Abstract: In a wafer processing method, the back side of a wafer having a plurality of devices on the front side thereof is ground, thereby reducing the thickness of the wafer to a predetermined thickness. The back side of the wafer is polished after performing the back grinding step, thereby removing a grinding strain, and a silicon nitride film is formed on the back side of the wafer. The thickness of the silicon nitride film to be formed in the silicon nitride film forming step is set to 6 to 100 nm. Thus, the silicon nitride film having a thickness of 6 to 100 nm is formed on the polished back side of the wafer from which a grinding strain has been removed. Accordingly, each device constituting the wafer can ensure a sufficient die strength and a sufficient gettering effect.

Abstract: A software installing method for installing software to a computer is disclosed. The method includes reading a software program to the computer, the software program corresponding to an equipment connected to the computer. The method further includes acquiring equipment information of the equipment from the equipment connected to the computer. The method also includes displaying an image representing a combination of parts of the equipment based on the acquired equipment information of the equipment on a display section prior to installing the software program, and installing the software program to the computer.

Abstract: In a device processing method, a laser beam is applied to a wafer along division lines from the back side of the wafer, thereby forming a division start point inside the wafer along the division lines at a depth not reaching the finished thickness of each device. A protective member is attached to the front side of the wafer before or after performing the division start points are formed. An external force is applied through the protective member to the wafer, thereby dividing the wafer along the division lines to obtain the individual devices. The back side of the wafer is ground to remove the modified layers, and a silicon nitride film is formed on at least the side surface of each device. The silicon nitride film has a gettering effect and is formed on the side surface of each device, which surface is formed by a cleavage plane.

Abstract: Execution is provided of at least: the first processing for making the installer software store the group information that relates to information which classifies a plurality of apparatuses into groups and specifies the apparatuses belonging to each group or the address information indicating the location storing this group information, at the time of building the installer software for installing the universal control software that provides universal control of a plurality of the apparatuses; the second processing for notifying about the group information or address information to prompt the group setting of a plurality of the apparatuses when installing the universal control software using installer software; and the third processing for selecting an apparatus as the object of control from among the apparatuses specified by group information acquired from the storage location having been notified or specified by the address information, when universal control software is executed.

Abstract: In a device processing method, a laser beam is applied to a wafer along division lines from the back side of the wafer, thereby forming a division start point inside the wafer along the division lines at a depth not reaching the finished thickness of each device. A protective member is attached to the front side of the wafer before or after performing the division start points are formed. An external force is applied through the protective member to the wafer, thereby dividing the wafer along the division lines to obtain the individual devices. The back side of the wafer is ground to remove the modified layers, and a silicon nitride film is formed on at least the side surface of each device. The silicon nitride film has a gettering effect and is formed on the side surface of each device, which surface is formed by a cleavage plane.

Abstract: In a wafer processing method, the back side of a wafer having a plurality of devices on the front side thereof is ground, thereby reducing the thickness of the wafer to a predetermined thickness. The back side of the wafer is polished after performing the back grinding step, thereby removing a grinding strain, and a silicon nitride film is formed on the back side of the wafer. The thickness of the silicon nitride film to be formed in the silicon nitride film forming step is set to 6 to 100 nm. Thus, the silicon nitride film having a thickness of 6 to 100 nm is formed on the polished back side of the wafer from which a grinding strain has been removed. Accordingly, each device constituting the wafer can ensure a sufficient die strength and a sufficient gettering effect.

Abstract: A method of manufacturing a semiconductor wafer, including a step of differentiating the glossiness of a front surface from that of a rear surface of the wafer by holding the semiconductor wafer in a wafer holding hole formed in a carrier plate, and simultaneously polishing a front and back surface of said semiconductor wafer by driving said carrier plate to make a circular motion associated with no rotation on its own axis within a plane parallel with a surface of said carrier plate between a pair of polishing members disposed to face to each other, by using an abrasive body with a semiconductor wafer sink rate different in polishing from that of an abrasive body for one of a polishing member on an upper surface plate and a polishing member on a lower surface plate so as to simultaneously polish both the front and rear surfaces of the semiconductor wafer, or differentiating by differentiating the rotating speed of the upper surface plate from that of the lower surface plate.

Abstract: Disclose is an image forming apparatus, which makes it possible to easily change the display magnification factor of the print preview image, by conducting intuitive operations.

Abstract: Disclosed is a computer readable storage medium storing a program to make a computer realize functions of an image storage unit to store image data for generating a tint block image, a tint block image generation unit to generate the tint block image based on the image data, a script generation unit to generate a script for forming the tint block image based on the tint block image generated by the generation unit, a script adding unit to add the script to print data and a print data input unit to input the print data in which the script is added by the adding unit to an image forming apparatus.

Abstract: A wireless communication apparatus is provided which is capable of performing synchronous transmission of a stream such as a video signal and therefore performing high-quality video transmission. The sending side generates time information based on a count of a beacon timer, adds the time information to a data packet of a video signal and sends the data packet. The receiving side, using PLL based on a timer count contained in a beacon, generates a clock having a higher frequency every time a beacon signal is received. The receiving side counts the clocks and accordingly generates new time information. This time information is compared with the time information added to the received data packet of the video signal, and the data packet is outputted only when the two match with each other.

Abstract: The display information is compared with the displayed information on what items are already displayed at what positions on the editable tab screen capable of editing the items stored therein, wherein the aforementioned display information includes the display item information on which of the items contained in the fixed tabs are to be displayed on the editable tab screen and the display position information on the positions of the items to be found on the editable tab screen. If a change has been discovered, a step is taken to determine the method of change processing for displaying the editable tab screen according to the result of comparison. The editable tab screen selected by the user is displayed according to the method of change processing based on the result of comparison.

Abstract: The editable tab selectably displayed as well as the fixed tabs is selected by the user, whereby an editable tab screen is created and displayed using the display item information on which item should be displayed on the editable tab screen, the display position information on the position of the item to be displayed on the editable tab screen, and the item information of item included in the fixed tab.

Abstract: An item setting apparatus for changing over a screen corresponding to a desired tab by selecting the desired tab from plural tabs and setting items displayed on the screen based on a user's operation, comprises an item information holding section to hold item information about indication of items of plural tabs having plural items; a group information holding section to separate items into plural groups and hold group information about that to which group each item belongs; a display item editing section to edit items displayed on a screen of a tab; and a tab display control section to control to display items correctively by a group unit on a screen of a tab selected by a user by using the group information.

Abstract: There are described a method and a computer executable program of the same, each of which makes it possible to provide registered items for a predetermined processing, which is established in advance corresponding to user's demands. The method includes: displaying a list of plural registrable items on a display section, which can be registered in order to provide at least one of the plural registrable items for the predetermined processing; accepting a registration instruction for registering said at least one of the plural registrable items, which includes an attribute value that indicates a status of its registration, based on an operation conducted by a user; providing the registered item for the predetermined processing according to the attribute value of the registration concerned; and when the registration instruction is accepted, displaying an attached image, which corresponds to the attribute value of the registration concerned, associating with one of the registrable items.

Abstract: Execution is provided of at least: the first processing for making the installer software store the group information that relates to information which classifies a plurality of apparatuses into groups and specifies the apparatuses belonging to each group or the address information indicating the location storing this group information, at the time of building the installer software for installing the universal control software that provides universal control of a plurality of the apparatuses; the second processing for notifying about the group information or address information to prompt the group setting of a plurality of the apparatuses when installing the universal control software using installer software; and the third processing for selecting an apparatus as the object of control from among the apparatuses specified by group information acquired from the storage location having been notified or specified by the address information, when universal control software is executed.

Abstract: A grinding method for a wafer having a plurality of devices on the front side, wherein the back side of the wafer is ground by a grinding wheel to suppress the motion of heavy metal in the wafer by a gettering effect and also to maintain the die strength of each device at about 1,000 MPa or more. The grinding wheel is composed of a frame and an abrasive member fixed to the free end of the frame. The abrasive member is produced by fixing diamond abrasive grains having a grain size of less than or equal to 1 ?m with a vitrified bond. A protective member is attached to the front side of the wafer and the wafer is held on a chuck table in the condition where the protective member is in contact with the chuck table. The grinding wheel is rotated as rotating the chuck table to thereby grind the back side of the wafer by means of the abrasive member so that the average surface roughness of the back side of the wafer becomes less than or equal to 0.

Abstract: A method of manufacturing a semiconductor wafer, including a step of differentiating the glossiness of a front surface from that of a rear surface of the wafer by holding the semiconductor wafer in a wafer holding hole formed in a carrier plate, and simultaneously polishing a front and back surface of said semiconductor wafer by driving said carrier plate to make a circular motion associated with no rotation on its own axis within a plane parallel with a surface of said carrier plate between a pair of polishing members disposed to face to each other, by using an abrasive body with a semiconductor wafer sink rate different in polishing from that of an abrasive body for one of a polishing member on an upper surface plate and a polishing member on a lower surface plate so as to simultaneously polish both the front and rear surfaces of the semiconductor wafer, or differentiating by differentiating the rotating speed of the upper surface plate from that of the lower surface plate.

Abstract: A method of manufacturing a semiconductor wafer, comprising the step of differentiating the glossiness of a front surface from that of a rear surface of the wafer by using an abrasive cloth with a semiconductor wafer sink rate different in polishing from that of the other abrasive cloth for one of a polishing cloth (14) on an upper surface plate (12) and a polishing cloth (15) on a lower surface plate (13) so as to simultaneously polish both the front and rear surfaces of the semiconductor wafer (W), or differentiating by differentiating the rotating speed of the upper surface plate from that of the lower surface plate.

Abstract: A grinding method for a wafer having a plurality of devices on the front side, wherein the back side of the wafer is ground by a grinding wheel to suppress the motion of heavy metal in the wafer by a gettering effect and also to maintain the die strength of each device at about 1,000 MPa or more. The grinding wheel is composed of a frame and an abrasive member fixed to the free end of the frame. The abrasive member is produced by fixing diamond abrasive grains having a grain size of less than or equal to 1 ?m with a vitrified bond. A protective member is attached to the front side of the wafer and the wafer is held on a chuck table in the condition where the protective member is in contact with the chuck table. The grinding wheel is rotated as rotating the chuck table to thereby grind the back side of the wafer by means of the abrasive member so that the average surface roughness of the back side of the wafer becomes less than or equal to 0.

Abstract: During polishing of the semiconductor wafer by using a double-sided polisher, a larger difference as compared to the prior art is created between a frictional resistance acting on a front surface of a silicon wafer from an upper surface plate side and a frictional resistance acting on a back surface of the silicon wafer from a lower surface plate side. Thereby, respective wafers can be rotated at as 0.1 - 1.0 rpm within corresponding wafer holding holes. Accordingly, the rotation of the wafer would not be suspended even if there were any defective condition induced during polishing. Further, partial variation or deviation in polishing volume particular in the outer periphery of the wafer would be hard to occur. Therefore, the polish-sagging is suppressed and thus the improved degree of flatness of the wafer could be obtained.