Patents by Inventor Seiji Kozono

Seiji Kozono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5106329
    Abstract: A socket contact is constituted by a general tubular-shaped body and a pair of opposed resilient members formed by splitting the front portion of the general tubular body with a pair of slits. One of the opposed resilient members has an inner surface having a pair of contacting portions at the predetermined peripheral intervals. The other opposed resilient member has an inner surface having a contact portion in confronting relation with a peripheral center of the pair of contacting portions of the one of the opposed resilient members. As a result, it is possible to clamp a male contact to be inserted stably between the opposed resilient members and then to keep a posture of the male contact with high contact pressure against the male contact.
    Type: Grant
    Filed: April 2, 1991
    Date of Patent: April 21, 1992
    Assignee: Yazaki Corporation
    Inventors: Toshiro Maeshima, Seiji Kozono, Toshiharu Kudo, Mitsuhiko Totsuka, Kazuaki Sakurai
  • Patent number: 5085599
    Abstract: A connector is disclosed wherein a flexible retaining piece for engagement with a terminal is disposed in a terminal receiving chamber of a housing body, and a spacer for preventing the flexing of the flexible retaining piece is inserted into a gap which allows the flexing of said flexible retaining piece. The abutment wall is provided in the housing body in opposed relation to a side surface of the flexible retaining piece. The spacer is provided in the gap so as to slide in a direction perpendicular to the side surface of the flexible retaining piece. Engaging holes and flexure prevention portions for the flexible retaining pieces are provided on the spacer and are arranged in the direction of slide of the spacer.
    Type: Grant
    Filed: May 13, 1991
    Date of Patent: February 4, 1992
    Assignee: Yazaki Corporation
    Inventors: Toshiro Maejima, Kazuaki Sakurai, Seiji Kozono, Mitsuhiko Totsuka, Toshiharu Kudo
  • Patent number: 4909748
    Abstract: A movable connector having a movable housing which is to be secured to a panel is provided with spring members on for insertion into a fitting groove formed in the panel. The spring members serve to flexibly absorb displacements caused when a partner housing from a partner connector is fitted to the movable housing.
    Type: Grant
    Filed: February 8, 1989
    Date of Patent: March 20, 1990
    Assignee: Yazaki Corporation
    Inventors: Seiji Kozono, Toshiro Maejima
  • Patent number: D314180
    Type: Grant
    Filed: March 15, 1988
    Date of Patent: January 29, 1991
    Assignee: Yazaki Corporation
    Inventors: Toshiro Maejima, Seiji Kozono, Masaru Fukuda
  • Patent number: D314752
    Type: Grant
    Filed: March 15, 1988
    Date of Patent: February 19, 1991
    Assignee: Yazaki Corporation
    Inventors: Toshiro Maejima, Seiji Kozono, Masaru Fukuda
  • Patent number: D315547
    Type: Grant
    Filed: May 1, 1989
    Date of Patent: March 19, 1991
    Assignee: Yazaki Corporation
    Inventors: Seiji Kozono, Masaru Fukuda
  • Patent number: D315548
    Type: Grant
    Filed: May 1, 1989
    Date of Patent: March 19, 1991
    Assignee: Yazaki Corporation
    Inventors: Seiji Kozono, Masaru Fukuda
  • Patent number: D317148
    Type: Grant
    Filed: May 1, 1989
    Date of Patent: May 28, 1991
    Assignee: Yazaki Corporation
    Inventors: Seiji Kozono, Masaru Fukuda
  • Patent number: D317751
    Type: Grant
    Filed: December 2, 1988
    Date of Patent: June 25, 1991
    Assignee: Yazaki Corporation
    Inventor: Seiji Kozono
  • Patent number: D317752
    Type: Grant
    Filed: December 2, 1988
    Date of Patent: June 25, 1991
    Assignee: Yazaki Corporation
    Inventor: Seiji Kozono
  • Patent number: D317753
    Type: Grant
    Filed: December 2, 1988
    Date of Patent: June 25, 1991
    Assignee: Yazaki Corporation
    Inventor: Seiji Kozono
  • Patent number: D318267
    Type: Grant
    Filed: December 2, 1988
    Date of Patent: July 16, 1991
    Assignee: Yazaki Corporation
    Inventor: Seiji Kozono
  • Patent number: D319813
    Type: Grant
    Filed: August 2, 1989
    Date of Patent: September 10, 1991
    Assignee: Yazaki Corporation
    Inventor: Seiji Kozono
  • Patent number: D319998
    Type: Grant
    Filed: August 2, 1989
    Date of Patent: September 17, 1991
    Assignee: Yazaki Corporation
    Inventor: Seiji Kozono