Abstract: The present application relates to the field of high-throughput chemical reactions, and in particular to a sealing process for a well plate, a high-throughput screening method, a well plate heat-sealing device, and a high-throughput screening system. The sealing process for a well plate includes: covering a layer of film above blind wells of a well plate and then performing heat sealing, and the material for forming the film is consistent with the material of the part of the well plate in contact with the film, and the heat-sealing conditions include: the heat-sealing temperature is 5-65 °C higher than the melting point of the material of the film, and the heat-sealing duration is 0.3-4.5 s. The sealing process can solve problems that sealing of a single well with a small volume in an existing well plate is difficult and a temperature tolerance of an existing well plate sealing process is low.

Abstract: A light detection and ranging (LIDAR) device may include a local oscillator network and one or more LIDAR pixels coupled to the local oscillator network. At least one of the one or more LIDAR pixels may include a transmit optical antenna, a receive optical antenna, and at least one receiver. The transmit optical antenna may be configured to emit a transmit beam. The receive optical antenna may be configured to detect a first polarization orientation of a return beam and a second polarization orientation of the return beam. The at least one receiver can be configured to receive at least one local oscillator signal from the local oscillator network. The at least one receiver can be configured to generate a signal based on the local oscillator signal and the return beam.

Abstract: A method for coupling semiconductor optical components for a Light Detection and Ranging (LIDAR) system includes providing a first semiconductor optical component and a second semiconductor optical component; optically coupling a fiber array unit to the second semiconductor optical component; applying, by a vacuum component, a suction force to the second semiconductor optical component to couple the vacuum component to the second semiconductor optical component; transmitting light from one of the first semiconductor optical component and the fiber array unit to the other one of the first semiconductor optical component and the fiber array unit, via the second semiconductor optical component; and aligning the first semiconductor optical component with the second semiconductor optical component based on a measurement of the light.

Abstract: A method for manufacturing a semiconductor-based LIDAR sensor system for a vehicle, includes: providing a semiconductor optical device in a first alignment position within the LIDAR sensor system; obtaining an interference pattern associated with a first light beam that passes through the semiconductor optical device at a first location and a second light beam that passes through the semiconductor optical device at a second location; determining a position of the first location relative to the second location based on the interference pattern; and aligning the semiconductor optical device in a second alignment position within the LIDAR sensor system, based on the position of the first location relative to the second location.

Abstract: An electrode plate includes a current collector. On a side in a width direction of the current collector, the current collector is provided with a plurality of first slots and a plurality of second slots. Each of the first slots is provided with one tab or two tabs that are spaced, and the second slot is provided with no tab. In a length direction of the current collector, an odd number of second slots are provided between adjacent two of the first slots.

Abstract: The present disclosure is directed to a light detection and ranging (LIDAR) sensor system for a vehicle. The LIDAR sensor system includes a light source configured to output a beam. The LIDAR sensor system includes a semiconductor optical amplifier (SOA) array including a plurality of individualized SOA dies. A first individualized SOA die of the plurality of individualized SOA dies is spaced apart from a second individualized SOA die of the plurality of individualized SOA dies such that a spacing is defined between the first individualized SOA die and the second individualized SOA die. The SOA array is configured to receive the beam from the light source and amplify the beam.

Abstract: A light detection and ranging (LIDAR) device may include a local oscillator network and one or more LIDAR pixels coupled to the local oscillator network. At least one of the one or more LIDAR pixels may include a transmit optical antenna, a receive optical antenna, and at least one receiver. The transmit optical antenna may be configured to emit a transmit beam. The receive optical antenna may be configured to detect a first polarization orientation of a return beam and a second polarization orientation of the return beam. The at least one receiver can be configured to receive at least one local oscillator signal from the local oscillator network. The at least one receiver can be configured to generate a signal based on the local oscillator signal and the return beam.

Abstract: An autonomous vehicle can include a light detection and ranging (LIDAR) system. The LIDAR system can include a substrate having a first side and a second side; a light-sensitive device arranged on the first side of the substrate; and one or more optical isolation trenches formed into the substrate, the optical isolation trenches configured to optically isolate the light-sensitive device from light entering the substrate.

Abstract: An information handling system may include a main physical storage resource and a bootstrap physical storage resource. The information handling system may be configured to: boot from a bootstrap operating system (OS) stored on the bootstrap physical storage resource; install, by the bootstrap OS, a main OS onto the main physical storage resource; expose the bootstrap physical storage resource as a drive that is accessible from the main OS; and in response to a change in hardware, software, or firmware of the information handling system, update the bootstrap OS from the main OS.

Abstract: A method of improving autoscaling for bursty traffic. A performance metric is received and used by an autoscaling controller to scale a number of deployed processes. The performance metric is compared to a pre-existing target. When the performance metric exceeds the pre-existing target, the number of deployed processes is determined to be increased based on a curved metric. The curved metric is generated by applying a curve function to the performance metric, which prescales the number of deployed processes. The autoscaling controller then increases the number of deployed processes based on the curved metric.

Abstract: In a method for interaction processing, a virtual scene that includes a first virtual object and a plurality of second virtual objects is displayed in a game interaction interface. Visual identifiers that each follow a respective second virtual object of the plurality of second virtual objects and, in a region adjacent to the first control element, a plurality of manipulation control elements that each indicate a respective visual identifier of the visual identifiers are displayed based on selection of a first control element associated with an interaction operation. The first virtual object is controlled, based on a selection of a particular manipulation control element of the plurality of manipulation control elements, to perform the interaction operation with a target virtual object that corresponds to a particular second virtual object that is followed by the respective visual identifier indicated by the selected particular manipulation control element.

Abstract: A light detection and ranging (LIDAR) system for a vehicle can include: a light source configured to output a transmit beam at a first orientation; a reflective surface configured to redirect the transmit beam from the first orientation to a second orientation; and a lens interface configured to receive the transmit beam at the first orientation and focus the transmit beam onto the reflective surface; wherein the LIDAR system emits the transmit beam at the second orientation into an environment of the LIDAR system.

Abstract: A first metal layer is provided with a plurality of first pores, a second metal layer is provided with a plurality of second pores, an insulation layer is provided with a plurality of second pores, and the first pores, the second pores, and the third pores being configured to transmit ions. The electrode plate includes a first tab and a first insulation adhesive, where a first portion of the first tab is connected to the first metal layer, along the thickness direction of the electrode plate, a projection of a third portion is located outside a projection of the first metal layer, and the first insulation adhesive is disposed on the surface of the third portion and that faces the second metal layer, and the first insulation adhesive is connected to the first metal layer.

Abstract: A LIDAR device for a vehicle includes an integrated chip. The integrated chip includes a substrate layer, a cladding layer, a waveguide, a scattering array, and a reflector layer. The cladding layer is disposed on the substrate layer to form an interface with the substrate layer. The waveguide is disposed within the cladding layer and configured to route an infrared optical field. The scattering array is disposed within the cladding layer between the waveguide and the interface and perturbs the infrared optical field and scatters the infrared optical field into a first beam propagating toward a surface of the cladding layer and into a second beam propagating towards the interface. The reflector layer is disposed within the cladding layer between the waveguide and the surface of the cladding layer to reflect the first beam towards the interface.

Abstract: A method for coupling semiconductor optical components for a Light Detection and Ranging (LIDAR) system includes providing a first semiconductor optical component and a second semiconductor optical component; optically coupling a fiber array unit to the second semiconductor optical component; applying, by a vacuum component, a suction force to the second semiconductor optical component to couple the vacuum component to the second semiconductor optical component, wherein the fiber array unit is coupled to the vacuum component; and aligning the first semiconductor optical component with the second semiconductor optical component based on a measurement of light transmitted between the first semiconductor optical component and the fiber array unit via the second semiconductor optical component.

Abstract: The present disclosure is directed to a light detection and ranging (LIDAR) sensor system for a vehicle. The LIDAR sensor system includes a light source configured to output a beam. The LIDAR sensor system includes a semiconductor optical amplifier (SOA) array including a plurality of individualized SOA dies. A first individualized SOA die of the plurality of individualized SOA dies is spaced apart from a second individualized SOA die of the plurality of individualized SOA dies such that a spacing is defined between the first individualized SOA die and the second individualized SOA die. The SOA array is configured to receive the beam from the light source and amplify the beam.

Abstract: A LIDAR sensor system for a vehicle includes a silicon photonics substrate. The silicon photonics substrate includes: a semiconductor wafer; one or more surface features on a first surface of the semiconductor wafer; and a photoresist layer formed on the first surface of the semiconductor wafer, wherein the photoresist layer includes a laminated dry film. The silicon photonics substrate can be manufactured by obtaining a semiconductor wafer having one or more surface features; applying a dry film photoresist layer to a first surface of the semiconductor wafer; performing an adhesion bake process on the semiconductor wafer; developing the dry film photoresist layer to produce one or more developed regions in the dry film photoresist layer; and forming one or more solder bumps in the one or more developed regions.

Abstract: A temple arm includes a housing, an electrode assembly and an acoustic assembly. The housing includes a first chamber and a second chamber, and along a first direction, a projection of the first chamber covers a projection of the second chamber. The housing includes an ear-hook portion, and the ear-hook portion is connected to the second chamber along a second direction. The first direction is perpendicular to the second direction. The electrode assembly includes an electrode terminal, and the electrode assembly is disposed in the first chamber. The acoustic assembly is disposed in the second chamber and electrically connected to the electrode terminal. The ear-hook portion is connected to the second chamber along the second direction.

Abstract: A method for manufacturing a semiconductor-based LIDAR sensor system for a vehicle, includes: providing a semiconductor optical device in a first alignment position within the LIDAR sensor system; obtaining an interference pattern associated with a first light beam that passes through the semiconductor optical device at a first location and a second light beam that passes through the semiconductor optical device at a second location; determining a position of the first location relative to the second location based on the interference pattern; and aligning the semiconductor optical device in a second alignment position within the LIDAR sensor system, based on the position of the first location relative to the second location.

Abstract: Embodiments of this application provide a maraging steel, a method for preparing a maraging steel, and an electronic device. The maraging steel includes the following alloy elements: Co, Mo, and Ti. By weight percentage, a content of Co ranges from 12 wt % to 17 wt %, a content of Mo ranges from 6 wt % to 8 wt %, and a content of Ti ranges from 0.4 wt % to 1.5 wt %. The maraging steel further includes the following alloy elements: Ni, Al, Fe, and an impurity element. By weight percentage, a content of Ni ranges from 15 wt % to 18 wt %, Al?0.3 wt %, and the remainder is Fe and the impurity element. Embodiments of this application provide the maraging steel, the method for preparing a maraging steel, and the electronic device, so that the maraging steel can have both a high strength and high plasticity.