Patents by Inventor Seiji Ishikawa
Seiji Ishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7945410Abstract: An average fault ratio is calculated from product characteristics of a product as a target of yield prediction, in order to predict yield accurately in the course of manufacturing the prediction target product. With respect to a reference product, whose wiring pattern is different from the prediction target product but manufactured by the same manufacturing process, a monthly electric fault density is calculated from actually measured data. Respective average fault ratios are obtained from product characteristics of the prediction target product and the reference product. A monthly electric fault density of the prediction target product is obtained by multiplying the monthly electric fault density of the reference product by the ratio of the average fault ratios. The yield is calculated by using the monthly electric fault density of the month in which a yield prediction target lot of the prediction target product was processed.Type: GrantFiled: August 9, 2007Date of Patent: May 17, 2011Assignee: Hitachi, Ltd.Inventors: Natsuyo Morioka, Seiji Ishikawa, Katsumi Ikegaya, Yasunori Yamaguchi, Kazuo Ito, Yuichi Hamamura
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Publication number: 20100307245Abstract: The present invention provides, in a physical quantity measuring system using a vibrator, a supporting structure of a vibrator for reducing the zero-point temperature drift of detection signal. It is provided a supporting member for supporting a vibrator with bonding wires. The supporting member has a supporting plate with an opening formed therein to be positioned direct under a vibrator, and a bonding wire comprising a bonding end to be bonded with the vibrator, a fixed portion fixed on the supporting plate and a bent portion direct under the opening. A distance “L1” between the bent portion and a position where the bonding wire starts to protrude from the supporting plate is 10 percent or more of a distance “L2” of the bent portion and the bonding end.Type: ApplicationFiled: July 21, 2010Publication date: December 9, 2010Applicant: Seiko Epson CorporationInventors: Seiji ISHIKAWA, Takayuki Kikuchi, Shigeki Hayashi
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Patent number: 7788978Abstract: The present invention provides, in a physical quantity measuring system using a vibrator, a supporting structure of a vibrator for reducing the zero-point temperature drift of detection signal. It is provided a supporting member for supporting a vibrator with bonding wires. The supporting member has a supporting plate with an opening formed therein to be positioned direct under a vibrator, and a bonding wire comprising a bonding end to be bonded with the vibrator, a fixed portion fixed on the supporting plate and a bent portion direct under the opening. A distance “L1” between the bent portion and a position where the bonding wire starts to protrude from the supporting plate is 10 percent or more of a distance “L2” of the bent portion and the bonding end.Type: GrantFiled: October 28, 2008Date of Patent: September 7, 2010Assignee: Seiko Epson CorporationInventors: Seiji Ishikawa, Takayuki Kikuchi, Shigeki Hayashi
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Patent number: 7736406Abstract: A vacuum cleaner includes a main body accommodating therein an electric blower and a dust-removal driving body; and a filter unit including a frame body where a filter for collecting dust particles is installed and a dust removing plate provided at a downstream side of the filter, one end of the dust removing plate being fixed at the frame body. The other end of the dust removing plate is struck in an air flow direction by means related with driving the dust-removal driving body, thereby transmitting an impact on the frame body with a repulsive force thereof.Type: GrantFiled: July 29, 2005Date of Patent: June 15, 2010Assignee: Panasonic CorporationInventors: Yoshiki Kuroki, Hideaki Sakatani, Seiji Ishikawa, Atsushi Kitai
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Publication number: 20090262319Abstract: A maskless exposure method of drawing a circuit pattern includes: moving a substrate with respect to a projection optical system; scanning, by the projection optical system, the substrate in a first direction; shifting a scanning region in a second direction; scanning the substrate in the first direction so that an overlapping part is formed. A plurality of marks different from the circuit pattern are exposed in a vicinity of the overlapping part. The plurality of marks are a set of marks at least including two marks disposed on one side of the overlapping part and two marks disposed on another side of the overlapping part. Deviations between the pair of the scanning regions, an inclination of exposing light, and a yawing angle of a stage are analyzed by measuring deviations of distances among the plurality of marks. Calibration data are obtained from a result of the analyzing.Type: ApplicationFiled: February 23, 2009Publication date: October 22, 2009Inventors: Hiroyasu Matsuura, Seiji Ishikawa, Tadamichi Wachi, Toshimasa Ishigaki
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Publication number: 20090165908Abstract: A pneumatic tire is provided which has sufficient total properties and mass productivity of a tire without reducing drainage capability due to narrowed circumferential grooves, achieves high design flexibility of tread patterns and stiffness of land portion as intended, and also effectively reduces undesired air column resonance noise produced by the circumferential grooves. The pneumatic tire includes a circumferential groove 3 which continuously and circumferentially extends in a straight line and arranged on a tread 1, and resonators 5 which are open to the circumferential groove 3 and terminate in a land portion 4, each of the resonators 5 being configured with an air chamber 6 open toward a land portion surface, and a narrowed neck 7 for communication between the air chamber 6 and the circumferential groove 3, and the narrowed neck 7 has the plane maximum width w0 which is within a range of from 3 to 50% of the plane maximum width w1 of the air chamber 6.Type: ApplicationFiled: April 2, 2007Publication date: July 2, 2009Applicant: BRIDGESTONE CORPORATIONInventors: Fumio Takahashi, Seiji Ishikawa
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Publication number: 20090165909Abstract: In a pneumatic tire provided on a groove surface with at least one main groove continuously extending in the circumferential direction of the tire, the air column resonance noise is effectively reduced without reducing the volume of the main groove, and the design flexibility is enhanced in consideration of the entire property of the tire. A pneumatic tire of the present invention is provided on a tread surface 1 with a main groove 2 continuously extending in the circumferential direction of the tire and a sub groove 4 having two ends open to the common main groove 2 and a portion between the ends deviously extending in a common land portion, and characterized in that the sub groove 4 is configured to extend to be entirely included in a ground contact area of the tread when the tire mounted to an applicable rim is inflated with the maximum air pressure and is postured to be applied by a load corresponding to 80% of a defined mass.Type: ApplicationFiled: March 30, 2007Publication date: July 2, 2009Applicant: BRIDGESTONE CORPORATIONInventors: Fumio Takahashi, Seiji Ishikawa
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Publication number: 20090092748Abstract: A process for packaging an electronic device employs an insulating protective resin layer produced from one or more of the resin compositions: (1) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.5 to 30 parts of an epoxy compound having an epoxy equivalent of more than 800, and an organic solvent, (2) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 10 parts of an epoxy compound having an epoxy equivalent of 100 to 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent; and (3) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 20 parts of an epoxy compound having an epoxy equivalent of more than 800, 2 to 30 parts of a polyvalent isocyanate compound, and an organic solvent.Type: ApplicationFiled: December 8, 2008Publication date: April 9, 2009Applicant: UBE INDUSTRIES, LTD.Inventors: Masahiro NAIKI, Masayuki KINOUCHI, Seiji ISHIKAWA, Yuji Matsui, Yoshiki TANAKA
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Publication number: 20090072672Abstract: The present invention provides, in a physical quantity measuring system using a vibrator, a supporting structure of a vibrator for reducing the zero-point temperature drift of detection signal. It is provided a supporting member for supporting a vibrator with bonding wires. The supporting member has a supporting plate with an opening formed therein to be positioned direct under a vibrator, and a bonding wire comprising a bonding end to be bonded with the vibrator, a fixed portion fixed on the supporting plate and a bent portion direct under the opening. A distance “L1” between the bent portion and a position where the bonding wire starts to protrude from the supporting plate is 10 percent or more of a distance “L2” of the bent portion and the bonding end.Type: ApplicationFiled: October 28, 2008Publication date: March 19, 2009Applicant: Seiko Epson CorporationInventors: Seiji Ishikawa, Takayuki KIKUCHI, Shigeki HAYASHI
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Patent number: 7456554Abstract: The present invention provides, in a physical quantity measuring system using a vibrator, a supporting structure of a vibrator for reducing the zero-point temperature drift of detection signal. It is provided a supporting member 22 for supporting a vibrator 1A with bonding wires 26. The supporting member 22 has a supporting plate 40 with an opening 25 formed therein to be positioned direct under a vibrator 1A, and a bonding wire 26 comprising a bonding end 29 to be bonded with the vibrator 1A, a fixed portion 26a fixed on the supporting plate 40 and a bent portion 28 direct under the opening 25. A distance “L1” between the bent portion 28 and a position 39 where the bonding wire 26 starts to protrude from the supporting plate 40 is 10 percent or more of a distance “L2” of the bent portion 28 and the bonding end 29.Type: GrantFiled: May 9, 2006Date of Patent: November 25, 2008Assignee: Seiko Epson CorporationInventors: Seiji Ishikawa, Takayuki Kikuchi, Shigeki Hayashi
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Publication number: 20080241486Abstract: Direct exposure equipment having a multiple heads generally conducts overlapping exposure at an exposure area boundary between the heads. In such a case, if the heads are misaligned, a flaw will occur in a pattern shape at an area that is subject to overlapping exposure. To overcome this, TEGs are disposed for evaluating line width and resistance at an overlapping exposure area between the exposure heads and at a returning exposure area formed when direct exposure equipment having a multi-head configuration exposes a substrate. By examining measured values from these TEGs, a misalignment in the multiple exposure heads is detected.Type: ApplicationFiled: March 26, 2008Publication date: October 2, 2008Inventors: Seiji Ishikawa, Hiroyasu Matsuura, Yuichi Hamamura, Tadamichi Wachi
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Publication number: 20080176478Abstract: An exposure method that suppresses distribution of pattern shapes at the time of exposure. In a manufacturing method for a display unit, a layer forming a reference for pattern arrangement is determined among layers formed on a panel. An arrangement of a pattern in a layer above the reference layer is determined using a value obtained from distribution of the pattern arrangement in the reference layer.Type: ApplicationFiled: January 17, 2008Publication date: July 24, 2008Inventors: Seiji ISHIKAWA, Jun Ooida, Yoshinori Muramatsu, Takahiro Miyazaki
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Publication number: 20080140330Abstract: An average fault ratio is calculated from product characteristics of a product as a target of yield prediction, in order to predict yield accurately in the course of manufacturing the prediction target product. With respect to a reference product, whose wiring pattern is different from the prediction target product but manufactured by the same manufacturing process, a monthly electric fault density is calculated from actually measured data. Respective average fault ratios are obtained from product characteristics of the prediction target product and the reference product. A monthly electric fault density of the prediction target product is obtained by multiplying the monthly electric fault density of the reference product by the ratio of the average fault ratios. The yield is calculated by using the monthly electric fault density of the month in which a yield prediction target lot of the prediction target product was processed.Type: ApplicationFiled: August 9, 2007Publication date: June 12, 2008Inventors: Natsuyo Morioka, Seiji Ishikawa, Katsumi Ikegaya, Yasunori Yamaguchi, Kazuo Ito, Yuichi Hamamura
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Publication number: 20080090501Abstract: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.Type: ApplicationFiled: October 31, 2007Publication date: April 17, 2008Inventors: Katsuya Okumura, Riichirou Aoki, Hiromi Yajima, Seiji Ishikawa, Manabu Tsujimura
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Publication number: 20070247937Abstract: An information processing system of the invention has a database in which test results for a plurality of memory devices mounted on a wafer are stored and a computer for analyzing the test results. The computer includes a data retrieval section for retrieving a test result from the database; and a required redundant line quantity calculation section for determining the total number of redundant lines which is required for recovering failed bits of the memory device based on the test results, deciding how the required total number of redundant lines should be assigned in each of the row and column directions, and calculating the total number of redundant lines required for recovery and the number of redundant lines assigned in each of the row and columns directions on the memory device, and the computer displays a result of calculation by the required redundant line quantity calculation section.Type: ApplicationFiled: April 17, 2007Publication date: October 25, 2007Applicant: ELPIDA MEMORY, INC.Inventors: Ichiro Moriyama, Seiji Ishikawa
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Patent number: 7150386Abstract: An object of the present invention is to provide a novel system for supporting a vibrator having a terminal for electrical connection so that the vibrator may be miniaturized and the deviation of vibration property among vibrators mounted on the supporting systems may be prevented. The supporting system has a substrate 11 and bonding wires 9, 10 supported on the substrate 11 and to be joined with a vibrator 1. The vibrator 1 is supported with the bonding wires 9, 10 so that the vibrator 1 does not directly contact the substrate 11 and bonding wires 9, 10 are electrically connected with a terminal 6 of the vibrator 1.Type: GrantFiled: January 17, 2003Date of Patent: December 19, 2006Assignee: NGK Insulators, Ltd.Inventors: Seiji Ishikawa, Takayuki Kikuchi
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Patent number: 7148609Abstract: An object of the present invention is to provide a novel structure of supporting a vibrator having a terminal for electrical connection so that the vibrator can be miniaturized, and the driving impedance can be made constant in a wide temperature range to reduce the temperature drift. The structure has a substrate and bonding wires 45, 46 supported on the surface of the substrate and to be connected with the vibrator. The vibrator is supported with the bonding wire so that the vibrator is not directly contacted with the substrate. The bonding wire is electrically connected with the terminal. The resonance frequency “fr” of the supporting structure, the driving frequency “fd” for the vibrator and the detuning “?f” satisfy the following formula 1.1·?f?fr?0.9·fd.Type: GrantFiled: May 10, 2004Date of Patent: December 12, 2006Assignee: NGK Insulators, Ltd.Inventors: Seiji Ishikawa, Makoto Tani, Shigeki Hayashi
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Publication number: 20060267458Abstract: The present invention provides, in a physical quantity measuring system using a vibrator, a supporting structure of a vibrator for reducing the zero-point temperature drift of detection signal. It is provided a supporting member 22 for supporting a vibrator 1A with bonding wires 26. The supporting member 22 has a supporting plate 40 with an opening 25 formed therein to be positioned direct under a vibrator 1A, and a bonding wire 26 comprising a bonding end 29 to be bonded with the vibrator 1A, a fixed portion 26a fixed on the supporting plate 40 and a bent portion 28 direct under the opening 25. A distance “L1” between the bent portion 28 and a position 39 where the bonding wire 26 starts to protrude from the supporting plate 40 is 10 percent or more of a distance “L2” of the bent portion 28 and the bonding end 29.Type: ApplicationFiled: May 9, 2006Publication date: November 30, 2006Applicant: NGK Insulators, Ltd.Inventors: Seiji Ishikawa, Takayuki Kikuchi, Shigeki Hayashi
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Patent number: 7140255Abstract: A device 1 for measuring a mass comprises a vibrator 2, driving means 3A, 3B, 3C, 3D for exciting a basic vibration in the vibrator 2, detecting means 4A, 4B for detecting a displacement of vibration in the vibrator 2 and an adsorption film 5 capable of adsorbing a substance for detection. The mass is measured based on a difference between a detected value of the displacement of vibration obtained from the detecting means 4A, 4B when the mass is not measured and a detected value of the displacement of vibration obtained from the detecting means 4A, 4B when the mass is measured.Type: GrantFiled: August 13, 2004Date of Patent: November 28, 2006Assignee: NGK Insulators, Ltd.Inventors: Yukihisa Ohsugi, Naotake Okada, Seiji Ishikawa
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Patent number: RE39262Abstract: A polishing apparatus includes a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and pressing the workpiece against the abrasive cloth under a predetermined pressure. The turntable and the top ring are movable relatively to each other to polish a surface of the workpiece supported by the top ring with the abrasive cloth. The abrasive cloth has a projecting region on a surface thereof for more intensive contact with the workpiece than other surface regions of the abrasive cloth. The projecting region has a smaller dimension in a radial direction of the turntable than a diameter of the workpiece when the projecting region is held in contact with the workpiece. A position of the projection region is determined on the basis of an area in which the projecting region acts on the workpiece.Type: GrantFiled: February 28, 2002Date of Patent: September 5, 2006Assignee: Ebara CorporationInventors: Masayoshi Hirose, Yoshimi Sasaki, Akira Ogata, Seiji Ishikawa, Tamami Takahashi, Hirokuni Hiyama, Yutaka Wada