Abstract: devices and methods of forming a semiconductor device that includes a deep shielding pattern that may improve a reliability and/or a functioning of the device. An example method may include forming a wide band-gap semiconductor layer structure on a substrate, the semiconductor layer structure including a drift region that has a first conductivity type; forming a plurality of gate trenches in an upper portion of the semiconductor layer structure, the gate trenches spaced apart from each other, each gate trench having a bottom surface, a first sidewall, a second sidewall, and an upper opening; forming an obstruction over a portion of each gate trench that partially obscures the upper opening; and implanting dopants having a second conductivity type that is opposite the first conductivity type into the bottom surfaces of the gate trenches, where the dopants implanted into the bottom surface of the gate trenches form deep shielding patterns.

Abstract: A power semiconductor device comprises a semiconductor layer structure comprising a drift region that comprises a wide band-gap semiconductor material that has a first conductivity type, a well region that has a second conductivity type, and a source region that has the first conductivity type in an upper portion of the well region and a gate trench in an upper portion of the semiconductor layer structure and comprising a portion obliquely angled in plan view. Sidewalls of the gate trench may extend along substantially the same crystal plane in the semiconductor layer structure.

Abstract: A semiconductor device includes a semiconductor layer having a first conductivity type, a well region in the semiconductor layer, the well region having a second conductivity type opposite the first conductivity type, a source region having the first conductivity type in the well region, and an implanted charge compensation region in the semiconductor layer beneath the well region. The source region is adjacent a channel region in the well region. A method of forming a semiconductor device includes forming a well region having a second conductivity type in a semiconductor layer having a first conductivity type opposite the second conductivity type, forming a source region having the first conductivity type in the well region, and implanting ions into the semiconductor layer to form a charge compensation region in the semiconductor layer beneath the well region. The source region is adjacent a channel region in the well region.

Abstract: Shielding techniques are used to provide an embedded sensor element such as a temperature sensing element on a wide bandgap power semiconductor device. A semiconductor device may include a drift layer and an embedded sensor element. The drift layer may be a wide bandgap semiconductor material. A shielding structure is provided in the drift layer below the embedded sensor element. The embedded sensor element may be provided between contacts that are in electrical contact with the shielding well. The distance between the contacts may be minimized. A noise reduction well may be provided between the contacts to further isolate the embedded sensor element from parasitic signals.

Abstract: Semiconductor devices and methods of forming a semiconductor device that includes a deep shielding pattern that may improve a reliability and/or a functioning of the device. An example method may include forming a wide band-gap semiconductor layer structure on a substrate, the semiconductor layer structure including a drift region that has a first conductivity type; forming a plurality of gate trenches in an upper portion of the semiconductor layer structure, the gate trenches spaced apart from each other, each gate trench having a bottom surface, a first sidewall, a second sidewall, and an upper opening; forming an obstruction over a portion of each gate trench that partially obscures the upper opening; and implanting dopants having a second conductivity type that is opposite the first conductivity type into the bottom surfaces of the gate trenches, where the dopants implanted into the bottom surface of the gate trenches form deep shielding patterns.

Abstract: A vertical semiconductor device includes one or more of a substrate, a buffer layer over the substrate, one or more drift layers over the buffer layer, and a spreading layer over the one or more drift layers.

Abstract: A power semiconductor device comprises a semiconductor layer structure comprising a drift region that comprises a wide band-gap semiconductor material that has a first conductivity type, a well region that has a second conductivity type, and a source region that has the first conductivity type in an upper portion of the well region and a gate trench in an upper portion of the semiconductor layer structure and comprising a portion obliquely angled in plan view. Sidewalls of the gate trench may extend along substantially the same crystal plane in the semiconductor layer structure.

Abstract: A power semiconductor device includes semiconductor layer structure comprising a semiconductor drift region of a first conductivity type and an edge termination region comprising a plurality of guard rings of a second conductivity type. The guard rings extend into a surface of the semiconductor drift region. The guard rings respectively comprise a first portion adjacent the surface and a second portion spaced from the surface, where the first portion is wider than the second portion. Related devices and fabrication methods are also discussed.

Abstract: Shielding techniques are used to provide an embedded sensor element such as a temperature sensing element on a wide bandgap power semiconductor device. A semiconductor device may include a drift layer and an embedded sensor element. The drift layer may be a wide bandgap semiconductor material. A shielding structure is provided in the drift layer below the embedded sensor element. The embedded sensor element may be provided between contacts that are in electrical contact with the shielding well. The distance between the contacts may be minimized. A noise reduction well may be provided between the contacts to further isolate the embedded sensor element from parasitic signals.

Abstract: A semiconductor device includes a vertical transistor and a body diode. Various improvements to the semiconductor device allow for improved performance of the body diode, in particular to reduced snappiness and increased softness.

Abstract: A method of forming a semiconductor device comprises forming a first mask that includes a longitudinally-extending first opening that has a first width on a semiconductor layer structure. A spacer is formed on sidewalls of the first mask that are exposed by the first opening to form a second mask, where the first and second masks comprise a mask structure that has a longitudinally-extending second opening that has a second width that is smaller than the first width. Dopants are implanted through the second opening to form an implanted region in the semiconductor layer structure. The spacer is at least partially removed from the sidewalls of the first mask to form a third opening in the mask structure. The semiconductor layer structure is then etched using the mask structure as an etch mask to form a gate trench in the semiconductor layer structure underneath the third opening.

Abstract: A semiconductor device includes a semiconductor layer structure having a drift region of a first conductivity type and a well region of a second conductivity type above the drift region. A gate is provided on the semiconductor layer structure adjacent the well region. A buried shielding structure of the second conductivity type is provided under the well region and separated from the well region by a portion of the drift region. Related devices and fabrication methods are also discussed.

Abstract: A semiconductor device includes a semiconductor layer structure comprising a drift region of a first conductivity type and a well region of a second conductivity type above the drift region, a gate on the semiconductor layer structure adjacent the well region, and a contact shielding structure of the second conductivity type that vertically extends from the well region into the drift region, and discontinuously extends in one or more lateral directions. Related devices and fabrication methods are also discussed.

Abstract: A power semiconductor device includes semiconductor layer structure comprising a semiconductor drift region of a first conductivity type and an edge termination region comprising a plurality of guard rings of a second conductivity type. The guard rings extend into a surface of the semiconductor drift region. The guard rings respectively comprise a first portion adjacent the surface and a second portion spaced from the surface, where the first portion is wider than the second portion. Related devices and fabrication methods are also discussed.

Abstract: A vertical semiconductor device includes a substrate, a drift region over the substrate, an upper region on the drift region, a top surface over the upper region and being substantially planar, and a series of implants of a second dopant in the upper region, such that each implant of the series of implants is located at a different depth below the top surface. The series of implants forms at least two gate region. The substrate and the drift region are doped with a first dopant of a first polarity. The second dopant has a second polarity opposite that of the first polarity. At least a portion of a channel region is provided between the at least two gate regions, and a conducting gap is defined within the channel region and between opposing sidewalls of the at least two gate regions.

Abstract: A semiconductor device includes a vertical transistor and a body diode. Various improvements to the semiconductor device allow for improved performance of the body diode, in particular to reduced snappiness and increased softness.

Abstract: A precursor for a vertical semiconductor device is provided with a substrate, a drift region over the substrate, and an upper precursor region over the drift region. The top surface of the precursor is substantially planar, and the substrate and the drift region are doped with a first dopant of a first polarity. In a first embodiment, a series of implants with a second dopant is provided in the upper precursor region via the top surface to form each of at least two gate regions such that each implant of the series of implants is provided at a different depth below the top surface. In a second embodiment, a series of implants with the first dopant is provided in the upper precursor region via the top surface to form a channel region that has at least a portion between two gate regions.

Abstract: A method of forming ohmic contacts on a semiconductor structure having a p-type region and an n-type region includes depositing a first metal on the n-type region, annealing the structure at a first contact anneal temperature to form a first ohmic contact on the n-type region, depositing a second metal on the first ohmic contact and on the p-type region, and annealing the structure at a second contact anneal temperature, less than the first contact anneal temperature, to form a second ohmic contact on the p-type region.

Abstract: A semiconductor device includes a semiconductor layer structure comprising a gate trench formed in an upper surface thereof, a gate finger in the gate trench, a supplemental dielectric layer on an upper surface of the gate finger and vertically overlaps the gate trench, and a gate connector on an upper surface of the supplemental dielectric layer and on an upper surface of the gate finger.

Abstract: A wide band-gap semiconductor layer structure is provided that comprises a drift region having a first conductivity type and a plurality of source regions having the first conductivity type on the drift region. A plurality of trenches are provided in an upper surface of the wide band-gap semiconductor layer structure. Second conductivity type dopants are implanted into the wide band-gap semiconductor layer structure to simultaneously form well regions underneath the source regions and trench shielding regions underneath the trenches, the well regions and the trench shielding regions each having a second conductivity type.