Patents by Inventor Seizo Watanabe

Seizo Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Alloy for mold
    Patent number: 3988176
    Abstract: A mold for continuous casting made of a copper alloy having been subjected to 15 to 40% cold working, said alloy consisting of copper as main constituent and an addition of 0.18 to 0.85% by weight of tin, and, if desired, several other metal components, the alloy having a high softening temperature and high-temperature strength, whose numerical values are given by specific formulas in which the thermal conductivity .lambda. is a determining factor which, in itself, is dependent on the construction of the mold, operating conditions etc.
    Type: Grant
    Filed: July 26, 1974
    Date of Patent: October 26, 1976
    Assignee: Hitachi Shipbuilding and Engineering Co., Ltd.
    Inventors: Seizo Watanabe, Koji Kitazawa, Minoru Maeda, Masaru Yamaguchi