Patents by Inventor Seiji Inaoka

Seiji Inaoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for depositing electrically conducting polymer films via electrochemical deposition of precursor polymers
    Publication number: 20020011420
    Abstract: A method for depositing an electrically conducting film on an electrode and the film resulting from that method. An electrically conducting film according to the present invention is deposited by immersing the electrode in a solution of a precursor polymer in a predetermined solvent. The precursor polymer includes a plurality of electrochemical polymerizable monomers. Each monomer has first and second polymer-forming active sites that can be joined by electrochemical polymerization and third and fourth polymer-forming active sites that can be joined chemically in solution. The precursor polymer is constructed from the monomers joined by the third and fourth polymer-forming active sites. The precursor polymer is soluble in the solvent whereas a polymer formed by electrochemical polymerization of the first and second polymer-forming active sites is insoluble in the solvent.
    Type: Application
    Filed: September 11, 2001
    Publication date: January 31, 2002
    Inventors: Daniel B. Roitman, Seiji Inaoka, Riogoberto C. Advincula
  • Method for depositing electrically conducting polymer films via electrochemical deposition of precursor polymers
    Patent number: 6294245
    Abstract: A method for depositing an electrically conducting film on an electrode and the film resulting from that method. An electrically conducting film according to the present invention is deposited by immersing the electrode in a solution of a precursor polymer in a predetermined solvent. The precursor polymer includes a plurality of electrochemical polymerizable monomers. Each monomer has first and second polymer-forming active sites that can be joined by electrochemical polymerization and third and fourth polymer-forming active sites that can be joined chemically in solution. The precursor polymer is constructed from the monomers joined by the third and fourth polymer-forming active sites. The precursor polymer is soluble in the solvent whereas a polymer formed by electrochemical polymerization of the first and second polymer-forming active sites is insoluble in the solvent.
    Type: Grant
    Filed: September 22, 1999
    Date of Patent: September 25, 2001
    Assignee: Agilent Technologies, Inc.
    Inventors: Daniel B. Roitman, Seiji Inaoka, Riogoberto C. Advincula
  • Electrical connector
    Patent number: 5380225
    Abstract: A connector includes a jack and a plug having corresponding staggered contacts formed by alternating projections and recesses which permits the connector to have a higher contact density than conventional connectors.
    Type: Grant
    Filed: July 7, 1993
    Date of Patent: January 10, 1995
    Assignee: Minnesota Mining and Manufacturing Company
    Inventor: Seiji Inaoka