Patents by Inventor Seiya Inoue

Seiya Inoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230144107
    Abstract: A wafer placement table includes a ceramic base having a wafer placement surface on its top surface where a wafer is able to be placed and incorporating an electrode, a cooling base having a refrigerant flow channel, and a bonding layer that bonds the ceramic base with the cooling base, wherein in an area that overlaps the wafer placement surface in plan view of the refrigerant flow channel, a distance from a ceiling surface of the refrigerant flow channel to the wafer placement surface at a most downstream part of the refrigerant flow channel is shorter than the distance at a most upstream part of the refrigerant flow channel.
    Type: Application
    Filed: August 10, 2022
    Publication date: May 11, 2023
    Applicant: NGK Insulators, Ltd.
    Inventors: Seiya INOUE, Tatsuya KUNO, Ikuhisa MORIOKA
  • Publication number: 20230123870
    Abstract: A wafer placement table includes a ceramic base including an electrode, a cooling base including a coolant flow path formed therein, a bonding layer bonding the ceramic base and the cooling base, a stepped hole penetrating the bonding layer and the cooling base and including an upper hole portion with a small diameter, a lower hole portion with a large diameter, and a hole stepped portion between the upper hole portion and the lower hole portion, the upper hole portion passing through a region in which the coolant flow path is formed, a stepped insulating pipe inserted through the stepped hole and including an upper pipe portion with a small diameter, a lower pipe portion with a large diameter, and a pipe stepped portion between the upper pipe portion and the lower pipe portion; and a connection terminal bonded to the electrode and inserted through the stepped insulating pipe.
    Type: Application
    Filed: October 6, 2022
    Publication date: April 20, 2023
    Applicant: NGK Insulators, Ltd.
    Inventors: Hiroshi TAKEBAYASHI, Tatsuya KUNO, Seiya INOUE
  • Publication number: 20230122013
    Abstract: A wafer placement table includes a ceramic base having a wafer placement surface on its top surface where a wafer is able to be placed and incorporating an electrode, a cooling base bonded to a bottom surface of the ceramic base and having a refrigerant flow channel, a plurality of holes extending through the cooling base in an up and down direction, and a heat exchange promoting portion that is provided in an area around at least one of the plurality of holes and that promotes heat exchange between refrigerant flowing through the refrigerant flow channel and a wafer placed on the wafer placement surface.
    Type: Application
    Filed: July 20, 2022
    Publication date: April 20, 2023
    Applicant: NGK Insulators, Ltd.
    Inventors: Seiya INOUE, Tatsuya KUNO
  • Publication number: 20230115033
    Abstract: A member for semiconductor manufacturing apparatus includes a ceramic plate that has an upper surface including a wafer placement surface and that contains an electrode; a plug insertion hole that is formed as at least a portion of a through-hole extending through the ceramic plate in an up-down direction, an internal thread portion being on an inner circumferential surface around the plug insertion hole; and an insulating plug that includes an external thread portion screwed on the internal thread portion on an outer circumferential surface and that allows gas to pass therethrough.
    Type: Application
    Filed: June 29, 2022
    Publication date: April 13, 2023
    Applicant: NGK Insulators, Ltd.
    Inventors: Tatsuya KUNO, Seiya INOUE
  • Publication number: 20230111137
    Abstract: A wafer placement table includes a ceramic base having a wafer placement surface on its top surface and incorporating an electrode, a cooling base in which a refrigerant flow channel is formed, and a metal bonding layer that bonds the ceramic base with the cooling base. The cooling base includes a ceiling base made of a metal matrix composite material or a low thermal expansion metal material and defining a ceiling of the refrigerant flow channel, a grooved base of which a main component is made of the same ceramic material as a main component of the ceramic base and on a top surface of which a flow channel groove defining a bottom and a side wall of the refrigerant flow channel is provided, and a metal ceiling bonding layer that bonds a bottom surface of the ceiling base with the top surface of the grooved base.
    Type: Application
    Filed: June 17, 2022
    Publication date: April 13, 2023
    Applicant: NGK Insulators, Ltd.
    Inventors: Tatsuya KUNO, Seiya INOUE, Hiroshi TAKEBAYASHI
  • Publication number: 20230116574
    Abstract: A wafer placement table is a wafer placement table that includes a refrigerant flow channel through which refrigerant is flowed and includes a top base including a ceramic base incorporating an electrode and having a wafer placement surface on a top surface of the ceramic base, a bottom base on a top surface of which a flow channel groove defining a side wall and a bottom of the refrigerant flow channel is provided, and a seal member disposed between the top base and the bottom base so as to seal the refrigerant flow channel from an outside.
    Type: Application
    Filed: September 7, 2022
    Publication date: April 13, 2023
    Applicant: NGK Insulators, Ltd.
    Inventors: Tatsuya KUNO, Seiya INOUE, Hiroshi TAKEBAYASHI, Masaki ISHIKAWA
  • Publication number: 20230055928
    Abstract: A wafer placement table includes a ceramic base, a first cooling base, and a second cooling base. The ceramic base has a wafer placement surface and incorporates a wafer attracting electrode and a heater electrode. The first cooling base is bonded via a metal bonding layer to a surface of the ceramic base on a side opposite to the wafer placement surface and has a first refrigerant flow channel capable of switching between supply and stop of supply of first refrigerant. The second cooling base is attached via a space layer, capable of supplying heat-transfer gas, to a surface of the first cooling base on a side opposite to the metal bonding layer and has a second refrigerant flow channel capable of switching between supply and stop of supply of second refrigerant.
    Type: Application
    Filed: July 18, 2022
    Publication date: February 23, 2023
    Applicant: NGK Insulators, Ltd.
    Inventors: Hiroshi TAKEBAYASHI, Tatsuya KUNO, Seiya INOUE
  • Publication number: 20230057107
    Abstract: A wafer placement table includes a ceramic base, a cooling base, and a bonding layer. The ceramic base includes an outer peripheral part having an annular focus ring placement surface on an outer peripheral side of a central part having a circular wafer placement surface. The cooling base contains metal. The bonding layer bonds the ceramic base with the cooling base. The outer peripheral part of the ceramic base has a thickness of less than or equal to 1 mm and does not incorporate an electrode.
    Type: Application
    Filed: June 3, 2022
    Publication date: February 23, 2023
    Applicant: NGK Insulators, Ltd.
    Inventors: Hiroshi TAKEBAYASHI, Tatsuya KUNO, Seiya INOUE
  • Publication number: 20220399190
    Abstract: A focus ring placement table includes an annular ceramic heater on which a focus ring is placed, a metal base, an adhesive element bonding the metal base and the ceramic heater, an inner-peripheral-side protective element disposed between the metal base and the ceramic heater and bonded to an inner peripheral portion of the adhesive element, and an outer-peripheral-side protective element disposed between the metal base and the ceramic heater and bonded to an outer peripheral portion of the adhesive element. A coefficient of thermal expansion of the adhesive element is equal to or smaller than a coefficient of thermal expansion of the inner-peripheral-side protective element and is equal to or greater than a coefficient of thermal expansion of the outer-peripheral-side protective element.
    Type: Application
    Filed: April 29, 2022
    Publication date: December 15, 2022
    Applicant: NGK Insulators, Ltd.
    Inventors: Seiya INOUE, Tatsuya KUNO
  • Publication number: 20220400539
    Abstract: A member for a semiconductor manufacturing apparatus includes a disk-shaped or annular ceramic heater, a metal base, an adhesive element bonding the metal base and the ceramic heater, an adhesive protective element disposed between the ceramic heater and the metal base to extend along a periphery of the adhesive element, and an anti-adhesion layer disposed between the adhesive element and the protective element, the anti-adhesion layer preventing adhesion between the adhesive element and the protective element.
    Type: Application
    Filed: March 30, 2022
    Publication date: December 15, 2022
    Applicant: NGK Insulators, Ltd.
    Inventors: Seiya INOUE, Tatsuya KUNO
  • Publication number: 20220124875
    Abstract: A wafer placement table includes a ceramic plate, an electrode embedded in the ceramic plate, a hollow ceramic shaft attached to a surface of the ceramic plate, a power-supplying member running inside the ceramic shaft and connected to a terminal of the electrode, a plate-side attaching site defined on the ceramic plate and to which the power-supplying member is attached, and a power-source-side attaching site defined at a free end of the ceramic shaft and to which the power-supplying member is attached. The power-source-side attaching site is defined in correspondence with the plate-side attaching site and in such a manner as to be shifted from the plate-side attaching site in plan view. The power-supplying member includes a redirecting portion where the power-supplying member extending from the power-source-side attaching site is forcibly redirected toward the plate-side attaching site.
    Type: Application
    Filed: July 1, 2021
    Publication date: April 21, 2022
    Applicant: NGK INSULATORS, LTD.
    Inventors: Yuma IWATA, Seiya INOUE, Reo WATANABE
  • Publication number: 20220124874
    Abstract: A wafer placement table includes a ceramic plate, an electrode embedded in the ceramic plate, a hollow ceramic shaft attached to a surface of the ceramic plate, a power-supplying member running inside the ceramic shaft and connected to a terminal of the electrode, a plate-side attaching site defined on the ceramic plate and to which the power-supplying member is attached, a power-source-side attaching site defined at a free end of the ceramic shaft and to which the power-supplying member is attached, and a redirecting member provided inside the ceramic shaft. The power-source-side attaching site is defined in correspondence with the plate-side attaching site and in such a manner as to be shifted from the plate-side attaching site in plan view. The redirecting member holds the power-supplying member such that the power-supplying member extending from the power-source-side attaching site is forcibly redirected toward the plate-side attaching site.
    Type: Application
    Filed: July 1, 2021
    Publication date: April 21, 2022
    Applicant: NGK INSULATORS, LTD.
    Inventors: Seiya INOUE, Reo WATANABE, Yuma IWATA
  • Patent number: 9826431
    Abstract: A transmission method including: a spreading code channel selection for selecting randomly a spreading code channel for CDMA spreading of transmission data, a time slot channel selection for selecting randomly a time slot channel for transmitting the CDMA-spread transmission data, a frequency channel selection for selecting randomly a frequency channel for transmitting the CMDA-spread transmission data, and a transmission for transmitting the transmission data CDMA-spread in the spreading code channel selected in the spreading code channel selection, using the time slot channel selected in the time slot channel selection, at a frequency corresponding to the frequency channel selected in the frequency channel selection.
    Type: Grant
    Filed: September 4, 2013
    Date of Patent: November 21, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventors: Nobuyuki Mineta, Hiroyuki Sato, Seiya Inoue, Takehisa Kimura
  • Patent number: 9184828
    Abstract: When multiple communication terminals access a base station in CDMA in which transmission signals are spread with orthogonal codes, the orthogonal codes in CDMA signals transmitted from the communication terminals are synchronized on the communication path. The communication terminals each include an information acquirer acquiring reference time information common to the multiple communication terminals, a transmission time generator generating a chip clock on the basis of the time information, an orthogonal code generator generating orthogonal codes in time with the timing of the chip clock, a CDMA spreader spreading transmission signals with the orthogonal codes to generate code division multiple access signals, a carrier wave generator generating a carrier wave, and a BPSK modulator modulating the carrier wave generated by the carrier wave generator with the code division multiple access signals and transmitting the carrier wave.
    Type: Grant
    Filed: July 9, 2013
    Date of Patent: November 10, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Nobuyuki Mineta, Hiroyuki Sato, Seiya Inoue
  • Publication number: 20150289163
    Abstract: A transmission method including: a spreading code channel selection for selecting randomly a spreading code channel for CDMA spreading of transmission data, a time slot channel selection for selecting randomly a time slot channel for transmitting the CDMA-spread transmission data, a frequency channel selection for selecting randomly a frequency channel for transmitting the CMDA-spread transmission data, and a transmission for transmitting the transmission data CDMA-spread in the spreading code channel selected in the spreading code channel selection, using the time slot channel selected in the time slot channel selection, at a frequency corresponding to the frequency channel selected in the frequency channel selection.
    Type: Application
    Filed: September 4, 2013
    Publication date: October 8, 2015
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Nobuyuki Mineta, Hiroyuki Sato, Seiya Inoue, Takehisa Kimura
  • Publication number: 20150078250
    Abstract: When multiple communication terminals access a base station in CDMA in which transmission signals are spread with orthogonal codes, the orthogonal codes in CDMA signals transmitted from the communication terminals are synchronized on the communication path. The communication terminals each include an information acquirer acquiring reference time information common to the multiple communication terminals, a transmission time generator generating a chip clock on the basis of the time information, an orthogonal code generator generating orthogonal codes in time with the timing of the chip clock, a CDMA spreader spreading transmission signals with the orthogonal codes to generate code division multiple access signals, a carrier wave generator generating a carrier wave, and a BPSK modulator modulating the carrier wave generated by the carrier wave generator with the code division multiple access signals and transmitting the carrier wave.
    Type: Application
    Filed: July 9, 2013
    Publication date: March 19, 2015
    Applicant: Mitsubishi Electric Corporation
    Inventors: Nobuyuki Mineta, Hiroyuki Sato, Seiya Inoue
  • Patent number: 6692393
    Abstract: A ball bearing for a pulley that is a component of a wrapping connector transmission device installed to an engine for an automobile. In the bearing, the depths of ball grooves formed in the inner ring and the outer ring of the ball bearing are set so that the risk rate of the ball being stranded on the shoulder becomes approximately the same for the inner ring and the outer ring under pure thrust load. Furthermore, the depth of the ball groove of the outer ring is set shallower than the depth of the ball groove of the inner ring. The depth of the ball groove of the outer ring is set in a range of 12-19% of the diameter of the ball.
    Type: Grant
    Filed: December 14, 2001
    Date of Patent: February 17, 2004
    Assignee: NTN Corporation
    Inventors: Masao Fukuwaka, Seiya Inoue, Takahiro Kanamoto, Hiroshi Kawamura
  • Patent number: 6580921
    Abstract: A portable-type dual-mode mobile telephone terminal apparatus including a satellite wireless communication controller 2 for performing satellite communications via a communications satellite and a cellular wireless communication controller 8 for performing cellular communications via a ground station, and interfacing means 21 for making interfacing between the satellite wireless communication controller 2 and the LCD/keypad junction unit 14 of the cellular wireless communication controller 8. The interfacing means 21 performs software interfacing under the control of a program while address decoders and input and output ports perform electrical interfacing.
    Type: Grant
    Filed: November 3, 1998
    Date of Patent: June 17, 2003
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Seiya Inoue, Kozo Seo
  • Publication number: 20020086754
    Abstract: A ball bearing for a pulley that is a component of a wrapping connector transmission device installed to an engine for an automobile. In the bearing, the depths of ball grooves formed in the inner ring and the outer ring of the ball bearing are set so that the risk rate of the ball being stranded on the shoulder becomes approximately the same for the inner ring and the outer ring under pure thrust load. Furthermore, the depth of the ball groove of the outer ring is set shallower than the depth of the ball groove of the inner ring. The depth of the ball groove of the outer ring is set in a range of 12-19% of the diameter of the ball.
    Type: Application
    Filed: December 14, 2001
    Publication date: July 4, 2002
    Inventors: Masao Fukuwaka, Seiya Inoue, Takahiro Kanamoto, Hiroshi Kawamura
  • Patent number: RE40910
    Abstract: A mobile communication terminal equipment is mounted in a vehicle and can utilize both the satellite and terrestrial communication systems. The mobile communication terminal equipment includes a satellite transceiver and a portable set. The satellite transceiver has a satellite transmission/reception circuit. As required, the portable set is disconnected from the satellite transceiver to be carried by the user. The portable set includes a terrestrial transmission/reception circuit, a signal input/output circuit and a connection selecting switch. The connection selecting switch is automatically controlled to connect the signal input/output circuit selectively to one of the satellite and terrestrial transmission/reception circuits. When the satellite transmission/reception circuit is in connection with the signal input/output circuit, the communication through the satellite wireless communication system can be carried out.
    Type: Grant
    Filed: July 8, 1998
    Date of Patent: September 8, 2009
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Katsuhiko Aoki, Makio Tsuchiya, Seiya Inoue