Abstract: In a lead-free solder comprising an alloy composition composed mainly of tin, the alloy composition further contains 0.002 to 0.015% by mass of phosphorus. This lead-free solder can be used as a plating in a connection lead comprising: a copper strip or other strip conductor; and the plating provided on at least one side of the strip constructor, the plating having a shape such that the plating in the widthwise direction of the strip conductor has a bulge as viewed in section with the apex being located at a proper position in the widthwise direction of the strip conductor. By virtue of this constitution, the lead-free solder on its surface is less likely to be oxidized, and the connection lead has excellent bond strength owing to the property of the lead-free solder and, in addition, has the function of breaking the formed oxide layer and the function of removing included gas bubbles and can eliminate the need to form the plating in very large thickness.

Abstract: This invention provides a composite conductor having excellent strength, flexing resistance and corrosion resistance, a production method thereof and a cable employing the same composite conductor. A corrosion resistant layer is formed of Au, Ag, Sn, Ni, solder, Zn, Pd, Sn—Ni alloy, Ni—Co alloy, Ni—P alloy, Ni—Co—P alloy, Cu—Zn alloy, Sn—Bi alloy, Sn—Ag—cu alloy, Sn—Cu alloy or Sn—Zn alloy in the thickness of 0.5 &mgr;m or more on an external periphery of a core made of copper-metal fiber conductor. A wire material made of the copper-metal fiber conductor is subjected to area reduction processing. In the middle of the area reduction processing or after the area reduction processing is completed, corrosion resistant layer is formed on the periphery of the wire material in the thickness of 0.

Abstract: In FFCl integrated by sandwiching flat type conductors 2 between plastic films 3 with adhesives, wherein the conductors are formed of pure copper or a copper alloy having a wiredrawing draught of at least 95% and an elongation of at least 5%, and the plastic films with adhesives are formed of one having a modulus of longitudinal elasticity of at least 280 kg/mm2 and an elongation of at least 80%, and the 180° peel strength between the adhesives and the conductors 2 is made to be at least 0.8 kg/cm. As a result, even if the number of conductors 2 is increased than the conventional FFC, bending-resistant characteristic equal to or higher than the conventional FFC can be exhibited.

Abstract: In a flexible flat cable comprising a single conductor or a plurality of conductors, juxtaposed to each other or one another, which are sandwiched between a pair of plastic films with an adhesive to form an integral structure, the plastic films with an adhesive each are formed of a polyimide with an adhesive which has a modulus of longitudinal elasticity of not less than 300 kg/mm2 and an elongation of not less than 20%, the adhesive is formed of an epoxy having a glass transition temperature Tg of 80° C. or above, and the 180° peel strength between the adhesive and the conductor is not less than 0.5 kg/cm. By virtue of this constitution, a novel flexible flat cable can be realized which has significantly improved heat resistance and, at the same time, has excellent flex resistance even at a high temperature of 80° C. or above.

Abstract: A wire rod comprising high-purity copper having a total unavoidable impurity content of not more than 1 ppm by mass and, added to the high-purity copper, 1.0 to 5.0% by mass of silver having a purity of not less than 99.99% by mass is drawn to an ultrafine copper alloy wire with a diameter of not more than 0.08 mm. According to this constitution, since the content of foreign matter, causative of breaking of wires, in a base material has been minimized, excellent wire drawability and bending properties can be realized. Further, since silver is used as an additive element, the ultrafine copper alloy wire possesses excellent tensile strength. This constitution can further realize a stranded copper alloy wire conductor, and an extrafine coaxial cable possessing excellent tensile strength, wire drawability, and bending properties.

Abstract: It is an object of the invention to provide an electrode wire for an electrical discharge machining apparatus, which is low-priced in cost of production, has sufficient conductivity and strength at high temperature and is suited for improving the speed of electrical discharge machining. Cu—Zn alloy covering layer is formed around a core metallic wire formed of Cu—0.02 to 0.2 Zr alloy or Cu—0.15 to 0.25 Sn—0.15 to 0.25 In alloy.

Abstract: It is an object of the invention to provide an electrode wire for an electrical discharge machining apparatus, which is low-priced in cost of production, has sufficient conductivity and strength at high temperature and is suited for improving the speed of electrical discharge machining. Cu—Zn alloy covering layer is formed around a core metallic wire formed of Cu-0.02 to 0.2 Zr alloy or Cu-0.15 to 0.25 Sn-0.15 to 0.25 In alloy.

Abstract: The invention relates to a method for manufacturing an electrode wire for an electrical discharge machining apparatus, which is composed of a core wire formed of Cu or Cu-alloy and a covering layer formed of brass. A brass tape is longitudinally applied around a core wire to provide a pipe, a seam formed by butting longitudinal edges of the brass tape is continuously welded to provide a composite wire, area-reduction process of reduction rate less than 65% is applied to the brass pipe by means of a squeezing die, a heat treatment at a temperature higher a recrystallization one of brass is applied to the composite pipe, and thereafter the composite wire is processed to be reduced in area through plural reducing dies step by step.

Abstract: A high pin count and multi-layer lead frame according to the present invention which has a short pitch, high density lead pattern and at the same time, enhanced transmission characteristics for high-frequency signals includes at least one pair of conductive layers for grounding, power supply or both of them and one pair of insulating layers formed on these conductive layers, inner leads formed on the insulating layer on the top conductive layer by etching or vapor deposition in a short pitch, high density pattern, and outer leads made of metal frame. The inner leads are electrically connected to the leads for signals of the outer leads, the leads for grounding and power supply of the outer leads are connected to each of the conductive layers separately, and a plurality of holes for wire bonding the electrodes of a semiconductor element to each of the conductive layers are formed on each of the insulating layers.

Abstract: A method of fabricating an undoped or impurity-doped semi-insulating GaAs single crystal with the use of a silica boat comprises the steps of making a melt of GaAs in the silica boat except for a seed crystal, doping the melt with oxygen, maintaining the doped melt as it is for a predetermined period of time, solidifying the melt from the side opposite the seed crystal toward the seed crystal, seeding the melt when the melt attains a predetermined melt zone width on the seed crystal side, and moving the melt zone in the direction opposite the seed crystal for its solidification while keeping the melt zone width unchanged.