Abstract: An electrical bonding pad for an integrated circuit, comprising an encapsulation layer for receiving electrical signals and for covering a portion of a stack of conductive layers. The pad further comprises a conductive area in the stack, with the conductive area being at least partially covered by the encapsulation layer. The conductive area is intended for the passage of electrical signals received by the encapsulation layer and traveling towards a circuit core, and is electrically insulated from the encapsulation layer in a manner that at least partially decouples the electrical signals received from the encapsulation layer.

Abstract: An integrated circuit includes many metallization levels. A thick dielectric region is placed above at least two metallization levels and laterally neighboring two or more metallization levels. That part of the two metallization levels which lie beneath the dielectric region forms a screen. A conducting strip is placed on the dielectric region so that the dielectric region forms a waveguide.

Abstract: An electronic component for microwave transmission includes a high resistivity substrate on which is at least located several metallization layers divided into portions. A first set of piled up portions defines a ground ribbon and a second set of piled up portions defines a power ribbon. At least a first active portion of said ground ribbon and a first active portion of said power ribbon are respectively located between the substrate and an uppermost one of the several metallization layers. The electronic component in one implementation is a coplanar waveguide.

Abstract: The invention relates to integrated circuits for microwave applications in the millimeter wavelength range (frequencies of around 50 GHz). To improve the performance of the microwave transmission lines in the circuit, a structure of conducting vias between a transmission line and a conducting zone is proposed. The vias are formed in apertures in a benzocyclobutene layer. These apertures are larger at their base than the conducting zones. The transmission line descends into the aperture but does not come back up over the edges of the aperture. The parasitic capacitances with the substrate at the point of contact are minimized.

Abstract: An integrated circuit includes many metallization levels. A thick dielectric region is placed above at least two metallization levels and laterally neighboring two or more metallization levels. That part of the two metallization levels which lie beneath the dielectric region forms a screen. A conducting strip is placed on the dielectric region so that the dielectric region forms a waveguide.