposer having its upper surface supporting an interconnection network and having its lower surface intended to be assembled on a printed circuit board by bumps; an integrated circuit chip assembled on the upper surface of the interposer; antennas made of tracks formed on the upper surface of the interposer; and reflectors on the upper surface of the printed circuit board in front of each of the antennas, the effective distance between each antenna and the reflector plate being on the order of one quarter of the wavelength, taking into account the dielectric constants of the interposed materials.

Abstract: A coplanar waveguide electronic device is formed on a substrate. The waveguide includes a signal ribbon and a ground plane. The signal ribbon is formed of two or more signal lines of a same level of metallization that are electrically connected together. The ground plane is formed of an electrically conducting material which includes rows of holes.

Abstract: An embodiment relates to a coplanar waveguide electronic device comprising a substrate whereon is mounted a signal ribbon and at least a ground plane. The signal ribbon comprises a plurality of signal lines of a same level of metallization electrically connected together, and the ground plane is made of an electrically conducting material and comprises a plurality of holes.

Abstract: An embodiment relates to a coplanar waveguide electronic device comprising a substrate whereon is mounted a signal ribbon and at least a ground plane. The signal ribbon comprises a plurality of signal lines of a same level of metallization electrically coupled together, and the ground plane is made of an electrically conducting material and comprises a plurality of holes.

Abstract: A wireless data transmitter including: a data modulator adapted to modulate a data signal based on a frequency signal; and at least one antenna adapted to wirelessly transmit the modulated data signal and the frequency signal independently.

Abstract: Phase shifting circuitry is provided for phase shifting at least one of first and second quadrature components of a data signal. The circuitry includes a first phase shifter adapted to phase shift, by a first phase angle, the first quadrature component by adding together weighted versions of the first and second quadrature components.

Abstract: A millimeter wave transceiver including a plate forming an interposer having its upper surface supporting an interconnection network and having its lower surface intended to be assembled on a printed circuit board by bumps; an integrated circuit chip assembled on the upper surface of the interposer; antennas made of tracks formed on the upper surface of the interposer; and reflectors on the upper surface of the printed circuit board in front of each of the antennas, the effective distance between each antenna and the reflector plate being on the order of one quarter of the wavelength, taking into account the dielectric constants of the interposed materials.

Abstract: Device comprising a first input configured to receive a first input signal of given wavelength, several distinct pairs of outputs, the two outputs of each pair of outputs being configured to deliver a differential output signal, and an electrically conducting transmission means forming a closed circuit and coupled between the first input and the outputs, at least one length of the portion of the transmission means, coupled between two outputs of a pair of outputs, being substantially equal to an even multiple of a quarter of the said wavelength, the lengths of those portions of the transmission means which couple two homologous outputs of two pairs of outputs being substantially equal, and at least one length of the portion of the transmission means, coupled between the first input and the output closest to the said first input, being substantially equal to a quarter of the said wavelength.

Abstract: External electrical connection pads are provided on a semiconductor device. A well is formed in an outer surface for the semiconductor device to at least partially expose an internal electrical connection pad. An electrical connection tab is formed which has an internal branch extending over the internal pad, an external branch extending over a top of the outer surface and extending from one side edge of the well, and a linking branch extending over a sidewall of the wells between the external branch and the internal branch.

Abstract: An embodiment relates to a coplanar waveguide electronic device comprising a substrate whereon is mounted a signal ribbon and at least a ground plane. The signal ribbon comprises a plurality of signal lines of a same level of metallization electrically connected together, and the ground plane is made of an electrically conducting material and comprises a plurality of holes.

Abstract: An electronic component for microwave transmission includes a high resistivity substrate on which is at least located several metallization layers divided into portions. A first set of piled up portions defines a ground ribbon and a second set of piled up portions defines a power ribbon. At least a first active portion of said ground ribbon and a first active portion of said power ribbon are respectively located between the substrate and an uppermost one of the several metallization layers. The electronic component in one implementation is a coplanar waveguide.