Patents by Inventor Seigi Suh

Seigi Suh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11289238
    Abstract: A solvent-free electroconductive composition may be used to make electroconductive lines on a surface of a substrate or electroconductive plugs within via holes of a substrate. The solvent-free electroconductive composition is generally made of about 40 to about 95 wt % of a conductive component, about 4 to about 30 wt % of a polymer or oligomer comprising a reactive functional group, up to about 20 wt % of a monomeric diluent comprising a reactive functional group, and up to about 3 wt % of a curing agent. In some instances, the solvent-free electroconductive composition further includes up to about 3 wt % of a lubricating compound. Substrates made using solvent-free electroconductive compositions may be used in printed circuit boards, integrated circuits, solar cells, capacitors, resistors, thermistors, varistors, resonators, transducers, inductors, and multilayer ferrite beads.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: March 29, 2022
    Assignee: HERAEUS PRECIOUS METALS NORTH AMERICA CONSHOHOCKEN LLC
    Inventor: Seigi Suh
  • Publication number: 20210174983
    Abstract: A solvent-free electroconductive composition may be used to make electroconductive lines on a surface of a substrate or electroconductive plugs within via holes of a substrate. The solvent-free electroconductive composition is generally made of about 40 to about 95 wt % of a conductive component, about 4 to about 30 wt % of a polymer or oligomer comprising a reactive functional group, up to about 20 wt % of a monomeric diluent comprising a reactive functional group, and up to about 3 wt % of a curing agent. In some instances, the solvent-free electroconductive composition further includes up to about 3 wt % of a lubricating compound. Substrates made using solvent-free electroconductive compositions may be used in printed circuit boards, integrated circuits, solar cells, capacitors, resistors, thermistors, varistors, resonators, transducers, inductors, and multilayer ferrite beads.
    Type: Application
    Filed: December 4, 2019
    Publication date: June 10, 2021
    Inventor: Seigi Suh
  • Patent number: 10910340
    Abstract: A silver sintering preparation comprising: (A) 30 to 88 wt.-% of silver flake particles having a mean particle diameter (d50) in the range of >1 to 20 ?m, (B) 5 to 30 wt.-% of at least one silver precursor, (C) 1 to 10 wt.-% of an organic polymer system, and (D) 6 to 30 wt.-% of organic solvent, wherein the organic polymer system (C) is chemically essentially stable at temperatures <300° C. and forms a continuous phase together with the organic solvent (D).
    Type: Grant
    Filed: October 14, 2019
    Date of Patent: February 2, 2021
    Assignee: HERAEUS DEUTSCHLAND GMBH & CO. KG
    Inventors: Ly May Chew, Seigi Suh, Samson Shahbazi, Wolfgang Schmitt
  • Patent number: 10508217
    Abstract: The invention is directed to a polyimide-based polymer thick film paste composition for forming a polyimide-based polymer thick film resistor, a process for forming the resistor and an electrical device containing a resistor formed using the paste composition The paste composition comprise a functional component, a polyimide, and an organic solvent and can be cured by heating.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: December 17, 2019
    Assignee: E I DU PONT DE NEMOURS AND COMPANY
    Inventor: Seigi Suh
  • Publication number: 20190100676
    Abstract: The invention is directed to a polyimide-based polymer thick film paste composition for forming a polyimide-based polymer thick film resistor, a process for forming the resistor and an electrical device containing a resistor formed using the paste composition The paste composition comprise a functional component, a polyimide, and an organic solvent and can be cured by heating.
    Type: Application
    Filed: December 3, 2018
    Publication date: April 4, 2019
    Inventor: Seigi Suh
  • Patent number: 10189950
    Abstract: This invention is directed to polyimide-based polymer thick film compositions and particularly non-fluorinated polyimide-based polymer thick film compositions. These compositions are comprised of certain polyimide polymers and certain solvents. In some embodiments various functional components are added to the composition to provide compositions that can be used to form various elements of an electrical circuit.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: January 29, 2019
    Assignee: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: Seigi Suh, Haixin Yang
  • Patent number: 10153075
    Abstract: The invention is directed to a polyimide-based polymer thick film paste composition for forming a polyimide-based polymer thick film resistor, a process for forming the resistor and an electrical device containing a resistor formed using the paste composition The paste composition comprise a functional component, a polyimide, and an organic solvent and can be cured by heating.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: December 11, 2018
    Assignee: E I DU PONT DE NEMOURS AND COMPANY
    Inventor: Seigi Suh
  • Patent number: 9905414
    Abstract: Metal silicates or phosphates are deposited on a heated substrate by the reaction of vapors of alkoxysilanols or alkylphosphates along with reactive metal amides, alkyls or alkoxides. For example, vapors of tris(tert-butoxy)silanol react with vapors of tetrakis(ethylmethylamido) hafnium to deposit hafnium silicate on surfaces heated to 300° C. The product film has a very uniform stoichiometry throughout the reactor. Similarly, vapors of diisopropylphosphate react with vapors of lithium bis(ethyldimethylsilyl)amide to deposit lithium phosphate films on substrates heated to 250° C. Supplying the vapors in alternating pulses produces these same compositions with a very uniform distribution of thickness and excellent step coverage.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: February 27, 2018
    Assignee: President and Fellows of Harvard College
    Inventors: Roy Gerald Gordon, Jill S. Becker, Dennis Hausmann, Seigi Suh
  • Publication number: 20170200539
    Abstract: The invention is directed to a polyimide-based polymer thick film paste composition for forming a polyimide-based polymer thick film resistor, a process for forming the resistor and an electrical device containing a resistor formed using the paste composition The paste composition comprise a functional component, a polyimide, and an organic solvent and can be cured by heating.
    Type: Application
    Filed: December 15, 2016
    Publication date: July 13, 2017
    Inventor: Seigi Suh
  • Publication number: 20170174838
    Abstract: This invention is directed to polyimide-based polymer thick film compositions and particularly non-fluorinated polyimide-based polymer thick film compositions. These compositions are comprised of certain polyimide polymers and certain solvents.
    Type: Application
    Filed: December 12, 2016
    Publication date: June 22, 2017
    Inventors: Seigi Suh, Haixin Yang
  • Patent number: 9649730
    Abstract: The invention is directed to a paste composition and a process for forming a solderable polyimide-based polymer thick film conductor. The paste composition comprising an electrically conductive metal, a polyimide, an organosilicon compound and an organic solvent and can be cured by heating at a temperature of 320 to 380° C. The invention also provides an electrical device containing a solderable polyimide-based polymer thick film conductor formed using the paste composition.
    Type: Grant
    Filed: August 12, 2015
    Date of Patent: May 16, 2017
    Assignee: E I DU PONT DE NEMOURS AND COMPANY
    Inventor: Seigi Suh
  • Patent number: 9637648
    Abstract: This invention provides a polymer thick film copper conductor composition for forming a solderable and highly solder leach resistant electrical conductor and a method for using the polymer thick film copper conductor composition to form the electrical conductor in an electrical circuit. The method subjects the deposited thick film copper conductor composition to photonic sintering. The invention further provides electrical devices containing electrical conductors made from the polymer thick film copper conductor composition and also those formed by the method.
    Type: Grant
    Filed: September 23, 2015
    Date of Patent: May 2, 2017
    Assignee: E I DU PONT DE NEMOURS AND COMPANY
    Inventor: Seigi Suh
  • Patent number: 9637647
    Abstract: This invention provides a polymer thick film copper conductor composition for forming an electrical conductor and a method for using the polymer thick film copper conductor composition to form an electrical conductor in an electrical circuit. The method subjects the deposited thick film copper conductor composition to photonic sintering. The invention further provides electrical devices containing electrical conductors made from the polymer thick film copper conductor composition and also those formed by the method.
    Type: Grant
    Filed: September 23, 2015
    Date of Patent: May 2, 2017
    Assignee: E I DU PONT DE NEMOURS AND COMPANY
    Inventor: Seigi Suh
  • Publication number: 20170044382
    Abstract: The invention is directed to a process for forming a solderable polyimide-based polymer thick film conductor in which a paste composition comprising an electrically conductive metal, a polyimide and an organic solvent is cured by heating at a temperature of 280 to 320° C. The invention is also provides an electrical device containing a solderable polyimide-based polymer thick film conductor formed by the process of the invention.
    Type: Application
    Filed: August 12, 2015
    Publication date: February 16, 2017
    Inventor: SEIGI SUH
  • Publication number: 20170044384
    Abstract: This invention provides a polymer thick film copper conductor composition for forming a solderable and highly solder leach resistant electrical conductor and a method for using the polymer thick film copper conductor composition to form the electrical conductor in an electrical circuit. The method subjects the deposited thick film copper conductor composition to photonic sintering. The invention further provides electrical devices containing electrical conductors made from the polymer thick film copper conductor composition and also those formed by the method.
    Type: Application
    Filed: September 23, 2015
    Publication date: February 16, 2017
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventor: Seigi Suh
  • Publication number: 20170044383
    Abstract: This invention provides a polymer thick film copper conductor composition for forming an electrical conductor and a method for using the polymer thick film copper conductor composition to form an electrical conductor in an electrical circuit. The method subjects the deposited thick film copper conductor composition to photonic sintering. The invention further provides electrical devices containing electrical conductors made from the polymer thick film copper conductor composition and also those formed by the method.
    Type: Application
    Filed: September 23, 2015
    Publication date: February 16, 2017
    Inventor: Seigi Suh
  • Publication number: 20170043435
    Abstract: The invention is directed to a paste composition and a process for forming a solderable polyimide-based polymer thick film conductor. The paste composition comprising an electrically conductive metal, a polyimide, an organosilicon compound and an organic solvent and can be cured by heating at a temperature of 320 to 380° C. The invention also provides an electrical device containing a solderable polyimide-based polymer thick film conductor formed using the paste composition.
    Type: Application
    Filed: August 12, 2015
    Publication date: February 16, 2017
    Inventor: SEIGI SUH
  • Publication number: 20160268121
    Abstract: Metal silicates or phosphates are deposited on a heated substrate by the reaction of vapors of alkoxysilanols or alkylphosphates along with reactive metal amides, alkyls or alkoxides. For example, vapors of tris(tert-butoxy)silanol react with vapors of tetrakis(ethylmethylamido) hafnium to deposit hafnium silicate on surfaces heated to 300° C. The product film has a very uniform stoichiometry throughout the reactor. Similarly, vapors of diisopropylphosphate react with vapors of lithium bis(ethyldimethylsilyl)amide to deposit lithium phosphate films on substrates heated to 250° C. Supplying the vapors in alternating pulses produces these same compositions with a very uniform distribution of thickness and excellent step coverage.
    Type: Application
    Filed: May 23, 2016
    Publication date: September 15, 2016
    Inventors: Roy Gerald GORDON, Jill S. BECKER, Dennis HAUSMANN, Seigi SUH
  • Publication number: 20160183328
    Abstract: The present invention relates to the design, construction and manufacture of a novel electrical high temperature heater having a polymer thick film conductor paste with which to form an electrode on resistive film.
    Type: Application
    Filed: December 17, 2015
    Publication date: June 23, 2016
    Inventors: JOHN GRAEME PEPIN, JOHN DONALD SUMMERS, SEIGI SUH, KURT DOUGLAS ROBERTS, DANNY E GLENN
  • Publication number: 20160111276
    Abstract: Metal silicates or phosphates are deposited on a heated substrate by the reaction of vapors of alkoxysilanols or alkylphosphates along with reactive metal amides, alkyls or alkoxides. For example, vapors of tris(tert-butoxy)silanol react with vapors of tetrakis(ethylmethylamido)hafnium to deposit hafnium silicate on surfaces heated to 300° C. The product film has a very uniform stoichiometry throughout the reactor. Similarly, vapors of diisopropylphosphate react with vapors of lithium bis(ethyldimethylsilyl)amide to deposit lithium phosphate films on substrates heated to 250° C. Supplying the vapors in alternating pulses produces these same compositions with a very uniform distribution of thickness and excellent step coverage.
    Type: Application
    Filed: December 18, 2015
    Publication date: April 21, 2016
    Inventors: Roy Gerald GORDON, Jill S. BECKER, Dennis HAUSMANN, Seigi SUH