Abstract: In a wiring substrate, formation of voids due to underfill filling failure is suppressed. A wiring substrate includes an insulating base layer, an insulating layer laminated on the base layer, and an electrically conductive connection terminal projecting from the insulating layer inside an opening. The insulating layer has a first surface with an opening, and a second surface located within the opening and being concave toward the base layer in relation to the first surface. The second surface extends from the first surface to the connection terminal inside the opening. On a cut surface which is a flat surface extending along a lamination direction in which the insulating layer is laminated on the base layer, an angle which is larger than 0° but smaller than 90° is formed between a normal line extending from an arbitrary point on the second surface toward the outside of the insulating layer and a parallel line extending from the arbitrary point toward the connection terminal in parallel to the first surface.

Abstract: To provide a wiring board in which wiring conductors are securely protected by a precise and rigid dam portion formed on an outermost layer of a laminate and that is excellent in connection reliability with a semiconductor chip. A laminate that configures this wiring board includes multiple connection terminal portions and wiring conductors as a conductor layer of the outermost layer. The wiring conductors are arranged at predetermined positions, passing through between multiple connection terminal portions for flip-chip mounting a semiconductor chip. A resin insulating layer of the outermost layer of the laminate has a dam portion and a reinforcement portion. The dam portion covers the wiring conductors. The reinforcement portion is formed, between the wiring conductor and the connection terminal portion that is adjacent to the wiring conductor, lower than a height of the dam portion. The reinforcement portion is concatenated with a side surface of the dam portion.

Abstract: To provide a wiring board excellent in connection reliability with a semiconductor chip. A first buildup layer 31 where resin insulating layers 21 and 22 and a conductor layer 24 are laminated is formed at a substrate main surface 11 side of an organic wiring board 10. The conductor layer 24 for an outermost layer in the first buildup layer 31 includes a plurality of connecting terminal portions 41 for flip-chip mounting a semiconductor chip. The plurality of connecting terminal portions 41 is exposed through an opening portion 43 of a solder resist layer 25. Each connecting terminal portion 41 includes a connection region 51 for a semiconductor chip and a wiring region 52 disposed to extend from the connection region 51 along the planar direction.

Abstract: A wiring substrate includes a surface layer having electrical insulation properties and a connection terminal having electrical conduction properties and protruding from the surface layer. The connection terminal includes a base portion, a covering portion and a filling portion. The base portion of the connection terminal is made of an electrically conductive first metal and located adjacent to the surface layer so as to extend through the surface layer and protrude from the surface layer. The covering portion of the connection terminal is made of an electrically conductive second metal having a melting point lower than that of the first metal and located so as to cover the base portion. The filling portion of the connection terminal is made of at least one of the second metal and an alloy containing the first and second metals and located so as to fill a hollow in the base portion.

Abstract: To provide a wiring substrate which can prevent short circuit between connection terminals, and which realizes reduction of the pitch between the connection terminals. The wiring substrate of the present invention includes a layered structure including one or more insulation layers and one or more conductor layers, and the wiring substrate is characterized in that a plurality of connection terminals are formed on the layered structure so as to be separated from one another; a filling member is filled between the connection terminals; and each of the connection terminals has a side surface composed of a contact surface which is in contact with the filling member, and a spaced surface which is not in contact with the filling member and which is located above the contact surface and below the top surface of the filling member.

Abstract: The present invention is to provide an epoxy resin composition uniformly containing a large amount of inorganic fillers, excellent in heat resistance and flame resistance, and having good impregnation into a base material, and a prepreg using the epoxy resin composition, having good tackiness, and being easy in handling. Furthermore, it is to provide a printed wiring board using a metal-clad laminate formed using the prepreg and/or the prepreg or the epoxy resin composition, capable of easily conducting an ENEPIG process, and a semiconductor device using the printed wiring board, excellent in performances. An epoxy resin composition comprises a solid epoxy resin, a silica nanoparticle having an average particle diameter of 1 nm or more and 100 nm or less, and a silica particle having an average particle diameter larger than that of the silica nanoparticle, in the range of 0.1 ?m or more and 5.0 ?m or less.

Abstract: A wiring board includes a substrate layer, an insulating layer laminated on the substrate layer and a connection terminal exposed from the insulating layer. The insulating layer has a first surface formed with an opening, a second surface located inside the opening and recessed toward the substrate layer and a wall surface located inside the opening and extending between the first and second surfaces in a lamination direction of the insulating layer. The second surface extends between the wall surface and the connection terminal and has a curved shape being convex toward the substrate layer and including a deepest part closest to the substrate layer so as to satisfy relationship of L1>L2 where L1 is a length between the wall surface and the deepest part in a layer in-plane direction; and L2 is a length between the deepest part and the connection terminal in the layer in-plane direction.

Abstract: The invention relates to an isolated amino acid that can act as an antagonist to FGF signaling, comprising at least a portion of the FGF protein amino acid sequence, and including a mutation in either a) the integrin ?v?3 binding region of FGF-1; or b) the FGFR binding region of FGF-1.

Abstract: To obtain a wiring board that allows improving flowability of an underfill to be filled up a clearance between an electronic component and the wiring board. The present invention is a wiring board with a laminated body where one or more layer of each of an insulating layer and a conductor layer are laminated. The wiring board includes a plurality of connecting terminals formed separately from one another on the laminated body, a filling member filled up between the plurality of connecting terminals, and a solder resist layer laminated on the laminated body. The filling member is in contact with at least a part of each side surface of the plurality of connecting terminals. The solder resist layer includes an opening that exposes the plurality of connecting terminals. The filling member has a surface roughness rougher than a surface roughness of a top surface of the solder resist layer.

Abstract: A wiring substrate according to the present invention includes a laminate of one or more insulation layers and one or more conductive layers and further includes a plurality of connection terminals formed on the laminate and spaced apart from one another, each having a step formed at the outer periphery of a first main surface opposite a contact surface in contact with the laminate, and a filling member provided in a filling manner between the connection terminals.

Abstract: Embodiments of the present wiring substrate include a stacked body including one or more insulation layers and one or more conductive layers, wherein the wiring substrate has a plurality of connection terminals formed on the stacked body, each connection terminal has a top surface whose area is smaller than that of each of opposite side surfaces thereof, and a filling member provided in a filling manner between the connection terminals. The top surface of each connection terminal has an area larger than that of a portion of each side surfaces portion exposed from the filling member, and a bonding layer containing a solder is formed on the top surface.

Abstract: A wiring board includes a base layer, a plurality of connection terminals and a surface layer. The base layer is electrically insulative. The plurality of connection terminals are conductive and formed on the base layer. The surface layer is electrically insulative, and fills gaps between the plurality of connection terminals on the base layer. The connection terminals include a base portion made of a conductive first metal and a coating portion made of a conductive second metal that is different from the first metal. The coating portion penetrates the surface layer, and coats the base portion to the base layer.

Abstract: The invention relates to an isolated amino acid that can act as an antagonist to FGF signaling, comprising at least a portion of the FGF protein amino acid sequence, and including a mutation in either a) the integrin ?v?3 binding region of FGF-1; or b) the FGFR binding region of FGF-1.

Abstract: A rotatable member (40) such as a sprocket is rotatably mounted on a fixed shaft member (32), and a first oil passage (72) extending in a radial direction is formed by a thrust member (36) abutting an axial end surface of the rotating member. The inner end of the first oil passage communicates with a radial bearing interface (A) of the rotatable member, and an oil jet ejected from an orifice (68) of an oil nozzle (66) is directed to an open outer end of the first lubricating oil passage. Because the first oil passage is fixed in position, the radial bearing interface receives an adequate supply of lubricating oil fed from the oil nozzle. The other axial end of the rotating member may be provided with a second lubricating oil passage (82) which also extends in a radial direction, the second lubricating oil passage having an open outer end and an open inner end communicating with the radial bearing interface.

Abstract: The present invention provides a pressure sensor and a method of manufacturing the same, which can change resistance to load smoothly in a relatively small load range and detect the pressure to the extent of relatively large load range. An uneven layer 6 is formed of a resin containing non-conductive particles 6a and having insulation properties, on a surface of the second substrate 3, and a resistor layer 7 containing at least carbon powder and having a certain film thickness is formed on a surface of the uneven layer 6. A sum of a film thickness of the uneven layer 6 between the non-conductive particles 6a and a film thickness of the resistor layer 7 is smaller than a particle diameter of non-conductive particles 6a included in the uneven layer, and at least a resistor layer 7 is formed on the non-conductive particles 6a and between the non-conductive particles 6a.

Abstract: An object of the present invention is to provide a resin composition having excellent impregnation property into a base material and capable of producing a prepreg, metal-clad laminate and printed wiring board excellent in properties such as low warpage, flame resistance, low thermal expansion properties, drill processability and desmear resistance. A first resin composition comprises an epoxy resin, an irregular-shaped first inorganic filler and a second inorganic filler having an average particle diameter of 10 to 100 nm which is different from that of the first inorganic filler. A second resin composition comprises an epoxy resin, silicone rubber particles having an average particle diameter of 1 ?m to 10 ?m, boehmite particles having an average particle diameter of 0.2 ?m to 5 ?m, and silica nanoparticles having an average particle diameter of 10 nm to 100 nm.

Abstract: The invention relates to an isolated amino acid that can act as an antagonist to FGF signaling, comprising at least a portion of the FGF protein amino acid sequence, and including a mutation in either a) the integrin ?v?3 binding region of FGF-1; or b) the FGFR binding region of FGF-1.

Abstract: The present invention is to provide an epoxy resin composition uniformly containing a large amount of inorganic fillers, excellent in heat resistance and flame resistance, and having good impregnation into a base material, and a prepreg using the epoxy resin composition, having good tackiness, and being easy in handling. Furthermore, it is to provide a printed wiring board using a metal-clad laminate formed using the prepreg and/or the prepreg or the epoxy resin composition, capable of easily conducting an ENEPIG process, and a semiconductor device using the printed wiring board, excellent in performances. An epoxy resin composition comprises a solid epoxy resin, a silica nanoparticle having an average particle diameter of 1 nm or more and 100 nm or less, and a silica particle having an average particle diameter larger than that of the silica nanoparticle, in the range of 0.1 ?m or more and 5.0 ?m or less.

Abstract: The present invention provides a pressure sensor and a method of manufacturing the same, which can change resistance to load smoothly in a relatively small load range and detect the pressure to the extent of relatively large load range. An uneven layer 6 is formed of a resin containing non-conductive particles 6a and having insulation properties, on a surface of the second substrate 3, and a resistor layer 7 containing at least carbon powder and having a certain film thickness is formed on a surface of the uneven layer 6. A sum of a film thickness of the uneven layer 6 between the non-conductive particles 6a and a film thickness of the resistor layer 7 is smaller than a particle diameter of non-conductive particles 6a included in the uneven layer, and at least a resistor layer 7 is formed on the non-conductive particles 6a and between the non-conductive particles 6a.

Abstract: A rotatable member (40) such as a sprocket is rotatably mounted on a fixed shaft member (32), and a first oil passage (72) extending in a radial direction is formed by a thrust member (36) abutting an axial end surface of the rotating member. The inner end of the first oil passage communicates with a radial bearing interface (A) of the rotatable member, and an oil jet ejected from an orifice (68) of an oil nozzle (66) is directed to an open outer end of the first lubricating oil passage. Because the first oil passage is fixed in position, the radial bearing interface receives an adequate supply of lubricating oil fed from the oil nozzle. The other axial end of the rotating member may be provided with a second lubricating oil passage (82) which also extends in a radial direction, the second lubricating oil passage having an open outer end and an open inner end communicating with the radial bearing interface.