Patents by Inventor Seiji Ishikawa

Seiji Ishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6529619
    Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: March 4, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Seiji Ishikawa, Masao Sakata, Jun Nakazato, Sadao Shimoyashiro, Hiroto Nagatomo, Yuzo Taniguchi, Osamu Satou, Tsutomu Okabe, Yuzaburo Sakamoto, Kimio Muramatsu, Kazuhiko Matsuoka, Taizo Hashimoto, Yuichi Ohyama, Yutaka Ebara, Isao Miyazaki, Shuichi Hanashima
  • Patent number: 6520273
    Abstract: In the case where internal temperature of fuel cells 40 has not reached a stationary level (step S26), a control unit 100 disconnects a secondary battery 60 from an inverter 70 (step S28) and controls the drive of a motor 80 (step S30), in order to cause the motor 80 to consume electric power supplied from the fuel cells 40 while the inverter 70 functions to prevent any torque from being produced at a drive shaft 82 of the motor 80. Such control enables the internal temperature of the fuel cells to be raised to the stationary level in a shortest possible time at the time of activating the fuel cells.
    Type: Grant
    Filed: November 14, 2000
    Date of Patent: February 18, 2003
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventor: Seiji Ishikawa
  • Publication number: 20030028994
    Abstract: A vacuum cleaner includes a main body having an electric blower for generating a suction air flow, a dirt collecting case for centrifugally separating and collecting dirt, and a compression assembly for compressing dirt collected in the dirt collecting case to reduce a volume thereof. The dirt collecting case has a separation chamber for centrifugally separating dirt from the dirt containing air and a dirt collecting chamber in communication with the separation chamber for accumulating the dirt separated by the separation chamber. The compression assembly has a first air intake member provided in the separation chamber and communicating with the electric blower, a second air intake member provided in the dirt collecting chamber and communicating with the electric blower, a shielding plate for selectively opening the first and the second air intake member and an actuator for driving the shielding plate.
    Type: Application
    Filed: August 8, 2002
    Publication date: February 13, 2003
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hidenori Kitamura, Saburo Kajikawa, Masakazu Onda, Seiji Ishikawa, Yasunori Tsuzaki, Masashi Okushima, Tetsuharu Nomachi, Koji Yamamura, Hirokazu Nagaoka
  • Patent number: 6468639
    Abstract: A single-application polyimidosiloxane coating material comprising a uniformly mixed solution composition of a polyimidosiloxane with an epoxy resin-reactive group in the molecule, an epoxy resin and a fine inorganic filler in a solvent. The coating material has satisfactory storage stability and printing properties, and its cured films also have satisfactory properties and allow single-application printing.
    Type: Grant
    Filed: April 21, 1999
    Date of Patent: October 22, 2002
    Assignee: Ube Industries, Ltd.
    Inventors: Seiji Ishikawa, Shigeru Yamamoto, Yoshiaki Watanabe
  • Patent number: 6461738
    Abstract: A polyimide-based insulating film composition comprising (a) 100 parts by weight of an organic solvent-soluble polyimidosiloxane obtained from a tetracarboxylic acid component and a diamine component comprising 45 to 90 mole percent of a diaminopolysiloxane represented by the following general formula (1): H2N—R1—[Si(R2)2—O—]n1—Si(R2)2—R1—NH2  (1) 0.5 to 40 mole percent of a polar group-containing aromatic diamine and 0 to 50 mole percent of an aromatic diamine with plural benzene rings, (b) 2 to 40 parts by weight of a polyvalent isocyanate and (c) an organic solvent. The composition has satisfactory storage stability and printing properties, while its cured films exhibit solvent resistance, with both heat resistance and flex resistance.
    Type: Grant
    Filed: February 23, 2001
    Date of Patent: October 8, 2002
    Assignee: Ube Industries, Inc.
    Inventors: Seiji Ishikawa, Musubu Ichikawa
  • Patent number: 6443808
    Abstract: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: September 3, 2002
    Assignees: Kabushiki Kaisha Toshiba, Ebara Corporation
    Inventors: Katsuya Okumura, Riichirou Aoki, Hiromi Yajima, Seiji Ishikawa, Manabu Tsujimura
  • Patent number: 6439971
    Abstract: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: August 27, 2002
    Assignees: Kabushiki Kaisha Toshiba, Ebara Corporation
    Inventors: Katsuya Okumura, Riichirou Aoki, Hiromi Yajima, Seiji Ishikawa, Manabu Tsujimura
  • Patent number: 6425806
    Abstract: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: July 30, 2002
    Assignees: Kabushiki Kaisha Toshiba, Ebara Corporation
    Inventors: Katsuya Okumura, Riichirou Aoki, Hiromi Yajima, Seiji Ishikawa, Manabu Tsujimura
  • Publication number: 20020076548
    Abstract: A single-application polyimidosiloxane coating material comprising a uniformly mixed solution composition of a polyimidosiloxane with an epoxy resin-reactive group in the molecule, an epoxy resin and a fine inorganic filler in a solvent. The coating material has satisfactory storage stability and printing properties, and its cured films also have satisfactory properties and allow single-application printing.
    Type: Application
    Filed: April 21, 1999
    Publication date: June 20, 2002
    Inventors: SEIJI ISHIKAWA, SHIGERU YAMAMOTO, YOSHIAKI WATANABE
  • Patent number: 6407768
    Abstract: A video microscope having an observation stand whose position is fixed relative to an object, a lens body tube having a lens system arranged at one end thereof along an imaging optical path with respect to the object and that is inserted into the observation stand so as to movable in the optical axis direction, a video signal converting section tube that has an image pick-up element arranged at a predetermined position that corresponds to the lens system, and movable in the optical axis direction relative to the observation stand and movable relative to the lens body tube. The video microscope further includes an object distance adjustment drive motor that moves the lens body tube in the optical axis direction by driving an object distance adjusting mechanism and an objective distance position detecting system.
    Type: Grant
    Filed: June 29, 1999
    Date of Patent: June 18, 2002
    Inventor: Seiji Ishikawa
  • Patent number: 6404911
    Abstract: A semiconductor failure analysis system and method therefor facilitated by a failure information collection unit for collection, by bit, failure information of a semiconductor, an inspection unit for examining relations between various types of inspection data obtained by inspection of the semiconductor and for examining relations between the inspection data and failure information, a storage unit for storing design information of the semiconductor, an analysis unit for analyzing the failure information from the failure information collection unit, from the inspection unit and design information stored in the storage unit, a display unit for displaying at least one of the result of analysis from the analysis unit and the failure information, a failure cause estimation unit for estimating a cause of the failure information, and a unit for feeding the estimated cause of the failure information back to a process in which the failure has occurred.
    Type: Grant
    Filed: December 8, 2000
    Date of Patent: June 11, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Kazuko Ishihara, Seiji Ishikawa, Masao Sakata, Isao Miyazaki, Yoshiyuki Miyamoto, Jun Nakazato
  • Publication number: 20020046604
    Abstract: An angular velocity measuring apparatus for detecting an angular velocity of a rotation about a rotation axis including a vibration element, a semiconductor integrated circuit chip for processing signals supplied to and from the vibration element and a circuit board on which the semiconductor integrated circuit chip is mounted, and the vibration element is mounted on the semiconductor integrated circuit chip by means of a supporting member including a metal support rod and an adhesive layer. The vibration element and semiconductor integrated circuit chip are arranged to be overlapped with each other viewed in a direction of the rotation axis and are arranged substantially in parallel with each other in planes which are substantially perpendicular to the rotation axis.
    Type: Application
    Filed: September 18, 2001
    Publication date: April 25, 2002
    Applicant: NGK Insulators, Ltd.
    Inventors: Seiji Ishikawa, Takayuki Kikuchi
  • Publication number: 20020034326
    Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.
    Type: Application
    Filed: October 30, 2001
    Publication date: March 21, 2002
    Inventors: Seiji Ishikawa, Masao Sakata, Jun Nakazato, Sadao Shimoyashiro, Hiroto Nagatomo, Yuzo Taniguchi, Osamu Satou, Tsutomu Okabe, Yuzaburo Sakamoto, Kimio Muramatsu, Kazuhiko Matsuoka, Taizo Hashimoto, Yuichi Ohyama, Yutaka Ebara, Isao Miyazaki, Shuichi Hanashima
  • Patent number: 6339653
    Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.
    Type: Grant
    Filed: March 10, 2000
    Date of Patent: January 15, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Seiji Ishikawa, Masao Sakata, Jun Nakazato, Sadao Shimoyashiro, Hiroto Nagatomo, Yuzo Taniguchi, Osamu Satou, Tsutomu Okabe, Yuzaburo Sakamoto, Kimio Muramatsu, Kazuhiko Matsuoka, Taizo Hashimoto, Yuichi Ohyama, Yutaka Ebara, Isao Miyazaki, Shuichi Hanashima
  • Patent number: 6330352
    Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.
    Type: Grant
    Filed: March 15, 2000
    Date of Patent: December 11, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Seiji Ishikawa, Masao Sakata, Jun Nakazato, Sadao Shimoyashiro, Hiroto Nagatomo, Yuzo Taniguchi, Osamu Satou, Tsutomu Okabe, Yuzaburo Sakamoto, Kimio Muramatsu, Kazuhiko Matsuoka, Taizo Hashimoto, Yuichi Ohyama, Yutaka Ebara, Isao Miyazaki, Shuichi Hanashima
  • Patent number: 6329948
    Abstract: In order to determine a position of a mobile station in a wireless communication system including a plurality of mobile stations each having a wireless communication terminal installed therein, a plurality of base stations and a communication control station, times of receipt at which a radio wave emitted by a wireless communication terminal provided in a mobile station whose position is to be determined are received by at least three base stations substantially synchronized with a standard time are measured, a plurality of representative points are set on a position calculation area within an overlapped portions of cover areas of these base stations, communication delay times at respective representative points are calculated with [(x−xi)2+(y−yi)2]½/C (C is a velocity of light), wave emitting times TMi are calculated as differences between the times of receipt Ti and the communication delay times, a sum D of squares of differences between two calculated wave emitting times i
    Type: Grant
    Filed: August 10, 2000
    Date of Patent: December 11, 2001
    Assignee: NGK Insulators, Ltd.
    Inventor: Seiji Ishikawa
  • Publication number: 20010038708
    Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.
    Type: Application
    Filed: June 29, 2001
    Publication date: November 8, 2001
    Inventors: Seiji Ishikawa, Masao Sakata, Jun Nakazato, Sadao Shimoyashiro, Hiroto Nagatomo, Yuzo Taniguchi, Osamu Satou, Tsutomu Okabe, Yuzaburo Sakamoto, Kimio Muramatsu, Kazuhiko Matsuoka, Taizo Hashimoto, Yuichi Ohyama, Yutaka Ebara, Isao Miyazaki, Shuichi Hanashima
  • Patent number: 6290583
    Abstract: An apparatus for holding a workpiece is incorporated in a polishing apparatus which polishes the workpiece to a flat mirror finish. The workpiece holding apparatus has a top ring holding a workpiece and a top ring drive shaft for rotating the top ring and pressing the top ring holding the workpiece against a turntable. A rotary joint is removably provided on the top ring drive shaft for allowing fluid to pass therethrough to thereby communicate with an external fluid source. A passage provided in the top ring drive shaft allows the rotary joint to communicate with through-holes formed in the top ring.
    Type: Grant
    Filed: September 10, 1998
    Date of Patent: September 18, 2001
    Assignee: Ebara Corporation
    Inventors: Hiroo Suzuki, Seiji Ishikawa
  • Publication number: 20010020081
    Abstract: A polyimide-based insulating film composition comprising (a) 100 parts by weight of an organic solvent-soluble polyimidosiloxane obtained from a tetracarboxylic acid component and a diamine component comprising 45 to 90 mole percent of a diaminopolysiloxane represented by the following general formula (1):
    Type: Application
    Filed: February 23, 2001
    Publication date: September 6, 2001
    Inventors: Seiji Ishikawa, Musubu Ichikawa
  • Publication number: 20010014572
    Abstract: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.
    Type: Application
    Filed: March 13, 2001
    Publication date: August 16, 2001
    Inventors: Katsuya Okumura, Riichirou Aoki, Hiromi Yajima, Seiji Ishikawa, Manabu Tsujimura