Patents by Inventor Seiji Kai

Seiji Kai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10148245
    Abstract: An elastic wave device includes a support substrate and a laminated film disposed on the support substrate. A portion of the laminated film is removed in a region outside a region in which an interdigital transducer electrode is disposed and below a region to which an external connection terminal is joined. An insulating layer is disposed in at least a portion of the region in which the portion of the laminated film is removed. A support layer is disposed on the insulating layer so as to surround the region in which the interdigital transducer electrode is disposed. A main component of a material of which the support layer is made is about 50% or more identical to a main component of a material of which the insulating layer is made. A cover is secured to the support layer to seal a cavity defined by the support layer.
    Type: Grant
    Filed: June 9, 2016
    Date of Patent: December 4, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Seiji Kai
  • Publication number: 20180102761
    Abstract: An elastic wave device includes a piezoelectric thin film provided on a low acoustic velocity film and an IDT electrode provided on the piezoelectric thin film, wherein the piezoelectric thin film is made of a piezoelectric single crystal and includes a first principal surface that is a positive surface in a polarization axis direction and a second principal surface that is a negative surface in the polarization axis direction. The first principal surface of the piezoelectric thin film faces the low acoustic velocity film, and the second principal surface faces the IDT electrode.
    Type: Application
    Filed: December 7, 2017
    Publication date: April 12, 2018
    Inventors: Tsutomu TAKAI, Atsushi TANAKA, Seiji KAI
  • Publication number: 20180102757
    Abstract: An elastic wave device includes a multilayer film stacked on a support substrate. A first support layer surrounds a region including interdigital transducer electrodes. A second support layer is disposed in the region surrounded by the first support layer. A cover is fixed on the first support layer and the second support layer so as to close a cavity defined by the first support layer. The multilayer film is partially disposed on the support substrate, and an insulating layer is disposed in at least a portion of a region in which the multilayer film is not disposed. At least one of the first support layer and the second support layer is disposed on the insulating layer.
    Type: Application
    Filed: December 5, 2017
    Publication date: April 12, 2018
    Inventors: Masahiro FUKUSHIMA, Seiji KAI, Takuya KOYANAGI
  • Publication number: 20180097502
    Abstract: An elastic wave device includes a lamination layer film including a piezoelectric thin film on a support substrate. The lamination layer film is not partially present in a region located in an outer side portion of a region where IDT electrodes are provided. A first insulation layer extends from at least a portion of a region where the lamination layer film is not present to an upper portion of the piezoelectric thin film. A wiring electrode extends from the upper portion of the piezoelectric thin film to an upper portion of the first insulation layer, and extends onto a section of the first insulation layer in the region.
    Type: Application
    Filed: December 5, 2017
    Publication date: April 5, 2018
    Inventors: Koji Yamamoto, Tsutomu Takai, Seiji Kai, Hisashi Yamazaki, Yuji Miwa, Takashi Yamane
  • Publication number: 20180091116
    Abstract: An elastic wave device includes a support substrate, a film stack including a piezoelectric thin film, and an IDT electrode. The film stack is partially absent in a region outside a region where the IDT electrode is located in plan view. The elastic wave device further includes a support layer located on the support substrate in at least a portion of a region where the film stack is partially absent and surrounds a region where the film stack is located in plan view and a cover member located on the support layer. The cover member defines a hollow space facing the IDT electrode together with the piezoelectric thin film and the support layer.
    Type: Application
    Filed: November 29, 2017
    Publication date: March 29, 2018
    Inventor: Seiji KAI
  • Patent number: 9876484
    Abstract: In an elastic wave device, a plurality of elastic wave elements that include IDT electrodes are provided on a piezoelectric substrate, and a support layer that surrounds the elastic wave elements is provided on the piezoelectric substrate to define hollow portions in which the elastic wave elements are located. A cover member is stacked on the support layer, so that the hollow portions, in which the elastic wave elements are located, are provided, and the support layer includes a first support layer and a second support layer. The first support layer extends along an outer peripheral edge of the piezoelectric substrate, and the second support layer is located in a region surrounded by the first support layer and disposed around the elastic wave elements so as to have the hollow portions, in which the elastic wave elements are located. A hollow path is provided between the first support layer and the second support layer and arranged to allow communication between at least two of the hollow portions.
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: January 23, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Mitsuyoshi Hira, Seiji Kai
  • Publication number: 20170317659
    Abstract: A surface acoustic wave device assembly includes a collective board, first circuit portions provided on the collective board and respectively including first hot terminals and first ground terminals, a second circuit portion provided on the collective board and including second hot terminals and second ground terminals, and a power supply wiring provided on the collective board so as to surround the periphery of the first circuit portions and the second circuit portion. The first circuit portions include surface acoustic wave devices defining band pass filters. The second circuit portion defines a band pass filter. The first ground terminals and first hot terminals, and the second ground terminal are connected to the power supply wiring, the second hot terminals are not connected to the power supply wiring, and pass bands of the surface acoustic wave devices and a pass band of the band pass filter defined by the second circuit portion are the same or substantially the same.
    Type: Application
    Filed: July 17, 2017
    Publication date: November 2, 2017
    Inventors: Toru TAKESHITA, Seiji KAI, Takashi NAKA, Motoji TSUDA, Mitsuyoshi HIRA
  • Publication number: 20170093366
    Abstract: An elastic wave device includes a piezoelectric substrate, functional electrodes on the piezoelectric substrate, a support layer on the piezoelectric substrate with a frame shape surrounding the functional electrodes, a cover member on the support layer to seal an opening of the support layer, the cover member including a first main surface facing the support layer, and a second main surface opposite to the first main surface. Recesses are located in the cover member and are open to the second main surface. Via holes extend through the support layer and to bottom surfaces of the recesses of the cover member, the via holes each including an opening that is open to the bottom surface. The area of the opening of each of the via holes is not more than the area of the bottom surface of the corresponding recess of the cover member. First via conductor portions are provided in the via holes and second via conductor portions are provided in the recesses of the cover member.
    Type: Application
    Filed: December 13, 2016
    Publication date: March 30, 2017
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Taku Kikuchi, Seiji KAI, Motoji TSUDA, Mitsuyoshi HIRA
  • Publication number: 20160380611
    Abstract: An elastic wave device includes a support substrate and a laminated film disposed on the support substrate. A portion of the laminated film is removed in a region outside a region in which an interdigital transducer electrode is disposed and below a region to which an external connection terminal is joined. An insulating layer is disposed in at least a portion of the region in which the portion of the laminated film is removed. A support layer is disposed on the insulating layer so as to surround the region in which the interdigital transducer electrode is disposed. A main component of a material of which the support layer is made is about 50% or more identical to a main component of a material of which the insulating layer is made. A cover is secured to the support layer to seal a cavity defined by the support layer.
    Type: Application
    Filed: June 9, 2016
    Publication date: December 29, 2016
    Inventor: Seiji KAI
  • Publication number: 20160294354
    Abstract: In an elastic wave device, a multilayer film including a piezoelectric thin film is provided on a support substrate, an interdigital transducer electrode is provided on one surface of the piezoelectric thin film, a wiring electrode is connected to the interdigital transducer electrode, the wiring electrode includes a lead electrode portion and a pad electrode portion, an external connection terminal is located above the pad electrode portion, the external connection terminal is electrically connected to the pad electrode portion, and the external connection terminal is bonded onto the pad electrode portion on the support substrate so that at least the piezoelectric thin film of the multilayer film is not present below the pad electrode portion.
    Type: Application
    Filed: June 13, 2016
    Publication date: October 6, 2016
    Inventors: Shin SAIJO, Hisashi YAMAZAKI, Koji YAMAMOTO, Seiji KAI, Munehisa WATANABE
  • Publication number: 20160163957
    Abstract: In a surface acoustic wave device, a conductor pattern is located on a main surface of a piezoelectric substrate and includes a surface acoustic wave element pattern, a pad and a feed line that is electrically connected to the pad and extends up to an outer peripheral edge of the main surface. The piezoelectric substrate and a cover are bonded to each other with a support layer therebetween that includes a frame extending along the outer peripheral edge of the main surface so that a gap is provided between the frame and the outer peripheral edge and includes a pad adjacent portion on the pad. Thus, a closed space is surrounded by the piezoelectric substrate, the cover and the frame. The support layer further includes a reinforcement portion that intersects a feed line at or near an intersection portion in which a separated portion of the frame that is separated from the pad adjacent portion intersects the feed line.
    Type: Application
    Filed: February 11, 2016
    Publication date: June 9, 2016
    Inventors: Daisuke AJIMA, Seiji KAI
  • Publication number: 20160149557
    Abstract: In an elastic wave device, a plurality of elastic wave elements that include IDT electrodes are provided on a piezoelectric substrate, and a support layer that surrounds the elastic wave elements is provided on the piezoelectric substrate to define hollow portions in which the elastic wave elements are located. A cover member is stacked on the support layer, so that the hollow portions, in which the elastic wave elements are located, are provided, and the support layer includes a first support layer and a second support layer. The first support layer extends along an outer peripheral edge of the piezoelectric substrate, and the second support layer is located in a region surrounded by the first support layer and disposed around the elastic wave elements so as to have the hollow portions, in which the elastic wave elements are located. A hollow path is provided between the first support layer and the second support layer and arranged to allow communication between at least two of the hollow portions.
    Type: Application
    Filed: February 1, 2016
    Publication date: May 26, 2016
    Inventors: Mitsuyoshi HIRA, Seiji KAI
  • Patent number: 9271400
    Abstract: An electronic component includes a frame-shaped supporting body including a heat-curable resin and surrounding a functional unit on one main surface of a substrate and so as to be separated from a periphery of the substrate on an inner side and in which a lid member is fixed to the supporting body such that an opening of the frame-shaped supporting body is sealed. The frame-shaped supporting body includes a frame-shaped supporting body main body, a first protrusion that protrudes toward an inside from the supporting body main body and a second protrusion that protrudes toward an outside from the supporting body main body at a portion where the supporting body main body and the first protrusion are continuous with each other.
    Type: Grant
    Filed: September 3, 2013
    Date of Patent: February 23, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Seiji Kai, Shintaro Nakatani, Mitsuyoshi Hira, Takao Mukai, Hisashi Yamazaki
  • Publication number: 20150236237
    Abstract: Functional element units and a connection line electrically connecting the functional element units are formed on one principal surface of a piezoelectric motherboard. A resin support layer enclosing the functional element units is formed on the one principal surface of the motherboard. An elastic wave device with the functional units is obtained by dividing a multilayer body including the motherboard, the functional element units, and the support layer into a plurality of sections along a dicing line. The connection line includes a line main body positioned on the dicing line, and a connection unit in which the line main body and the functional element units are electrically connected. Prior to dividing the multilayer body, a retaining member made of resin which straddles the line main body in the width direction of the line main body is formed separate from the support layer on the motherboard.
    Type: Application
    Filed: May 6, 2015
    Publication date: August 20, 2015
    Inventors: Mitsuyoshi HIRA, Seiji KAI
  • Publication number: 20150037921
    Abstract: A method for manufacturing acoustic wave devices includes forming power supply lines along boundaries between chip regions on a main surface of a collective substrate on which interdigital transducer (IDT) electrodes and pad electrodes are formed; providing substantially frame-shaped first support members, each including a first opening in which one of the IDT electrodes is located and including first through-holes in a region in which the pad electrodes are formed; providing second support members outside the first support members; providing a lid member including second through-holes at positions overlapping the first through-holes on top surfaces of the first support members; and forming terminal electrodes in the first through-holes and the second through-holes by electroplating. The collective substrate, the first support members, the second support members, and the lid member form enclosed spaces in which the power supply lines are sealed.
    Type: Application
    Filed: July 28, 2014
    Publication date: February 5, 2015
    Inventors: Yohei KONAKA, Seiji KAI
  • Publication number: 20140003017
    Abstract: An electronic component includes a frame-shaped supporting body including a heat-curable resin and surrounding a functional unit on one main surface of a substrate and so as to be separated from a periphery of the substrate on an inner side and in which a lid member is fixed to the supporting body such that an opening of the frame-shaped supporting body is sealed. The frame-shaped supporting body includes a frame-shaped supporting body main body, a first protrusion that protrudes toward an inside from the supporting body main body and a second protrusion that protrudes toward an outside from the supporting body main body at a portion where the supporting body main body and the first protrusion are continuous with each other.
    Type: Application
    Filed: September 3, 2013
    Publication date: January 2, 2014
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Seiji KAI, Shintaro NAKATANI, Mitsuyoshi HIRA, Takao MUKAI, Hisashi YAMAZAKI
  • Patent number: 7459327
    Abstract: A solid-state imager is disclosed wherein isolation regions (4) are covered with power supply lines (8), a light-transmitting lens film (24) whose surface forms continuous convex portions above the isolation regions (4) convex towards channel regions (5) is provided, and a light-transmitting material having a refractive index lower than that of the lens film (24) is provided over the lens film (24).
    Type: Grant
    Filed: April 16, 2004
    Date of Patent: December 2, 2008
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Seiji Kai, Ryouji Matsui, Tetsuya Yamada, Tsutomu Imai, Kazuyuki Takegawa
  • Patent number: 7348133
    Abstract: The invention provides a manufacturing method of a solid-state image sensing device where light-receiving sensitivity is improved. The manufacturing method of the solid-state image sensing device of the invention has forming an insulating film on a light-receiving region and a non-light-receiving region, forming a mask pattern for forming a lens on the insulating film on the light-receiving region and a dummy mask pattern for forming a lens on the insulating film on the non-light-receiving region, forming a plurality of convex portions on the insulating film by etching the insulating film by using the mask pattern and the dummy mask pattern as a mask, forming a first lens film on the insulating film, forming a planarizing film having a lower etching rate than the first lens film on the first lens film, etching back the first lens film and the planarizing film, and forming a second lens film on the first lens film.
    Type: Grant
    Filed: August 5, 2004
    Date of Patent: March 25, 2008
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Isamu Tomizawa, Seiji Kai, Kouji Yagi
  • Publication number: 20070075382
    Abstract: An integrated circuit is provided, and in the integrated circuit, a microlens array is formed with a silicon nitride film which provides an interlayer insulation film for Al wiring, so that any stress migration in the Al wiring and any deformation of lens shape can be prevented. A silicon nitride film is formed on a semiconductor substrate as an interlayer insulation film between a first-layer wiring and a second-layer wiring. The silicon nitride film includes, in an image pickup section, a lens array having a plurality of convex lenses which are formed with a surface of the silicon nitride film. A silicon dioxide film is grown on the silicon nitride film. Then, a second Al film is formed on the silicon dioxide film. The Al film is etched in an unnecessary portion such as the surfaces of the lens array, to form wiring.
    Type: Application
    Filed: September 27, 2006
    Publication date: April 5, 2007
    Applicant: SANYO ELECTRIC CO., LTD.
    Inventors: Keiichi Yamaguchi, Seiji Kai
  • Patent number: 7138670
    Abstract: A compact semiconductor device having a contact hole that improves stability of electric connection between a wire and an electrode. The semiconductor device includes an insulation layer formed on a semiconductor substrate, first electrodes formed on the insulation layer and spaced from one another by an interval, an insulation film covering the first electrodes, and spaced second electrodes formed on the insulation film. Each second electrode includes an intermediate portion filling the space between two adjacent first electrodes, two edge portions respectively laid above the two adjacent first electrodes in an overlapping manner, and an upper surface connected to a wire by a contact. Thickness, t1, of the insulation film, thickness, t2, of each edge portion of the second electrode, and interval, S, between the first electrodes are adjusted to satisfy the expression of S<(2t1+2t2).
    Type: Grant
    Filed: January 21, 2005
    Date of Patent: November 21, 2006
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Tetsuya Miwa, Tsutomu Imai, Seiji Kai, Takayuki Kaida