Abstract: A light detection and ranging system. The system includes a solid-state optical antenna array, a phase monitor array, a phase controller, a plurality of phase shifters and a global phase shifter. The phase monitor array is configured to output a first mixed signal associated with one of the optical antenna subarrays, and a second mixed signal associated with two of the optical antenna subarrays. The phase controller is configured to output a first phase coefficient based on the first mixed signal and a second phase coefficient based on the second mixed signal. One of the phase shifters is configured to apply the first phase coefficient to compensate for temperature variation within one of the optical antenna subarrays. The global phase shifter is configured to apply the second phase coefficient to compensate for temperature variation between two of the optical antenna subarrays.

Abstract: A cross reality system enables any of multiple devices to efficiently access previously stored maps. Both stored maps and tracking maps used by portable devices may have any of multiple types of location metadata associated with them. The location metadata may be used to select a set of candidate maps for operations, such as localization or map merge, that involve finding a match between a location defined by location information from a portable device and any of a number of previously stored maps. The types of location metadata may prioritized for use in selecting the subset. To aid in selection of candidate maps, a universe of stored maps may be indexed based on geo-location information. A cross reality platform may update that index as it interacts with devices that supply geo-location information in connection with location information and may propagate that geo-location information to devices that do not supply it.

Abstract: A light detection and ranging (LIDAR) sensor system includes a dual-polarization optical antenna, a single-polarization optical antenna, a first receiver, and a second receiver. The dual-polarization optical antenna is configured to (i) emit a transmit beam with a first polarization orientation and (ii) and detect a return beam having a second polarization orientation. The single-polarization optical antenna is configured to detect the return beam having the second polarization orientation.

Abstract: A sense amplifier capable of performing a logical NOT operation is provided, which includes a sense circuit, configured to sense a first voltage of a bit line and a second voltage of an inverse bit line; a first transistor, coupled between a first terminal of the sense circuit and the bit line; a second transistor, coupled between a second terminal of the sense circuit and the inverse bit line; and a third transistor, coupled between the bit line and the inverse bit line. First and second memory cells are respectively controlled by first and second word lines, and connected to the bit line. When the sense amplifier is in an inverse writing state, the sense amplifier writes the second voltage to the second memory cell through a predetermined path. A first logical state of the first voltage is complementary to a second logical state of the second voltage.

Abstract: A photonic integrated circuit (PIC) assembly comprising a semiconductor optical amplifier (SOA) array and a U-turn chip. The SOA array includes an input SOA and a plurality of SOAs. The input SOA and the plurality of SOAs are arranged parallel to one another. The U-turn chip includes an optical splitter and a waveguide assembly. The optical splitter is configured to receive amplified input light propagating in a first direction from the input SOA, and divide the amplified light into beams. The waveguide assembly guides the beams to a corresponding SOA of the plurality of SOAs, and adjusts a direction of prorogation of each of the guided beams to be substantially parallel to a second direction that is substantially opposite the first direction.

Abstract: A light detection and ranging (LIDAR) sensor system includes a plurality of LIDAR pixels and a local oscillator module. The local oscillator module is coupled to the plurality of LIDAR pixels. The local oscillator module includes a first local oscillator input configured to receive a first local oscillator signal and a second local oscillator input configured to receive a second local oscillator signal. The local oscillator module is configured to provide the first local oscillator signal or the second local oscillator signal to a first LIDAR pixel of the plurality of LIDAR pixels.

Abstract: A memory device capable of performing in-memory computing is provided and includes a memory cell array, a sense amplifier, a voltage control circuit, and a word line decoding circuit. The memory cell array includes memory cells arranged in a two-dimensional array. The memory cells on each row of the memory cell array are connected to a corresponding word line, and the memory cells on each column of the memory cell array are connected to a corresponding bit line. The sense amplifier detects a voltage level of the activated bit line and a voltage level of an inverse bit line corresponding to the bit line. The voltage control circuit selects a detection voltage provided to the sense amplifier according to a control signal from a memory controller. The word line decoding circuit activates a first word line and a second word line according to the control signal.

Abstract: A light detection and ranging (LIDAR) system include one or more LIDAR pixels including a transmit optical antenna, a receive optical antenna, a first receiver, and a second receiver. The transmit optical antenna is configured to emit a transmit beam. The receive optical antenna is configured to detect (i) a first polarization orientation of a returning beam and (ii) a second polarization orientation of the returning beam.

Abstract: A light detection and ranging (LIDAR) system for a vehicle can include: a light source configured to output a beam; a photonics integrated circuit (PIC) including a semiconductor die, the semiconductor die comprising a substrate having two or more semiconductor devices formed on the substrate, the two or more semiconductor devices configured to receive the beam from the light source and modify the beam and at least one photonics die coupled to the semiconductor die, the at least one photonics die comprising at least a transmitter configured to receive the beam from the semiconductor die; and one or more optics configured to receive the beam from the transmitter and emit the beam towards an object in an environment of the vehicle.

Abstract: A light detection and ranging (LIDAR) sensor system for a vehicle can include: a light source configured to output a beam; a photonics integrated circuit (PIC) including a semiconductor die, the semiconductor die including a substrate having two or more semiconductor stacks respectively associated with two or more semiconductor devices formed on the substrate, the two or more semiconductor devices respectively configured to receive the beam from the light source and modify one or more features of the beam; a transmitter configured to receive the beam from the semiconductor die; and one or more optics configured to receive the beam from the transmitter and emit the beam towards an object.

Abstract: A light detection and ranging (LIDAR) device includes a substrate layer, a cladding layer, a waveguide, and an ohmic element. The cladding layer is disposed with the substrate layer. The waveguide runs through the cladding layer. The ohmic element runs through the cladding layer. The ohmic element is arranged to impart heat to the waveguide when an electrical current is driven through the ohmic element.

Abstract: Manufacturing an integrated chip packaging for a LIDAR sensor mounted to a vehicle includes obtaining a metallic housing including a cutout on a side of the metallic housing, obtaining a ceramic radio frequency (RF) circuit board including a flange, coupling the flange of the ceramic RF circuit board to the cutout on the side of the metallic housing, applying a sealing material to an interface between the flange of the ceramic RF circuit board and the cutout on the side of the metallic housing, and locally heating the flange of the ceramic RF circuit board to bond the flange of the ceramic RF circuit board to the cutout on the side of the metallic housing thereby forming a seal at the interface.

Abstract: An electrochemical device includes a tab, a housing having a main body, and an electrode assembly accommodated in the main body. One end of the tab is connected to the electrode assembly. Another end of the tab extends out from a first lateral face of the main body. The housing includes a tail seal portion and a first side seal portion connected to a second lateral face and a third lateral face of the main body respectively; and a first connecting portion connecting the first side seal portion to the tail seal portion. The third lateral face is located between the second lateral face and the first lateral face. The tail seal portion and the first side seal portion are configured to be folded in a first direction and a second direction respectively.

Abstract: A light detection and ranging (LIDAR) device includes a first wafer layer, a laser assembly disposed on the first wafer layer, a capping layer, a second wafer layer, and a photonic integrated circuit (PIC). The capping layer is coupled to the first wafer layer and configured to seal the laser assembly. The second wafer layer is at least partially coupled to the first wafer layer. The PIC is formed on the second wafer layer. The second wafer includes an exit feature configured to outcouple laser light from the laser assembly.

Abstract: A light detection and ranging (LIDAR) system for a vehicle can include: a light source configured to output a transmit beam at a first orientation; a reflective surface configured to redirect the transmit beam from the first orientation to a second orientation; and a lens interface configured to receive the transmit beam at the first orientation and focus the transmit beam onto the reflective surface; wherein the LIDAR system emits the transmit beam at the second orientation into an environment of the LIDAR system.

Abstract: A FMCW LIDAR system for simultaneous beam scanning of the target environment. The system can include a photonics assembly couplable to a beam steering module. The photonics assembly is configured to receive a frequency modulated laser beam and can include an optical splitter and a coherent receiver. The optical splitter can be configured to optically split the frequency modulated laser beam into a local laser beam and a target laser beam, deliver the target laser beam to the beam steering module, and receive the target laser beam reflected by a target from the beam steering module. The coherent receiver can be configured to mix the local laser beam and the target laser beam to produce an output signal.

Abstract: A light detection and ranging system. The system includes a solid-state optical antenna array, a phase monitor array, a phase controller, a plurality of phase shifters and a global phase shifter. The phase monitor array is configured to output a first mixed signal associated with one of the optical antenna subarrays, and a second mixed signal associated with two of the optical antenna subarrays. The phase controller is configured to output a first phase coefficient based on the first mixed signal and a second phase coefficient based on the second mixed signal. One of the phase shifters is configured to apply the first phase coefficient to compensate for temperature variation within one of the optical antenna subarrays. The global phase shifter is configured to apply the second phase coefficient to compensate for temperature variation between two of the optical antenna subarrays.

Abstract: Low noise amplifiers (LNAs) are disclosed herein. In certain embodiments, an LNA includes an input balun configured to convert a single-ended radio frequency (RF) receive signal to a differential RF receive signal, an amplifier chain configured to amplify the differential RF receive signal to generate a differential amplified RF receive signal, and an output balun configured to convert the differential amplified RF receive signal into a single-ended amplified RF receive signal. The LNA's amplifier chain is operable in multiple gain modes, and includes a first differential amplification stage, a second differential amplification stage, and a third differential amplification stage.

Abstract: An electrode plate assembly includes an electrode plate and a tab. A first through-hole is created on the electrode plate. The first through-hole penetrates the electrode plate along a thickness direction of the electrode plate. The tab includes a main body, a connecting portion, and a constraining portion. Along the thickness direction, the main body and the constraining portion are located on two sides of the electrode plate respectively. The connecting portion runs through the first through-hole and connects the main body and the constraining portion. The electrode plate includes a current collector and a first active material layer. Along the thickness direction, the first active material layer is disposed on one side of the current collector. The current collector and the first active material layer are located between the main body and the constraining portion. The tab is electrically connected to the current collector.

Abstract: A LIDAR sensor system for a vehicle includes a silicon photonics substrate. The silicon photonics substrate includes: a semiconductor wafer; one or more surface features on a first surface of the semiconductor wafer; and a photoresist layer formed on the first surface of the semiconductor wafer, wherein the photoresist layer includes a laminated dry film. The silicon photonics substrate can be manufactured by obtaining a semiconductor wafer having one or more surface features; applying a dry film photoresist layer to a first surface of the semiconductor wafer; performing an adhesion bake process on the semiconductor wafer; developing the dry film photoresist layer to produce one or more developed regions in the dry film photoresist layer; and forming one or more solder bumps in the one or more developed regions.