Abstract: A gas barrier film includes a substrate film and an inorganic layer, in which the inorganic layer includes Si, N, H, and O, the inorganic layer includes a uniform region having a thickness of more than 5 nm at the center in a thickness direction, in the uniform region, a ratio of Si, N, H, and O is uniform and an O proportion is low, and either or both interface-contact regions of the inorganic layer are oxygen-containing regions in which the O proportion represented by the expression “O Proportion: (Number of O/Total Number of Si, N, and O)×100%” increases in a direction from the uniform region side to an interface and in which a variation of the 0 proportion per unit thickness is 2%/nm to 8%/nm.

Abstract: In the manufacturing of transistors, a film substrate on which three or more alignment marks are formed is used, the alignment marks are detected, and a treatment for controlling the expansion and shrinkage of the substrate is carried out once or more by means of at least one of a temperature control of the substrate and a humidity control of the substrate depending on detection results thereof. Therefore, in the manufacturing of transistors in which films are used as substrates, it is possible to form constituent members of transistors such as source electrodes or drain electrodes without pattern deviation regardless of the expansion and shrinkage of substrates attributed to environmental changes.

Abstract: A method of inspecting a secondary battery includes: discharging the secondary battery initially charged, at a discharge current, from an initial voltage to a discharge ending voltage; calculating an interval capacity in a voltage interval from a check starting voltage to a check ending voltage, based on the discharge current, and discharge time taken in the voltage interval; measuring a voltage change amount from a point in time when the voltage reaches a first voltage to a point in time when a length of time elapses from the above point in time, when the secondary battery is discharged from the initial voltage to the discharge ending voltage; and determining whether a total capacity satisfies a performance requirement, by comparing the calculated interval capacity with a first threshold value, and determining whether an output satisfies a performance requirement, by comparing the measured voltage change amount with a second threshold value.

Abstract: The present invention provides, as gas barrier film having improved adhesiveness between a base material and a barrier laminate, a gas barrier film comprising a plastic film, an organic layer and an inorganic layer in this order, the gas barrier film having an aluminium compound layer containing one or more compounds selected from the group consisting of aluminium oxide, aluminium nitride and aluminium carbide between the plastic film and the organic layer; the plastic film and the aluminium compound layer, and the aluminium compound layer and the organic layer being directly in contact to each other respectively; the thickness of the aluminium compound layer being 40 nm or less; and the organic layer being a layer formed of a composition containing a polymerizable compound and a phosphate compound.

Abstract: The present invention provides, as gas barrier film having improved adhesiveness between a base material and a barrier laminate, a gas barrier film including a plastic film, an organic layer and an inorganic layer in this order, the gas barrier film having a silicon compound layer including one or more compounds selected from the group consisting of silicon oxide, silicon nitride and silicon carbide between the plastic film and the organic layer; the plastic film and the silicon compound layer, and the silicon compound layer and the organic layer being directly in contact to each other respectively; the thickness of the silicon compound layer being 40 nm or less; the organic layer being a layer formed of a composition containing a polymerizable compound and a silane coupling agent; and the thickness of the inorganic layer being larger than the thickness of the silicon compound layer.

Abstract: An administration method comprising: determining a cancer type through (i) first data indicating that an Estrogen Receptor (ER) is negative and a Human Epidermal growth factor Receptor-2 (Her2) is negative, or (ii) second data indicating that at least one of the ER and the Her2 is positive; and when the cancer type is determined through (i) the first data indicating that the ER is negative and the Her2 is negative: first performing a docetaxel administration cycle comprising administrating docetaxel to a patient multiple times at certain intervals; and then performing a 5-fluorouracil, epirubicin, and cyclophosphamide (FEC) administration cycle comprising administrating 5-fluorouracil, epirubicin, and cyclophosphamide to the patient multiple times at certain intervals, and when the cancer type is determined through (ii) the second data indicating that at least one of the ER and Her2 is positive: first performing the FEC administration cycle; and then performing the docetaxel administration cycle.

Abstract: A method of inspecting a secondary battery includes: discharging the secondary battery initially charged, at a discharge current, from an initial voltage to a discharge ending voltage; calculating an interval capacity in a voltage interval from a check starting voltage to a check ending voltage, based on the discharge current, and discharge time taken in the voltage interval; measuring a voltage change amount from a point in time when the voltage reaches a first voltage to a point in time when a length of time elapses from the above point in time, when the secondary battery is discharged from the initial voltage to the discharge ending voltage; and determining whether a total capacity satisfies a performance requirement, by comparing the calculated interval capacity with a first threshold value, and determining whether an output satisfies a performance requirement, by comparing the measured voltage change amount with a second threshold value.

Abstract: The variation in the contact pressures of the plurality of contact terminals to the plurality of chip electrodes is decreased. A thin-film sheet (first sheet) includes: a principal surface (contact-terminal formation surface) on which a plurality of contactors (contact terminals) are formed; and a rear surface positioned on an opposite side to the principal surface. Also, in the thin film sheet, a plurality of wirings and dummy wiring are arranged between the principal surface and the rear surface. A slit formed of an opening portion penetrating from the principal surface of the thin-film sheet to the rear surface thereof is formed along the wiring between the dummy wiring and the contactor arranged at an end of a contactor group (first contact terminal group) in which the plurality of contactors are aligned.

Abstract: A probe having a sufficient height is manufactured by selectively depositing, over the main surface of a wafer, a copper film in a region in which a metal film is to be formed and a region which will be outside an adhesion ring when a probe card is fabricated; forming the metal film, polyimide film, interconnect, another polyimide film, another interconnect and a further polyimide film; and then removing the wafer and copper film. According to the present invention, when probe testing is performed using a prober (thin film probe) having the probe formed in the above-described manner while utilizing the manufacturing technology of semiconductor integrated circuit devices, it is possible to prevent breakage of the prober and a wafer to be tested.

Abstract: The variation in the contact pressures of the plurality of contact terminals to the plurality of chip electrodes is decreased. A thin-film sheet (first sheet) includes: a principal surface (contact-terminal formation surface) on which a plurality of contactors (contact terminals) are formed; and a rear surface positioned on an opposite side to the principal surface. Also, in the thin film sheet, a plurality of wirings and dummy wiring are arranged between the principal surface and the rear surface. A slit formed of an opening portion penetrating from the principal surface of the thin-film sheet to the rear surface thereof is formed along the wiring between the dummy wiring and the contactor arranged at an end of a contactor group (first contact terminal group) in which the plurality of contactors are aligned.

Abstract: A probe having a sufficient height is manufactured by selectively depositing, over the main surface of a wafer, a copper film in a region in which a metal film is to be formed and a region which will be outside an adhesion ring when a probe card is fabricated; forming the metal film, polyimide film, interconnect, another polyimide film, another interconnect and a further polyimide film; and then removing the wafer and copper film. According to the present invention, when probe testing is performed using a prober (thin film probe) having the probe formed in the above-described manner while utilizing the manufacturing technology of semiconductor integrated circuit devices, it is possible to prevent breakage of the prober and a wafer to be tested.

Abstract: There was no device that proposes a method for administrating anti-cancer drugs according to each of cancer types. An administration method proposing device (100) includes an input unit (101) that receives an input of the cancer type of a cancer patient, an administration procedure determination unit (102) that determines the administration order of an FEC (F: 5-fluorouracil, E: epirubicin, and C: cyclophosphamide) administration cycle and a docetaxel administration cycle, and a display unit (103) that displays the administration order of the FEC administration cycle and the docetaxel administration cycle, as a result of the determination by the administration procedure determination unit (102).

Abstract: A probe having a sufficient height is manufactured by selectively depositing, over the main surface of a wafer, a copper film in a region in which a metal film is to be formed and a region which will be outside an adhesion ring when a probe card is fabricated; forming the metal film, polyimide film, interconnect, another polyimide film, another interconnect and a further polyimide film; and then removing the wafer and copper film. According to the present invention, when probe testing is performed using a prober (thin film probe) having the probe formed in the above-described manner while utilizing the manufacturing technology of semiconductor integrated circuit devices, it is possible to prevent breakage of the prober and a wafer to be tested.

Abstract: An object of the invention is to provide a curable composition wherein the adhesiveness to thermoplastic polyolefin (TPO) is improved. The invention is a curable composition containing (A) a polyoxyalkylene polymer having reactive silicon group(s), (B) a polyolefin polymer, and (C) a tackifying resin.

Abstract: To provide a technique of firmly bringing a stylus and a test pad into contact with each other in carrying out a probe testing summarizingly for plural chips by using a prober having the stylus formed by a technique of manufacturing a semiconductor integrated circuit device, plane patterns of respective wirings are formed such that a wiring and a wiring electrically connected to the wiring or a wiring which is not electrically connected to the wiring overlap each other, and a plane pattern arranged with both of the wiring and the wiring is constituted at upper portions of probes. Further, patterns of the wirings are formed such that an interval of arranging the wirings and a density of arranging the wirings become uniform at respective wiring layers in a thin film sheet.

Abstract: A technique of manufacturing a semiconductor integrated circuit device is provided for reducing the possibility of attachment of foreign matter to a membrane probe when performing probe inspection using the membrane probe formed by the manufacturing technique. A pressing member for pressing a membrane sheet includes a pressing pin receiving portion relatively disposed above for receiving the tip of a pressing pin of the plunger in a recess, and a membrane sheet pressing portion relatively disposed below. The membrane sheet pressing portion in contact with the membrane sheet has the minimum plane size to enable pressing of the entire surface of one chip of interest to be subjected to the probe inspection.

Abstract: A broadcast system composed of a first broadcast apparatus and a second broadcast apparatus. The first broadcast apparatus broadcasts a broadcast program composed of contents stream data and attachment data, and provides the second broadcast apparatus with the broadcast program. The attachment data contains information that indicates timing with which the attachment data is to be reproduced in synchronization with the contents stream data. The image sync information contains PCRs generated by the PCR generating apparatus of the first broadcast apparatus based on the standard time for the first broadcast apparatus. The image sync information replacing apparatus of the second broadcast apparatus replaces the PCRs with other PCRs which are newly generated based on the standard time for the second broadcast apparatus so that it can correctly reproduce the attachment data in synchronization with the encoded contents stream data.

Abstract: A probe having a sufficient height is manufactured by selectively depositing, over the main surface of a wafer, a copper film in a region in which a metal film is to be formed and a region which will be outside an adhesion ring when a probe card is fabricated; forming the metal film, polyimide film, interconnect, another polyimide film, another interconnect and a further polyimide film; and then removing the wafer and copper film. According to the present invention, when probe testing is performed using a prober (thin film probe) having the probe formed in the above-described manner while utilizing the manufacturing technology of semiconductor integrated circuit devices, it is possible to prevent breakage of the prober and a wafer to be tested.

Abstract: A technique of manufacturing a semiconductor integrated circuit device is provided for reducing the possibility of attachment of foreign matter to a membrane probe when performing probe inspection using the membrane probe formed by the manufacturing technique. A pressing member for pressing a membrane sheet includes a pressing pin receiving portion relatively disposed above for receiving the tip of a pressing pin of the plunger in a recess, and a membrane sheet pressing portion relatively disposed below. The membrane sheet pressing portion in contact with the membrane sheet has the minimum plane size to enable pressing of the entire surface of one chip of interest to be subjected to the probe inspection.

Abstract: An object of the invention is to provide a curable composition wherein the adhesiveness to thermoplastic polyolefin (TPO) is improved. The invention is a curable composition containing (A) a polyoxyalkylene polymer having reactive silicon group(s), (B) a polyolefin polymer, and (C) a tackifying resin.