Patents by Inventor Seiji Oka

Seiji Oka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100013085
    Abstract: A power semiconductor device includes power semiconductor elements joined to wiring patterns of a circuit substrate, cylindrical external terminal communication sections, and wiring means for forming electrical connection between, for example, the power semiconductor elements and the cylindrical external terminal communication sections. The power semiconductor elements, the cylindrical external terminal communication sections, and the wiring means are sealed with transfer molding resin. The cylindrical external terminal communication sections are arranged on the wiring patterns so as to be substantially perpendicular to the wiring patterns, such that external terminals are insertable and connectable to the cylindrical external terminal communication sections, and such that a plurality of cylindrical external terminal communication sections among the cylindrical external terminal communication sections are arranged two-dimensionally on each of wiring patterns that act as main circuits.
    Type: Application
    Filed: July 16, 2009
    Publication date: January 21, 2010
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takeshi Oi, Seiji Oka, Yoshiko Obiraki, Osamu Usui, Yasushi Nakayama
  • Publication number: 20100013086
    Abstract: A power semiconductor device with improved productivity, reduced size and reduction of amounting area therefore is provided. In the provided power semiconductor device, an external terminal does not limit an increase in current. The power semiconductor device is sealed with transfer molding resin. In the power semiconductor device, a cylindrical external terminal communication section is arranged on a wiring pattern so as to be substantially perpendicular to the wiring pattern. An external terminal can be inserted and connected to the cylindrical external terminal communication section. The cylindrical external terminal communication section allows the inserted external terminal to be electrically connected to the wiring pattern. A taper is formed at, at least, one end of the cylindrical external terminal communication section, which one end is joined to the wiring pattern.
    Type: Application
    Filed: July 16, 2009
    Publication date: January 21, 2010
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Yoshiko OBIRAKI, Seiji Oka, Osamu Usui, Yasushi Nakayama, Takeshi Oi
  • Patent number: 7630794
    Abstract: An isolated operation detecting method according to the present invention includes: a first step that injects a power fluctuation into the power system; a second step that measures a system cycle; a third step that adjusts the injection of the power fluctuation so that the system cycle increases when the system cycle is found increased than the previous system cycle as a result of the measuring, and decreases when the system cycle is found decreased than the previous system cycle; a fourth step that produces a change pattern of a latest system cycle on the basis of a deviation of the latest system cycle from a fixed number of cycle-passed previous system cycle; and a fifth step that determines an isolated operation on the basis of the change pattern.
    Type: Grant
    Filed: January 12, 2007
    Date of Patent: December 8, 2009
    Assignee: Omron Corporation
    Inventors: Masao Mabuchi, Yasuhiro Tsubota, Nobuyuki Toyoura, Seiji Oka, Shinichi Hosomi, Masaya Kato, Kazuyoshi Imamura
  • Publication number: 20080016897
    Abstract: An indoor unit of an air conditioner includes an indoor unit casing having a first suction port, a panel, a moving mechanism, and a control unit. The panel opens the first suction port by moving so that the panel is spaced apart from the indoor unit casing, and closes the first suction port by moving so that the panel is proximate to the indoor unit casing. The moving mechanism moves the panel so that the first suction port is opened to a desired degree of opening. The control unit controls the moving mechanism. Furthermore, the control unit is capable of modifying the degree of opening of the first suction port to a desired degree of opening.
    Type: Application
    Filed: July 13, 2005
    Publication date: January 24, 2008
    Applicant: Daikin Industries, Ltd.
    Inventors: Masanao Yasutomi, Seiji Oka, Mikio Ito
  • Publication number: 20070277541
    Abstract: When an infrared ray transmitting and receiving part of an indoor unit receives a command signal for turning on ventilating operation from a wireless remote controller, information of the on-state of the ventilating operation is stored in a first EEPROM of the indoor unit and a second EEPROM of an outdoor unit. By starting up an air blower in a humidifying unit and switching a switchover damper connected to a ventilation pipe, indoor air is discharged to the outside of the room or outdoor air is taken into the room. When the ventilating operation is once stopped by power failure, the ventilating operation resumes on the basis of the information of the on-state of the ventilating operation stored in the first EEPROM after recovery from the power failure. The disadvantage that the ventilating operation stops though no command for turning off the ventilating operation has been received from the operator can be prevented.
    Type: Application
    Filed: November 30, 2005
    Publication date: December 6, 2007
    Inventors: Akinori Nakai, Seiji Oka, Hidekazu Kudou, Takashi Tokui
  • Publication number: 20070179724
    Abstract: An isolated operation detecting method according to the present invention includes: a first step that injects a power fluctuation into the power system; a second step that measures a system cycle; a third step that adjusts the injection of the power fluctuation so that the system cycle increases when the system cycle is found increased than the previous system cycle as a result of the measuring, and decreases when the system cycle is found decreased than the previous system cycle; a fourth step that produces a change pattern of a latest system cycle on the basis of a deviation of the latest system cycle from a fixed number of cycle-passed previous system cycle; and a fifth step that determines an isolated operation on the basis of the change pattern.
    Type: Application
    Filed: January 12, 2007
    Publication date: August 2, 2007
    Inventors: Masao Mabuchi, Yasuhiro Tsubota, Nobuyuki Toyoura, Seiji Oka, Shinichi Hosomi, Masaya Kato, Kazuyoshi Imamura
  • Publication number: 20060286923
    Abstract: An air conditioner and a method for controlling an air conditioner are provided for controlling the direction in which conditioned air is discharged during powerful operation. The air conditioner is provided with a control unit. The control unit is connected, among other things, to a compressor, a four-way switching valve, a pressure-reducing device, a remote control, a fan motor, a flap motor, a temperature sensor, and an infrared sensor. The control unit controls the compressor, the four-way switching valve, the pressure-reducing device, the fan motor, and the flap motor. When a command for powerful operation is entered from the remote control, the control unit temporarily increases the rotational speed of the cross-flow fan, the operating frequency of the compressor, and the like, enhances the air conditioning capacity, and controls the direction of the horizontal flap according to the direction in which people are present in the room.
    Type: Application
    Filed: September 27, 2004
    Publication date: December 21, 2006
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Seiji Oka, Toru Suzuki, Akinori Nakai, Mituaki Nagamine
  • Patent number: 7038143
    Abstract: A wiring board includes a first conductor formation substrate having a first substrate and a first electrode; a second conductor formation substrate having a second substrate and a second electrode; and a dielectric sandwiched between the first conductor formation substrate and the second conductor formation substrate. The dielectric includes a dielectric film that is not melted during thermo-compression bonding, and an adherent insulator melted during thermo-compression bonding. The surface of the dielectric film is subjected to a treatment to improve wettability. Adherence of the adherent insulator in thermo-compression bonding to the dielectric film is facilitated. The distance between the first electrode and the second electrode is made uniform by interposing the dielectric film between the first and second electrodes. A wiring board ensured as to lifetime and improved in reliability, and a simple method of fabricating such a wiring board are achieved.
    Type: Grant
    Filed: April 25, 2003
    Date of Patent: May 2, 2006
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shigeru Utsumi, Hirofumi Fujioka, Seiji Oka, Hideki Tsuruse, Taichi Kase, Takeshi Muraki
  • Patent number: 6807072
    Abstract: An electric power conversion device comprises switching elements 2a, 2b making up a push-pull converter, a pulse transformer T, a rectification diode D1, a rectification diode D2, a choke coil L, a smoothing capacitor C, a DC magnetic deviation prevention means 3, and an inverter 4. The DC magnetic deviation prevention means 3 detects the coil currents I1, I2 flowing in the primary windings M1, M2 of the pulse transformer T. By controlling (shortening) the on time of the switching element having a greater amount of current, the coil currents I1, I2 are balanced (I1=I2), thereby preventing the magnetic deviation phenomena of the pulse transformer T.
    Type: Grant
    Filed: June 3, 2003
    Date of Patent: October 19, 2004
    Assignee: Omron Corporation
    Inventors: Katsutaka Tanabe, Nobuyuki Toyoura, Seiji Oka, Masao Mabuchi, Kotaro Nakamura, Yuji Tsurukawa, Kenichi Inoue
  • Publication number: 20040027842
    Abstract: An electric power conversion device comprises switching elements 2a, 2b making up a push-pull converter, a pulse transformer T, a rectification diode D1, a rectification diode D2, a choke coil L, a smoothing capacitor C, a DC magnetic deviation prevention means 3, and an inverter 4. The DC magnetic deviation prevention means 3 detects the coil currents I1, I2 flowing in the primary windings M1, M2 of the pulse transformer T. By controlling (shortening) the on time of the switching element having a greater amount of current, the coil currents I1, I2 are balanced (I1=I2), thereby preventing the magnetic deviation phenomena of the pulse transformer T.
    Type: Application
    Filed: June 3, 2003
    Publication date: February 12, 2004
    Applicant: OMRON CORPORATION
    Inventors: Katsutaka Tanabe, Nobuyuki Toyoura, Seiji Oka, Masao Mabuchi, Kotaro Nakamura, Yuji Tsurukawa, Kenichi Inoue
  • Patent number: 6664127
    Abstract: In a method of manufacturing multi-layer printed wiring board, an uncured resin sheet is laminated on both surfaces of a printed wiring board having one or more layers, an organic cover film having a release property is laminated on the surfaces of the uncured resin sheets on upper and lower sides of the printed wiring board, a position of the printed wiring board is irradiated with a laser beam from the surface of the organic cover film to form a non-through hole that reaches a metal land for electrically conducting the layers of the inner printed wiring board, the non-through hole is filled with a thermosetting electrically conducting paste which is then half-cured, and the organic cover film is peeled off.
    Type: Grant
    Filed: June 7, 2001
    Date of Patent: December 16, 2003
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Seiji Oka, Satoshi Yanaura, Yasuo Kawashima, Takeshi Muraki
  • Publication number: 20030213615
    Abstract: A wiring board includes a first conductor formation substrate having a first substrate and a first electrode; a second conductor formation substrate having a second substrate and a second electrode; and a dielectric sandwiched between the first conductor formation substrate and the second conductor formation substrate. The dielectric includes a dielectric film that is not rendered molten during thermo-compression bonding, and an adherent insulator rendered molten during thermo-compression bonding. The surface of the dielectric film is subjected to a treatment to improve wettability. Adherence of the adherent insulator rendered molten in thermo-compression bonding to the dielectric film is facilitated. The distance between the first electrode and the second electrode can be set constant by interposing the dielectric film between the first and second electrodes. Accordingly, a wiring board ensured in lifetime and improved in reliability, and a fabrication method of such a wiring board can be obtained.
    Type: Application
    Filed: April 25, 2003
    Publication date: November 20, 2003
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shigeru Utsumi, Hirofumi Fujioka, Seiji Oka, Hideki Tsuruse, Taichi Kase, Takeshi Muraki
  • Patent number: 6629362
    Abstract: The present invention is provided to prevent a rise of temperature of a heating element and temperature of a board by inserting a graphite sheet 1 having high thermal conductivity to a circuit print board without electrically connecting with a conductive hole 6. In order to accomplish the above object, a manufacturing method of a circuit print board according the present invention has a thermal diffusive sheet forming step for forming the thermal diffusive sheet 7 by bonding resin 2 to a graphite sheet 1. Next, the method has a through hole making step for making the through hole on the thermal diffusive sheet and an insulator bonding step for forming a core 10 by thermally pressing the insulator to the thermal diffusive sheet having the through hole 3. Through these steps, the graphite sheet 1 can be inserted into the circuit print board without electrically connecting with the conductive hole 6.
    Type: Grant
    Filed: February 7, 2001
    Date of Patent: October 7, 2003
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Takashi Kobayashi, Seiji Oka, Kazuo Funahashi, Hideki Tsuruse
  • Patent number: 6451710
    Abstract: A method of manufacturing highly reliable and highly dense printed wiring board which is not warped even by the application of pressure and heat in manufacturing the multi-layer printed wiring board. The highly precise and highly dense multi-layer printed wiring board is realized by using an uncured resin sheet reinforced with fiber as an interlayer insulating layer, forming non-through holes in the uncured resin sheet using a laser beam, filling the non-through holes with a conductive paste, half-curing the conductive paste to form a wiring material, and sticking the wiring material onto the wiring substrate by application of pressure and heat, without causing a deviation in position even in applying pressure and heat.
    Type: Grant
    Filed: June 7, 2001
    Date of Patent: September 17, 2002
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Seiji Oka, Satoshi Yanaura, Yasuo Kawashima, Takeshi Muraki
  • Publication number: 20020023343
    Abstract: A method of manufacturing highly reliable and highly densely printed wiring board which are not warped even by the application of pressure and heat in the step of manufacturing the multi-layer printed wiring board. The highly precise and highly dense multi-layer printed wiring board is realized by using an uncured resin sheet reinforced with fiber as an interlayer insulating layer, forming non-through holes in the uncured resin sheet by using a laser beam, filling the non-through holes with a conductive paste, half-curing the conductive paste to form a wiring material, and sticking the wiring material onto the wiring substrate by the application of pressure and heat, without causing deviation in position even in the step of applying pressure and heat.
    Type: Application
    Filed: June 7, 2001
    Publication date: February 28, 2002
    Inventors: Seiji Oka, Satoshi Yanaura, Yasuo Kawashima, Takeshi Muraki
  • Publication number: 20020016018
    Abstract: In a method of manufacturing multi-layer printed wiring board, an uncured resin sheet is laminated on both surfaces of a printed wiring board having one or more layers, an organic cover film having release property is laminated on the surfaces of the uncured resin sheets on the upper and lower sides of the inner printed wiring board, a desired position of the printed wiring board is irradiated with a laser beam from the surface of the organic cover film to form a non-through hole that reaches a metal land for electrically conducting the layers formed on the inner printed wiring board, the non-through hole is filled with a thermosetting electrically conducting paste which is then half-cured, and the organic cover film is peeled off.
    Type: Application
    Filed: June 7, 2001
    Publication date: February 7, 2002
    Inventors: Seiji Oka, Satoshi Yanaura, Yasuo Kawashima, Takeshi Muraki
  • Publication number: 20010010250
    Abstract: The present invention is provided to prevent a rise of temperature of a heating element and temperature of a board by inserting a graphite sheet 1 having high thermal conductivity to a circuit print board without electrically connecting with a conductive hole 6. In order to accomplish the above object, a manufacturing method of a circuit print board according the present invention has a thermal diffusive sheet forming step for forming the thermal diffusive sheet 7 by bonding resin 2 to a graphite sheet 1. Next, the method has a through hole making step for making the through hole on the thermal diffusive sheet and an insulator bonding step for forming a core 10 by thermally pressing the insulator to the thermal diffusive sheet having the through hole 3. Through these steps, the graphite sheet 1 can be inserted into the circuit print board without electrically connecting with the conductive hole 6.
    Type: Application
    Filed: February 7, 2001
    Publication date: August 2, 2001
    Inventors: Takashi Kobayashi, Seiji Oka, Kazuo Funahashi, Hideki Tsuruse
  • Patent number: 6108511
    Abstract: An image forming apparatus including a plurality of filters for obtaining reusable toner from used toner scraped off of an image carrier. Also included is a reusable toner container for storing the reusable toner, and a toner transfer device for transferring the reusable toner stored in the reusable toner container to a developing device so that the reusable toner is reused by the developing device. The plurality of filters have a different mesh-size and are positioned in a used toner stream in an order based on the different mesh-size.
    Type: Grant
    Filed: April 13, 1999
    Date of Patent: August 22, 2000
    Assignee: Ricoh Company, Ltd.
    Inventors: Akio Kutsuwada, Seiji Oka, Tetsuo Yamaoka, Keisuke Hayashi, Shinji Tamaki
  • Patent number: 5983059
    Abstract: A recyclable toner container having a hollow cylindrical body, a toner outlet at one end of the container, and a removable cap fitted in the toner outlet. The cap have a plurality of circumferential protuberances on an outer periphery thereof and contacting the inner periphery of the toner outlet. The diameters of the plurality of protuberances are sequentially increased from a downstream side toward an upstream side in a direction in which the cap is inserted into the toner outlet.
    Type: Grant
    Filed: September 8, 1997
    Date of Patent: November 9, 1999
    Assignee: Ricoh Company, Ltd.
    Inventors: Seiji Oka, Yasushi Akiba, Masumi Ikesue, Masakazu Nakada, Hiroyasu Itou
  • Patent number: 5822664
    Abstract: A developing machine is provided which includes a supporting case (2); a developing sleeve (4) mounted within the supporting case (2), for carrying a developing agent (3); a magnetic roller (15) mounted within the developing sleeve (4); a projection (5d) for thinning a layer of the developing agent (3) carried on the developing sleeve (4) and regulating the amount of the developing agent (3); a drift portion A having a predetermined capacity, in which the developing agent (3) stopped by the projection (5d) drifts about; a toner containing portion (5b) having a toner supplying opening 5c which faces the developing sleeve (4) and is contiguous to the drift portion A on the upstream side of a direction in which the developing agent (3) on the developing sleeve (4) is carried; a developing agent storage case (5) attachable to and detachable from the supporting case (2), including the developing sleeve (4) and the toner containing portion (5b); and a developing agent retrieving device for a scraping the developing
    Type: Grant
    Filed: December 29, 1995
    Date of Patent: October 13, 1998
    Assignee: Ricoh Company, Ltd.
    Inventors: Seiji Oka, Hajime Oyama, Yasushi Akiba, Kiyonori Tsuda