Patents by Inventor Seiji Hidaka

Seiji Hidaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150012899
    Abstract: A method for deriving an equivalent circuit model of a capacitor which makes it possible to derive, with high accuracy and with ease, an equivalent circuit model having characteristics in accordance with a direct current voltage applied to a capacitor. Characteristic values of predetermined resistive elements and capacitive elements forming an equivalent circuit model of a capacitor change in response to a DC bias voltage being applied to the capacitor, and the change is attributable to the material of a dielectric forming the capacitor. However, by multiplying the characteristic values of the resistive elements and the capacitive elements held while the DC bias voltage is not applied by a dimensionless coefficient in accordance with an application rule, the characteristic values of the resistive elements and the capacitive elements are corrected to values in accordance with the voltage of the DC bias voltage applied to the capacitor.
    Type: Application
    Filed: September 19, 2014
    Publication date: January 8, 2015
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Seiji HIDAKA, Atsushi SAKURAGI
  • Patent number: 8521362
    Abstract: Stabilizer control devices, methods, and programs obtain information indicating lateral acceleration operating on the vehicle and obtain information indicating a curve section existing in a traveling direction of the vehicle. The devices, methods, and programs control roll stiffness by a stabilizer mounted on the vehicle based on the obtained lateral acceleration information by setting a lateral acceleration threshold at a first value in the curve section and a second value in a section other than the curve section respectively, the first value being smaller than the second value. The devices, methods, and programs control the roll stiffness when the lateral acceleration is equal to or larger than the lateral acceleration.
    Type: Grant
    Filed: September 26, 2008
    Date of Patent: August 27, 2013
    Assignees: Aisin AW Co., Ltd., Aisin Seiki Kabushiki Kaisha
    Inventors: Takayuki Miyajima, Seiji Hidaka, Hirofumi Nitta
  • Patent number: 8489279
    Abstract: A damping force control apparatus includes a damping force control device controlling a damping force of a shock absorber provided between a sprung mass and an unsprung mass of each wheel of a vehicle, a detection device detecting at least an acceleration of the sprung mass in an up-down direction and a relative displacement between the sprung mass and the unsprung mass, a damping coefficient calculation device calculating a damping coefficient to be applied to the damping force control by the damping force control device based on detected results of the detection device, a sensed acceleration increment calculation device calculating a sensed acceleration increment corresponding to an increment of sense according to the Weber Fechner law on the basis of the detected results of the detection device, and a modification device modifying the damping coefficient in accordance with a sensed acceleration increment calculated by the sensed acceleration increment calculation device.
    Type: Grant
    Filed: October 26, 2009
    Date of Patent: July 16, 2013
    Assignee: Aisin Seiki Kabushiki Kaisha
    Inventors: Seiji Hidaka, Akihito Yamamoto
  • Publication number: 20120046831
    Abstract: A first stabilizer (SBr) is disposed on an axle for driving wheels, a second stabilizer (SBf) is disposed on a different axle from the axle for driving wheels, a stabilizer control unit (RT, FT) is provided for adjusting torsional rigidity of the first stabilizer and second stabilizer, a turning state amount obtaining unit is provided for obtaining a turning state amount of the vehicle, and an accelerating operation amount obtaining unit is provided for obtaining an accelerating operation amount operated by a vehicle driver. Based on these obtained results, the torsional rigidity of at least one of the first stabilizer and second stabilizer is adjusted by the stabilizer control unit, when the turning state amount of the vehicle is equal to or more than a predetermined turning state amount, and the accelerating operation amount is equal to or more than a predetermined accelerating operation amount.
    Type: Application
    Filed: March 26, 2010
    Publication date: February 23, 2012
    Applicants: ADVICS CO., LTD., AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Seiji Hidaka, Yoshiyuki Yasui, Keita Nakano, Chihiro Nitta
  • Publication number: 20100102521
    Abstract: A roll rigidity controlling apparatus includes a positional information obtaining means for obtaining a positional information of a vehicle, a gradient information obtaining means for obtaining a gradient information relating to a gradient of a road existing ahead of the vehicle, and a roll rigidity distribution changing means for changing a roll rigidity distribution ratio between a front portion and a rear portion of the vehicle on the basis of the positional information obtained by the positional information obtaining means and the gradient information obtained by the gradient information obtaining means before the vehicle reaches a point at which the gradient of the road changes.
    Type: Application
    Filed: October 27, 2009
    Publication date: April 29, 2010
    Applicants: AISIN SEIKI KABUSHIKI KAISHA, AISIN AW CO., LTD.
    Inventors: Seiji HIDAKA, Takayuki Miyajima
  • Publication number: 20100106368
    Abstract: A damping force control apparatus includes a damping force control device controlling a damping force of a shock absorber provided between a sprung mass and an unsprung mass of each wheel of a vehicle, a detection device detecting at least an acceleration of the sprung mass in an up-down direction and a relative displacement between the sprung mass and the unsprung mass, a damping coefficient calculation device calculating a damping coefficient to be applied to the damping force control by the damping force control device based on detected results of the detection device, a sensed acceleration increment calculation device calculating a sensed acceleration increment corresponding to an increment of sense according to the Weber Fechner law on the basis of the detected results of the detection device, and a modification device modifying the damping coefficient in accordance with a sensed acceleration increment calculated by the sensed acceleration increment calculation device.
    Type: Application
    Filed: October 26, 2009
    Publication date: April 29, 2010
    Applicant: AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Seiji HIDAKA, Akihito Yamamoto
  • Patent number: 7538638
    Abstract: A resonator, a filter, and a communication apparatus that can be easily miniaturized even if the resonant frequency is relatively low are provided. Conductor layers are laminated in the state in which they are partially insulated from each other by a dielectric layer. Conductor openings free from any conductor layer in the laminate direction serve as inductive areas, and the portion where the conductor layers oppose each other with the dielectric layer therebetween serves as a capacitive area CA. With this configuration, the resulting resonator serves as a stepped-impedance-structured slot resonator. By increasing the impedance step ratio of the capacitive area to the inductive areas according to this structure, the resonator is miniaturized. Additionally, the conductor loss of the resonator is reduced by suppressing the intrusion of magnetic field energy to the capacitive area. It is thus possible to obtain a small resonator having high Qo.
    Type: Grant
    Filed: March 10, 2004
    Date of Patent: May 26, 2009
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Seiji Hidaka, Shin Abe
  • Publication number: 20090112401
    Abstract: Stabilizer control devices, methods, and programs obtain information indicating lateral acceleration operating on the vehicle and obtain information indicating a curve section existing in a traveling direction of the vehicle. The devices, methods, and programs control roll stiffness by a stabilizer mounted on the vehicle based on the obtained lateral acceleration information by setting a lateral acceleration threshold at a first value in the curve section and a second value in a section other than the curve section respectively, the first value being smaller than the second value. The devices, methods, and programs control the roll stiffness when the lateral acceleration is equal to or larger than the lateral acceleration.
    Type: Application
    Filed: September 26, 2008
    Publication date: April 30, 2009
    Applicants: AISIN AW CO., LTD., AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Takayuki Miyajima, Seiji Hidaka, Hirofumi Nitta
  • Patent number: 7492243
    Abstract: A planar circuit having a conductive film on either main surface of a substrate. The conductive film on one of the main surfaces is patterned with two-dimensionally and repeatedly arranged unit cells, which are basic conductor patterns. Each of the unit cells has a capacitive region at the center thereof. Capacitance is induced between the center area and the conductor film formed on the main surface of the substrate opposite the center area. An area located near the middle of each of sides in the peripheral portion serves as an inductive region. In any two adjacent unit cells, the inductive regions have a multiple spiral-shaped conductor pattern, in which the center ends thereof are connected to each other at a halfway position between the two unit cells, and the outer peripheral ends thereof are connected to the capacitive regions.
    Type: Grant
    Filed: October 5, 2007
    Date of Patent: February 17, 2009
    Assignee: Murata Manufacturing Co., Ltd
    Inventors: Seiji Hidaka, Shigeyuki Mikami
  • Patent number: 7471173
    Abstract: A dielectric substrate is provided with first and second conductor openings communicating with each other via a first slit, and third and fourth conductor openings communicating with each other via a second slit, and the slits intersect each other. With this structure, two resonant modes including an even mode in which magnetic field vectors are directed from the first to third conductor openings and from the fourth to second conductor openings, and an odd mode in which magnetic field vectors are directed from the third to second conductor openings and from the first to fourth conductor openings, or two resonant modes including an X mode in which magnetic field vectors are directed from the first to second conductor openings, and a Y mode in which magnetic field vectors are directed from the third to fourth conductor openings are generated.
    Type: Grant
    Filed: August 26, 2004
    Date of Patent: December 30, 2008
    Assignee: Murata Manufacturing Co., Ltd
    Inventors: Seiji Hidaka, Hiromu Tokudera, Kei Matsutani
  • Publication number: 20080262690
    Abstract: An integrated vehicle body attitude control apparatus includes a detecting portion detecting a vehicle state including a vehicle speed and a steering state, an integrated vehicle body control model calculation portion setting a model rotation axis of a vehicle body and calculating an integrated vehicle body control model including a model value, a distribution controller combining pitch components, heave components and roll components calculated by a first calculator and a second calculator, distributing a combined resultant of the pitch components and the heave components for controlling damping force by the shock absorber controller and distributing a combined resultant of the roll components for controlling the torsional force by the stabilizer controller, and an actuation controller controlling actuation of a shock absorber and a stabilizer in response to a distribution result by the distribution controller.
    Type: Application
    Filed: April 22, 2008
    Publication date: October 23, 2008
    Applicant: AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Seiji Hidaka, Wataru Tanaka
  • Patent number: 7365618
    Abstract: A high-frequency circuit device, a high-frequency module, and a communication apparatus, which prevent generation of an undesired wave to prevent electrical power loss and undesired coupling, are provided. The high-frequency circuit device includes a first slot line and a second slot line, which are provided at respective surfaces of a dielectric substrate, are formed with the same shape. An FET is provided on the first slot line. For preventing the mounting of the FET from causing a phase difference to occur between a high-frequency signal, which propagates along the first slot line, and a high-frequency signal, which propagates along the second slot line, a phase-adjusting stub is formed at a position of a stub at the second slot line. The phase is adjusted by changing the length of the stub.
    Type: Grant
    Filed: July 31, 2007
    Date of Patent: April 29, 2008
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kazutaka Mukaiyama, Seiji Hidaka, Koichi Takizawa, Koichi Sakamoto
  • Publication number: 20080088391
    Abstract: A planar circuit having a conductive film on either main surface of a substrate. The conductive film on one of the main surfaces is patterned with two-dimensionally and repeatedly arranged unit cells, which are basic conductor patterns. Each of the unit cells has a capacitive region at the center thereof. Capacitance is induced between the center area and the conductor film formed on the main surface of the substrate opposite the center area. An area located near the middle of each of sides in the peripheral portion serves as an inductive region. In any two adjacent unit cells, the inductive regions have a multiple spiral-shaped conductor pattern, in which the center ends thereof are connected to each other at a halfway position between the two unit cells, and the outer peripheral ends thereof are connected to the capacitive regions.
    Type: Application
    Filed: October 5, 2007
    Publication date: April 17, 2008
    Inventors: Seiji Hidaka, Shigeyuki Mikami
  • Publication number: 20070285190
    Abstract: A high-frequency circuit device, a high-frequency module, and a communication apparatus, which prevent generation of an undesired wave to prevent electrical power loss and undesired coupling, are provided. The high-frequency circuit device includes a first slot line and a second slot line, which are provided at respective surfaces of a dielectric substrate, are formed with the same shape. An FET is provided on the first slot line. For preventing the mounting of the FET from causing a phase difference to occur between a high-frequency signal, which propagates along the first slot line, and a high-frequency signal, which propagates along the second slot line, a phase-adjusting stub is formed at a position of a stub at the second slot line. The phase is adjusted by changing the length of the stub.
    Type: Application
    Filed: July 31, 2007
    Publication date: December 13, 2007
    Inventors: Kazutaka Mukaiyama, Seiji Hidaka, Koichi Takizawa, Koichi Sakamoto
  • Publication number: 20070080761
    Abstract: A dielectric substrate is provided with first and second conductor openings communicating with each other via a first slit, and third and fourth conductor openings communicating with each other via a second slit, and the slits intersect each other. With this structure two resonant modes including an even mode in which magnetic field vectors are directed from the first to third conductor openings and from the fourth to second conductor openings, and an odd mode in which magnetic field vectors are directed from the third to second conductor openings and from the first to fourth conductor openings, or two resonant modes including an X mode in which magnetic field vectors are directed from the first to second conductor openings, and a Y mode in which magnetic field vectors are directed from the third to fourth conductor openings are generated.
    Type: Application
    Filed: August 26, 2004
    Publication date: April 12, 2007
    Inventors: Seiji Hidaka, Hiromu Tokudera, Kei Matsutani
  • Publication number: 20070013465
    Abstract: A resonator, a filter, and a communication apparatus that can be easily miniaturized even if the resonant frequency is relatively low are provided. Conductor layers are laminated in the state in which they are partially insulated from each other by a dielectric layer. Conductor openings free from any conductor layer in the laminate direction serve as inductive areas, and the portion where the conductor layers oppose each other with the dielectric layer therebetween serves as a capacitive area CA. With this configuration, the resulting resonator serves as a stepped-impedance-structured slot resonator. By increasing the impedance step ratio of the capacitive area to the inductive areas according to this structure, the resonator is miniaturized. Additionally, the conductor loss of the resonator is reduced by suppressing the intrusion of magnetic field energy to the capacitive area. It is thus possible to obtain a small resonator having high Qo.
    Type: Application
    Filed: March 10, 2004
    Publication date: January 18, 2007
    Inventors: Seiji Hidaka, Shin Abe
  • Patent number: 7113058
    Abstract: A conductive film is provided on a dielectric substrate. The conductive film has conductor opening portions, which serve as inductive regions, and a conductor opening portion, which serves as a capacitive region. Multi-step ring resonator elements, each including a conductor line aggregate, are provided on respective substrates to configure resonator elements. The resonator elements are mounted above the conductor opening portions that serve as the inductive regions. This arrangement provides a resonator having a high Qo.
    Type: Grant
    Filed: August 31, 2005
    Date of Patent: September 26, 2006
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Seiji Hidaka, Shin Abe
  • Patent number: 7095301
    Abstract: A resonator device including a plurality of resonance units formed on a dielectric substrate, each resonance unit having a plurality of conductor lines forming a capacitive area and an inductive area in a ring shape.
    Type: Grant
    Filed: June 2, 2004
    Date of Patent: August 22, 2006
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Seiji Hidaka, Shin Abe
  • Publication number: 20060049897
    Abstract: A conductive film is provided on a dielectric substrate. The conductive film has conductor opening portions, which serve as inductive regions, and a conductor opening portion, which serves as a capacitive region. Multi-step ring resonator elements, each including a conductor line aggregate, are provided on respective substrates to configure resonator elements. The resonator elements are mounted above the conductor opening portions that serve as the inductive regions. This arrangement provides a resonator having a high Qo.
    Type: Application
    Filed: August 31, 2005
    Publication date: March 9, 2006
    Inventors: Seiji Hidaka, Shin Abe
  • Patent number: 6972645
    Abstract: A conductive film is provided on a dielectric substrate. The conductive film has conductor opening portions, which serve as inductive regions, and a conductor opening portion, which serves as a capacitive region. Multi-step ring resonator elements, each including a conductor line aggregate, are provided on respective substrates to configure resonator elements. The resonator elements are mounted above the conductor opening portions that serve as the inductive regions. This arrangement provides a resonator having a high Qo.
    Type: Grant
    Filed: April 1, 2004
    Date of Patent: December 6, 2005
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Seiji Hidaka, Shin Abe