Abstract: A biological information measurement device includes a sensor unit that detects predetermined biological information related to an organ of a living body, an A/D conversion unit that converts a measurement signal output from the sensor unit into a digital signal, a storage unit that stores information including a digital signal related to the measurement signal output from the A/D conversion unit, an analysis processing unit that determines presence or absence of a suspicion of an abnormality in the organ by analyzing the digital signal, and a measurement control unit that changes a sampling frequency related to A/D conversion of the measurement signal under a predetermined condition when the analysis processing unit has determined that a suspicion of an abnormality is present in the organ.

Abstract: A floor-standing air conditioner includes a first member that opens or closes a first flow path, a second member that opens or closes a second flow path, and a control unit that controls a fan, the first member, and the second member. The control unit is configured to perform a first blowing process of blowing out air from the first blow-out port with the first flow path opened by the first member and the second flow path closed by the second member, a second blowing process of blowing out air from the second blow-out port with the first flow path closed by the first member and the second flow path opened by the second member, and a blow-out port switching process of blowing out air from both the first blow-out port and the second blow-out port during switching between the first blowing process and the second blowing process.

Abstract: This air conditioning system includes a refrigerant circuit including an indoor heat exchanger of an indoor unit and an outdoor heat exchanger of an outdoor unit, and a detection unit capable of detecting a refrigerant leaking from the indoor unit. The detection unit is capable of switching between an energized state and a non-energized state on the basis of information on a refrigerant filling amount by which the refrigerant circuit is filled with the refrigerant.

Abstract: A semiconductor device includes: a first power supply terminal; a second power supply terminal; an output terminal; a first switching element connected between the first power supply terminal and the output terminal; and a second switching element connected between the second power supply terminal and the output terminal. The first power supply terminal includes: a first facing portion; a second facing portion; and a third facing portion. The first facing portion and the second facing portion are provided such that, upon application of a current, the current flows through the first facing portion and the second facing portion in a direction opposite to a direction in which the current flows through each of portions in the second power supply terminal that face the first facing portion and the second facing portion.

Abstract: A test method of the present disclosure includes: applying a thermal grease on a support plate; placing a press plate such that the press plate faces the support plate with the thermal grease interposed between the press plate and the support plate; changing a distance between the support plate and the press plate; and observing a shape of the thermal grease after the distance between the support plate and the press plate is changed. The pumping-out performance is determined based on the shape of the thermal grease.

Abstract: This air conditioning system includes a refrigerant circuit including an indoor heat exchanger of an indoor unit and an outdoor heat exchanger of an outdoor unit, and a detection unit capable of detecting a refrigerant leaking from the indoor unit. The detection unit is capable of switching between an energized state and a non-energized state on the basis of information on a refrigerant filling amount by which the refrigerant circuit is filled with the refrigerant.

Abstract: A floor-standing air conditioner includes a first member that opens or closes a first flow path, a second member that opens or closes a second flow path, and a control unit that controls a fan, the first member, and the second member. The control unit is configured to perform a first blowing process of blowing out air from the first blow-out port with the first flow path opened by the first member and the second flow path closed by the second member, a second blowing process of blowing out air from the second blow-out port with the first flow path closed by the first member and the second flow path opened by the second member, and a blow-out port switching process of blowing out air from both the first blow-out port and the second blow-out port during switching between the first blowing process and the second blowing process.

Abstract: A power semiconductor module includes a plurality of self-arc-extinguishing semiconductor elements, a printed wiring board, a plurality of conductive joining members, and a plurality of conductive gate wires. The printed wiring board includes an insulating substrate, a source conductive pattern, and a gate conductive pattern. The plurality of self-arc-extinguishing semiconductor elements each include a source electrode and a gate electrode. The source electrodes are joined to the source conductive pattern by means of the plurality of conductive joining members. The plurality of conductive gate wires connect the gate electrodes and the gate conductive pattern.

Abstract: A semiconductor device includes: a first power supply terminal; a second power supply terminal; an output terminal; a first switching element connected between the first power supply terminal and the output terminal; and a second switching element connected between the second power supply terminal and the output terminal. The first power supply terminal includes: a first facing portion; a second facing portion; and a third facing portion. The first facing portion and the second facing portion are provided such that, upon application of a current, the current flows through the first facing portion and the second facing portion in a direction opposite to a direction in which the current flows through each of portions in the second power supply terminal that face the first facing portion and the second facing portion.

Abstract: This power supply unit of a control system outputs a notification signal to a calculation unit when a time in which an input voltage becomes smaller than a threshold voltage exceeds a prescribed first measurement time. When detecting that a predetermined second measurement time has elapsed after the notification signal has been received, the calculation unit outputs an instruction signal instructing the execution of a process before a stop in preparation for a prescribed stop of power supply, and executes the process before the stop in place of the current process. Settings of the threshold voltage and the second measurement time are configured to be changeable by means of an external operation.

Abstract: This power supply unit of a control system outputs a notification signal to a calculation unit when a time in which an input voltage becomes smaller than a threshold voltage exceeds a prescribed first measurement time. When detecting that a predetermined second measurement time has elapsed after the notification signal has been received, the calculation unit outputs an instruction signal instructing the execution of a process before a stop in preparation for a prescribed stop of power supply, and executes the process before the stop in place of the current process. Settings of the threshold voltage and the second measurement time are configured to be changeable by means of an external operation.

Abstract: A power semiconductor device includes an emitter electrode disposed on a semiconductor substrate and through which a main current flows, a conductive layer that is disposed on the emitter electrode and is not a sintered compact, and a sintered metal layer that is disposed on the conductive layer and is a sintered compact. The sintered metal layer has a size to cover all the emitter electrode in plan view, and has higher heat conductivity than the conductive layer. The power semiconductor device can improve heat dissipation performance and adhesion.

Abstract: An air conditioner of the present invention includes: a compressor; an outdoor fan; a temperature sensor configured to detect an outside temperature; a memory configured to store the outside temperature detected by the temperature sensor; and a controller configured to conduct holding control of not updating the outside temperature stored in the memory, when the compressor is being driven and the outdoor fan is stopped or is repeatedly started and stopped after the outside temperature detected by the temperature sensor is stored in the memory while the outdoor fan is being driven.

Abstract: An object is to provide a technology that reduces the number of components and that is capable of suppressing the cost. A structure including semiconductor elements, a plurality of electrode terminals, and a dam bar for connecting the plurality of electrode terminals is prepared, and a part of the structure including a part of the plurality of electrode terminals and the dam bar is arranged in the terminal hole. Further, the part of the structure is clamped by a movable clamp inside the terminal hole, and at least a portion of the movable clamp is fitted into the terminal hole, and then a resin is injected into an internal space of a pair of molds.

Abstract: It is an object to provide a pressure-contact power semiconductor device and a power semiconductor core module which are capable of properly reducing their sizes. Each power semiconductor core module includes the following: a plurality of power semiconductor chips including a plurality of self-turn-off semiconductor elements and a plurality of diodes adjacent to each other in plan view; and a plurality of first springs disposed between an upper metal plate and a conductive cover plate. The plurality of self-turn-off semiconductor elements of each power semiconductor core module are arranged along any one of an L-shaped line, a cross-shaped line, and a T-shaped line in plan view.

Abstract: A power semiconductor device includes an emitter electrode disposed on a semiconductor substrate and through which a main current flows, a conductive layer that is disposed on the emitter electrode and is not a sintered compact, and a sintered metal layer that is disposed on the conductive layer and is a sintered compact. The sintered metal layer has a size to cover all the emitter electrode in plan view, and has higher heat conductivity than the conductive layer. The power semiconductor device can improve heat dissipation performance and adhesion.

Abstract: A semiconductor device includes semiconductor chips fixed to a board, an insulating plate having a through-hole formed therein, a first lower conductor including a lower main body formed on the lower surface of the insulating plate and soldered to any of the semiconductor chips, and a lower protrusion portion that connects with the lower main body, and extends to the outside of the insulating plate, a second lower conductor formed on a lower surface of the insulating plate and soldered to any of the semiconductor chips, an upper conductor including an upper main body formed on the upper surface of the insulating plate, and an upper protrusion portion that connects with the upper main body and extends to the outside of the insulating plate, and a connection portion provided in the through-hole and connects the upper main body and the second lower conductor.

Abstract: It is an object to provide a pressure-contact power semiconductor device and a power semiconductor core module which are capable of properly reducing their sizes. Each power semiconductor core module includes the following: a plurality of power semiconductor chips including a plurality of self-turn-off semiconductor elements and a plurality of diodes adjacent to each other in plan view; and a plurality of first springs disposed between an upper metal plate and a conductive cover plate. The plurality of self-turn-off semiconductor elements of each power semiconductor core module are arranged along any one of an L-shaped line, a cross-shaped line, and a T-shaped line in plan view.

Abstract: A semiconductor device includes semiconductor chips fixed to a board, an insulating plate having a through-hole formed therein, a first lower conductor including a lower main body formed on the lower surface of the insulating plate and soldered to any of the semiconductor chips, and a lower protrusion portion that connects with the lower main body, and extends to the outside of the insulating plate, a second lower conductor formed on a lower surface of the insulating plate and soldered to any of the semiconductor chips, an upper conductor including an upper main body formed on the upper surface of the insulating plate, and an upper protrusion portion that connects with the upper main body and extends to the outside of the insulating plate, and a connection portion provided in the through-hole and connects the upper main body and the second lower conductor.

Abstract: A relay substrate in which a circuit pattern and an external electrode are integrated on a insulating plate is used in the semiconductor device. Such configuration makes it possible to reduce a resistance in a current path while preventing the problems occurring when the external electrode is soldered on the semiconductor chip.