Abstract: A server includes a unit obtaining a position of a registered vehicle, a unit obtaining a vehicle dispatch position, a unit determining a candidate vehicle based on the vehicle dispatch position and the position of the registered vehicle, a unit transmitting information regarding an autonomous driving function of the candidate vehicle to a user device, a unit receiving information for identifying a dispatch vehicle, and a unit transmitting a vehicle dispatch position to the dispatch vehicle. The user device includes a unit receiving the information regarding the autonomous driving function of the candidate vehicle, a unit displaying the information regarding the autonomous driving function of the candidate vehicle, an unit accepting a user operation for selecting the dispatch vehicle, and a unit transmitting the information for identifying the dispatch vehicle to the server.

Abstract: A server includes a unit obtaining a position of a registered vehicle, a unit obtaining a vehicle dispatch position, a unit determining a candidate vehicle based on the vehicle dispatch position and the position of the registered vehicle, a unit transmitting information regarding an autonomous driving function of the candidate vehicle to a user device, a unit receiving information for identifying a dispatch vehicle, and a unit transmitting a vehicle dispatch position to the dispatch vehicle. The user device includes a unit receiving the information regarding the autonomous driving function of the candidate vehicle, a unit displaying the information regarding the autonomous driving function of the candidate vehicle, an unit accepting a user operation for selecting the dispatch vehicle, and a unit transmitting the information for identifying the dispatch vehicle to the server.

Abstract: A support structure for supporting a flat inverter located between seats aligned along the vehicle width direction is provided. A bracket supports the inverter in a horizontal position above a floor tunnel of a floor between the seats in a passenger compartment such that it is spaced apart from the floor tunnel. The bracket has a pair of rear leg portions aligned along the vehicle width direction. Middle parts of the pair of rear leg portions are formed so as to be easily bent outward or inward in the vehicle width direction. When a load is applied to the bracket due to movement of the seats during a side impact on the vehicle, the pair of rear leg portions bend, and the horizontal position of the inverter is disrupted.

Abstract: A manufacturing method of a body frame includes a pre-strain step of press molding a wavy shape portion in the body frame to apply pre-strain after any press molding to mold the body frame.

Abstract: An operation input device includes an operation input unit that is configured to receive a tracing operation performed in a one-dimensional direction. The operation input unit includes a plurality of mechanical switches that are arranged side by side in an operation direction and each include an operation surface subjected to the tracing operation, the operation surface defining a curved surface along the operation direction.

Abstract: A manufacturing method of a body frame includes a pre-strain step of press molding a wavy shape portion in the body frame to apply pre-strain after any press molding to mold the body frame.

Abstract: A printed circuit board has a printed wiring board and a semiconductor package mounted on the printed wiring board. The printed wiring board and the semiconductor package are connected with a plurality of solder balls. An underfill material covering the plurality of solder balls is filled between the printed wiring board and the semiconductor package. The underfill material has a relative dielectric constant of 8.6 or more and 54.4 or less. Thus, crosstalk noise generated in wiring in the out-of-plane direction is reduced without increasing the mounting area.

Abstract: An operation input device includes an operation input unit that is configured to receive a tracing operation performed in a one-dimensional direction. The operation input unit includes a plurality of mechanical switches that are arranged side by side in an operation direction and each include an operation surface subjected to the tracing operation, the operation surface defining a curved surface along the operation direction.

Abstract: A printed circuit board has a printed wiring board and a semiconductor package mounted on the printed wiring board. The printed wiring board and the semiconductor package are connected with a plurality of solder balls. An underfill material covering the plurality of solder balls is filled between the printed wiring board and the semiconductor package. The underfill material has a relative dielectric constant of 8.6 or more and 54.4 or less. Thus, crosstalk noise generated in wiring in the out-of-plane direction is reduced without increasing the mounting area.

Abstract: A printed circuit board has a printed wiring board and a semiconductor package mounted on the printed wiring board. The printed wiring board and the semiconductor package are connected with a plurality of solder balls. An underfill material covering the plurality of solder balls is filled between the printed wiring board and the semiconductor package. The underfill material has a relative dielectric constant of 8.6 or more and 54.4 or less. Thus, crosstalk noise generated in wiring in the out-of-plane direction is reduced without increasing the mounting area.

Abstract: A printed wiring board includes a first conductive layer, a second conductive layer arranged at a gap with respective to the first conductive layer, a third conductive layer, a first via conductor and a second via conductor, and a third signal wiring pattern. A first signal wiring pattern is arranged on the first conductive layer, a second signal wiring pattern is arranged on the second conductive layer, and a third signal wiring pattern that is arranged on the third conductive layer. The third conductive layer is arranged between the first conductive layer and the second conductive layer via an insulating layer. The first via conductor and the second via conductor, which are arranged to be mutually adjacent, connect the first signal wiring pattern to the second signal wiring pattern. The third signal wiring pattern connects the first via conductor to the second via conductor.

Abstract: A sign is provided capable of increasing strength. A sign includes plural symbol portions arrayed in an array direction. Blank regions with an enclosed shape, and blank regions with an opened shape opening in the array direction, are formed inside the symbol portions. Reinforcement portions are provided at the blank regions. The symbol portions are coupled together by coupling portions, and the coupling portions are provided such that an array width direction position of the coupling portions coincides with an array width direction position of the reinforcement portions.

Abstract: A production method of a metallic decorative sheet (10) which is insert-molded integrally with a thermoplastic resin molded body (20) to constitute an insert molded body (1) has steps of: laminating a specular ink layer (12) on one surface of a transparent thermoplastic resin film (11) in a region except an edge region serving as an edge portion of the insert molded body (1) and in a region for displaying a metallic design on an outer surface of the insert molded body (1), and laminating a non-specular ink layer (13) on the specular ink layer (12) and on the surface of the transparent thermoplastic resin film (11) where the specular ink layer (12) is not laminated.

Abstract: A power source terminal and a ground terminal for a semiconductor integrated circuit are connected to a conductor pattern through a capacitor. The conductor pattern is connected, through a filter, to a plane conductor connected to neither a ground plane nor a power source plane. Thus, a common mode noise arising from between the power source and the ground is caused to flow into the plane conductor. This reduces the common mode noise flowing in the ground and the power source of the printed wiring board, which relatively act as antennas.

Abstract: In a printed wiring board including a first wiring layer and a second wiring layer provided via an insulator layer, at least three guard ground wirings extending along a pair of signal wirings provided in the first wiring layer and supplied with a ground potential are provided between the pair of signal wirings. Thus, crosstalk noise can be reduced without widening a wiring area between the pair of signal wirings.

Abstract: First and second signal wiring patterns are formed in a first conductor layer. A first electrode pad electrically connected to the first signal wiring pattern through a first via and a second electrode pad electrically connected to the second signal wiring pattern through a second via are formed in a second conductor layer as a surface layer. A third conductor layer is disposed between the first conductor layer and the second conductor layer with an insulator interposed between those conductor layers. A first pad electrically connected to the first via is formed in the third conductor layer. The first pad includes an opposed portion which overlaps the second electrode pad as viewed in a direction perpendicular to the surface of a printed board and which is opposed to the second electrode pad through intermediation of the insulator. This enables reduction of crosstalk noise caused between the signal wirings.

Abstract: A printed circuit board has a printed wiring board and a semiconductor package mounted on the printed wiring board. The printed wiring board and the semiconductor package are connected with a plurality of solder balls. An underfill material covering the plurality of solder balls is filled between the printed wiring board and the semiconductor package. The underfill material has a relative dielectric constant of 8.6 or more and 54.4 or less. Thus, crosstalk noise generated in wiring in the out-of-plane direction is reduced without increasing the mounting area.

Abstract: A sign is provided capable of increasing strength. A sign includes plural symbol portions arrayed in an array direction. Blank regions with an enclosed shape, and blank regions with an opened shape opening in the array direction, are formed inside the symbol portions. Reinforcement portions are provided at the blank regions. The symbol portions are coupled together by coupling portions, and the coupling portions are provided such that an array width direction position of the coupling portions coincides with an array width direction position of the reinforcement portions.

Abstract: Navigation devices, methods, and programs set a destination, find an on-street parking zone that is in the vicinity of the destination, and find a route, by modifying a search cost for a road, that will arrive at the destination by way of a road having the on-street parking zone. The devices, methods, and programs acquire parking information that pertains to the on-street parking zone and find the route by modifying the search cost based on the parking information. The devices, methods, and programs find the route when the vehicle has reached a specified distance from the destination.

Abstract: A printed wiring board includes a first conductive layer, a second conductive layer arranged at a gap with respective to the first conductive layer, a third conductive layer, a first via conductor and a second via conductor, and a third signal wiring pattern. A first signal wiring pattern is arranged on the first conductive layer, a second signal wiring pattern is arranged on the second conductive layer, and a third signal wiring pattern that is arranged on the third conductive layer. The third conductive layer is arranged between the first conductive layer and the second conductive layer via an insulating layer. The first via conductor and the second via conductor, which are arranged to be mutually adjacent, connect the first signal wiring pattern to the second signal wiring pattern. The third signal wiring pattern connects the first via conductor to the second via conductor.