Patents by Inventor Seigi Aoyama

Seigi Aoyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8779294
    Abstract: The present invention provides a flexible flat cable having high conductivity and high bending durability, and a method for manufacturing the same. The present invention is a flexible flat cable comprising conductors and insulating films applied over the conductors, wherein the conductor is comprised of at least one additive element selected from the group consisting of magnesium (Mg), zirconium (Zr), niobium (Nb), calcium (Ca), vanadium (V), nickel (Ni), manganese (Mn), titanium (Ti), and chromium (Cr); 2 mass-ppm or more of oxygen; and the balance being inevitable impurity and copper, wherein the conductor has such a recrystallized texture that the size of crystal grains in the inner area of the conductor is large and that of in the surface area thereof is smaller than that of the inner area, wherein both sides of the conductor are sandwiched between insulating films.
    Type: Grant
    Filed: October 19, 2011
    Date of Patent: July 15, 2014
    Assignee: Hitachi Metals, Ltd.
    Inventors: Toru Sumi, Seigi Aoyama, Hiromitsu Kuroda, Hideyuki Sagawa
  • Publication number: 20140000932
    Abstract: Provided are a soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire which have high electrical conductivity and high bending life and can limit disconnection during use compared with oxygen-free copper wire, and also provided are an insulated wire, coaxial cable, and composite cable using the soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire. The soft dilute-copper alloy wire is subjected to annealing treatment by elongation processing of soft dilute-copper alloy material comprising copper and an additive element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Hf, Fe, Mn and Cr, with inevitable impurities as the balance, wherein the soft dilute-copper alloy wire has an average grain size that is 20 ?m or less in a surface layer having a depth of 50 ?m from the surface, and an elongation value that is at least 1% higher than the average elongation value of oxygen-free copper wire that has been subjected to the aforementioned annealing treatment.
    Type: Application
    Filed: March 16, 2012
    Publication date: January 2, 2014
    Applicant: HITACHI CABLE, LTD.
    Inventors: Seigi Aoyama, Toru Sumi, Hiromitsu Kuroda, Hideyuki Sagawa
  • Publication number: 20130323532
    Abstract: A copper-based material includes a base comprising copper and a surface treatment layer disposed on a surface of the base, the surface treatment layer including an amorphous layer containing a metal element that has a greater affinity for oxygen than for copper, oxygen, and, optionally, copper diffused from the base.
    Type: Application
    Filed: May 29, 2013
    Publication date: December 5, 2013
    Inventors: Hideyuki SAGAWA, Seigi Aoyama, Toru Sumi, Keisuke Fujito, Hiromitsu Kuroda
  • Patent number: 8596333
    Abstract: A method of making a copper wire rod with low semi-softening temperature includes melting a raw material copper to have a copper melt, adjusting concentrations of oxygen and sulfur included in the copper melt to be not more than 20 ppm and not more than 6 ppm, respectively, continuously casting the adjusted copper melt at temperature not higher than 1120° C. to have a cast bar, and hot-rolling the cast bar in a temperature range of 850° C. to 550° C.
    Type: Grant
    Filed: March 9, 2010
    Date of Patent: December 3, 2013
    Assignee: Hitachi Cable, Ltd.
    Inventors: Seigi Aoyama, Toru Sumi
  • Publication number: 20130042949
    Abstract: A method of manufacturing a soft-dilute-copper-alloy material includes a plastic working of a soft-dilute-copper-alloy including an additional element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Mn and Cr, and a balance consisting of copper and inevitable impurity, and a subsequent annealing treatment of the soft-dilute-copper-alloy. A working ratio in the plastic working before the annealing treatment is not less than 50%.
    Type: Application
    Filed: August 10, 2012
    Publication date: February 21, 2013
    Applicant: Hitachi Cable, Ltd.
    Inventors: Hideyuki Sagawa, Seigi Aoyama, Hiromitsu Kuroda, Toru Sumi, Keisuke Fujito, Ryohei Okada, Shinichi Masui
  • Publication number: 20130022831
    Abstract: A soft dilute copper alloy wire is composed of a soft dilute copper alloy material containing an additive element selected from the group consisting of Ti, Mg, Zr, Nb, Cu, V, Ni, Mn, and Cr, and balance comprising Cu. An average size of crystal grains lying from a surface of the soft dilute copper alloy wire at least to a depth of 20% of a wire diameter is not greater than 20 ?m.
    Type: Application
    Filed: July 19, 2012
    Publication date: January 24, 2013
    Applicant: Hitachi Cable, Ltd.
    Inventors: Hideyuki Sagawa, Seigi Aoyama, Hiromitsu Kuroda, Toru Sumi, Keisuke Fujito
  • Publication number: 20120305286
    Abstract: Provided are a soft dilute copper alloy material, a soft dilute copper alloy wire, a soft dilute copper alloy sheet, a soft dilute copper alloy stranded wire, and a cable, a coaxial cable and a composite cable using same. The disclosed soft-3dilute-copper-alloy material contains: copper; at least one additional element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Mn, and Cr; and inevitable impurities as the remainder. The soft dilute copper alloy material is characterized in that the average grain size is at most 20 ?m in the surface layer up to a depth of 50 ?m from the surface.
    Type: Application
    Filed: February 8, 2011
    Publication date: December 6, 2012
    Inventors: Seigi Aoyama, Toru Sumi, Hiromitsu Kuroda, Hideyuki Sagawa
  • Patent number: 8250744
    Abstract: A solar cell lead wire includes a conductive material, and a solder plated layer on a periphery of the conductive material. The solder plated layer is formed flat by rolling. A method of manufacturing a solar cell lead wire includes feeding an elongate conductive material from a feed reel, the elongate conductive material including a rectangular conductor or a round conductor, soaking the conductive material in a molten solder in a molten solder plating bath, cooling the conductive material to have a plated wire with a solder plated layer formed on the conductive material, and winding the plated wire on a winding reel. The plated wire is formed flat by rolling after the solder plated layer of the plated wire is solidified by the cooling.
    Type: Grant
    Filed: July 17, 2009
    Date of Patent: August 28, 2012
    Assignees: Hitachi Cable, Ltd., Hitachi Cable Fine-Tech, Ltd.
    Inventors: Seigi Aoyama, Hiroshi Bando, Iku Higashidani, Yoshiharu Masaki, Hiroshi Okikawa
  • Publication number: 20120097904
    Abstract: A dilute copper alloy material used in an environment with presence of hydrogen includes pure copper including an inevitable impurity, more than 2 mass ppm of oxygen, and an additive element selected from the group consisting of Mg, Zr, Nb, Ca, V, Fe, Al, Si, Ni, Mn, Ti and Cr, the additive element being capable of forming an oxide in combination with the oxygen. A method of manufacturing a dilute copper alloy member excellent in characteristics of resistance to hydrogen embrittlement includes melting the dilute copper alloy material by SCR continuous casting and rolling at a copper melting temperature of not less than 1100° C. and not more than 1320° C. to make molten metal, forming a cast bar from the molten metal, and forming the dilute copper alloy member by hot-rolling the cast bar.
    Type: Application
    Filed: October 19, 2011
    Publication date: April 26, 2012
    Applicants: Hitachi Wire and Rod LTD., Hitachi Cable, Ltd
    Inventors: Hiromitsu Kuroda, Toru Sumi, Hideyuki Sagawa, Seigi Aoyama
  • Publication number: 20120100390
    Abstract: A weldment includes metal materials that are welded to each other. At least one of the metal materials includes pure copper including an inevitable impurity, more than 2 mass ppm of oxygen, and an additive element selected from the group consisting of Mg, Zr, Nb, Fe, Si, Al, Ca, V, Ni, Mn, Ti and Cr. A method of manufacturing a weldment includes melting a dilute copper alloy material by SCR continuous casting and rolling at a molten copper temperature of not less than 1100° C. and not more than 1320° C. to make a molten metal, forming a cast bar from the molten metal, forming a dilute copper alloy member by hot-rolling the cast bar, and welding the dilute copper alloy member to a metal material.
    Type: Application
    Filed: October 19, 2011
    Publication date: April 26, 2012
    Applicants: Hitachi Wire and Rod LTD, HITACHI CABLE, LTD.
    Inventors: Hiromitsu Kuroda, Toru Sumi, Hideyuki Sagawa, Seigi Aoyama, Masayoshi Goto, Takahiko Hanada, Takahiro Sato, Hidenori Abe
  • Publication number: 20120097420
    Abstract: An audio/video cable includes a plurality of parallel arranged insulated wires or twisted pair insulated wires each including a copper conductor and an insulation layer formed on a periphery thereof. The copper conductor includes a soft dilute copper alloy material containing pure copper, an additive element and an inevitable impurity as a balance. The soft dilute copper alloy material includes a recrystallized structure having a grain size distribution such that crystal grains in a surface layer are smaller than internal crystal grains. The surface layer includes a crystal structure such that an average crystal grain size from a surface of the surface layer up to a depth of 50 ?m toward inside of the soft dilute copper alloy material is not more than 20 ?m.
    Type: Application
    Filed: October 19, 2011
    Publication date: April 26, 2012
    Applicant: HITACHI CABLE, LTD.
    Inventors: Seigi Aoyama, Toru Sumi, Masayoshi Goto
  • Publication number: 20120097422
    Abstract: The present invention provides a flexible flat cable having high conductivity and high bending durability, and a method for manufacturing the same. The present invention is a flexible flat cable comprising conductors and insulating films applied over the conductors, wherein the conductor is comprised of at least one additive element selected from the group consisting of magnesium (Mg), zirconium (Zr), niobium (Nb), calcium (Ca), vanadium (V), nickel (Ni), manganese (Mn), titanium (Ti), and chromium (Cr); 2 mass-% or more of oxygen; and the balance being inevitable impurity and copper, wherein the conductor has such a recrystallized texture that the size of crystal grains in the inner area of the conductor is large and that of in the surface area thereof is smaller than that of the inner area, wherein both sides of the conductor are sandwiched between insulating films.
    Type: Application
    Filed: October 19, 2011
    Publication date: April 26, 2012
    Applicant: HITACHI CABLE, LTD.
    Inventors: Toru SUMI, Seigi AOYAMA, Hiromitsu KURODA, Hideyuki SAGAWA
  • Patent number: 8138606
    Abstract: A Pb-free Sn-based material part of a wiring conductor is provided at least at a part of its surface, and the Sn-based material part includes a base metal doped with an oxidation control element. The oxidation control element is at least one element selected from a group consisted of P, Ge, K, Zn, Cr, Mn, Na, V, Si, Ti, Al, Li, Mg and Ca. The wiring conductor is reflow processed, such that at least one of the Sn and the oxidation control element is diffused to form an alloy.
    Type: Grant
    Filed: April 6, 2007
    Date of Patent: March 20, 2012
    Assignee: Hitachi Cable, Ltd.
    Inventors: Takayuki Tsuji, Hiroshi Yamanobe, Hajime Nishi, Takeshi Usami, Seigi Aoyama, Masato Ito, Hiroshi Okikawa
  • Publication number: 20100263905
    Abstract: A dilute copper alloy material includes, based on a total mass of the dilute copper alloy material, 2 to 12 mass ppm of sulfur, 2 to 30 mass ppm of oxygen, 4 to 55 mass ppm of titanium, and a balance consisting of pure copper and an inevitable impurity. A part of the sulfur and the titanium forms a compound or an aggregate of TiO, TiO2, TiS or Ti—O—S, and an other part of the sulfur and the titanium forms a solid solution. TiO, TiO2, TiS and Ti—O—S distributed in a crystal grain of the dilute copper alloy material are not more than 200 nm, not more than 1000 nm, not more than 200 nm and not more than 300 nm, respectively, in particle size thereof, and not less than 90% of particles distributed in a crystal grain of the dilute copper alloy material are not more than 500 nm or less in particle size.
    Type: Application
    Filed: April 8, 2010
    Publication date: October 21, 2010
    Inventors: Seigi AOYAMA, Toru Sumi, Shuji Sakai, Takahiro Sato, Hidenori Abe
  • Publication number: 20100230069
    Abstract: A method of making a copper wire rod with low semi-softening temperature includes melting a raw material copper to have a copper melt, adjusting concentrations of oxygen and sulfur included in the copper melt to be not more than 20 ppm and not more than 6 ppm, respectively, continuously casting the adjusted copper melt at temperature not higher than 1120° C. to have a cast bar, and hot-rolling the cast bar in a temperature range of 850° C. to 550° C.
    Type: Application
    Filed: March 9, 2010
    Publication date: September 16, 2010
    Applicant: HITACHI CABLE, LTD.
    Inventors: Seigi Aoyama, Toru Sumi
  • Patent number: 7773047
    Abstract: An antenna having an antenna element bent in a predetermined shape. The antenna element has a plurality of line conductors that are arranged in parallel and are sandwiched by two insulation films. A method of making an antenna has the steps of: arranging in parallel a plurality of line conductors, each of which having a width of 0.04 mm or less, at intervals of 10 times or more the width of each of the line conductors; discharging continuously the plurality of line conductors such that visibility of the line conductors is reduced; and sandwiching continuously the discharged line conductors by planar transparent insulation films with a sticking or adhesion layer to have an antenna element.
    Type: Grant
    Filed: September 20, 2006
    Date of Patent: August 10, 2010
    Assignee: Hitachi Cable, Ltd.
    Inventors: Toshiyuki Horikoshi, Masahiko Kobayashi, Seigi Aoyama, Hiroshi Yamanobe, Shinsuke Murano
  • Publication number: 20100163139
    Abstract: A method of manufacturing a Cu alloy conductor comprises the steps of: adding and dissolving In of 0.1-0.7 weight % to a Cu matrix containing oxygen of 0.001-0.1 weight % (10-1000 weight ppm) to form a molten Cu alloy, performing a continuous casting with the molten Cu alloy, rapidly quenching a casting material to a temperature by at least 15° C. or more lower than a melting point of molten Cu alloy, controlling the casting material at a temperature equal to or lower than 900° C., and performing a plurality of hot rolling processes to the casting material such that a temperature of a final hot rolling is within a range of from 500 to 600° C. to form the rolled material.
    Type: Application
    Filed: March 3, 2010
    Publication date: July 1, 2010
    Inventors: Seigi AOYAMA, Takaaki Ichikawa, Hiroyoshi Hiruta, Hiromitsu Kuroda
  • Patent number: 7737370
    Abstract: An electromagnetic shielding filter has two transparent boards and a conductive mesh with plural wires, where the conductive mesh is sandwiched between the two transparent boards. The plural wires are formed of a Cu—Sn—In alloy or a Cu—Ag alloy.
    Type: Grant
    Filed: July 30, 2007
    Date of Patent: June 15, 2010
    Assignee: Hitachi Cable, Ltd.
    Inventors: Seigi Aoyama, Toshiyuki Horikoshi, Hiromitsu Kuroda, Yuzo Ito, Hiroshi Komuro, Hiroshi Okikawa
  • Publication number: 20100018748
    Abstract: A solar cell lead wire includes a conductive material, and a solder plated layer on a periphery of the conductive material. The solder plated layer is formed flat by rolling. A method of manufacturing a solar cell lead wire includes feeding an elongate conductive material from a feed reel, the elongate conductive material including a rectangular conductor or a round conductor, soaking the conductive material in a molten solder in a molten solder plating bath, cooling the conductive material to have a plated wire with a solder plated layer formed on the conductive material, and winding the plated wire on a winding reel. The plated wire is formed flat by rolling after the solder plated layer of the plated wire is solidified by the cooling.
    Type: Application
    Filed: July 17, 2009
    Publication date: January 28, 2010
    Applicants: HITACHI CABLE, LTD., HITACHI CABLE FINE-TECH, LTD.
    Inventors: Seigi Aoyama, Hiroshi Bando, Iku Higashidani, Yoshiharu Masaki, Hiroshi Okikawa
  • Publication number: 20080283159
    Abstract: A method of fabricating soft copper alloy wire having flexure resistance and heat resistance, includes casting a molten alloy of a copper alloy including 10 mass ppm or less of oxygen, and 0.005 mass % to 0.6 mass % of indium, at a predetermined temperature, to provide a cast bar of the copper alloy having equiaxed crystal, rolling the cast bar of the copper alloy having equiaxed crystal to provide a rolled copper alloy, and conducting a cold drawing and annealing on the rolled copper alloy.
    Type: Application
    Filed: July 16, 2008
    Publication date: November 20, 2008
    Applicant: Hitachi Cable, Ltd.
    Inventors: Seigi Aoyama, Yuju Endo, Hiroyoshi Hiruta