Abstract: A semiconductor device includes a composite chip mounted over the a wiring substrate, the composite chip including a first area and a second area that is provided independently from the first area, the first area including a first circuit formed in the first area, and the second area including a second circuit formed in the second area.

Abstract: A semiconductor device includes a wiring board, a semiconductor chip mounted over a surface of the wiring board, a sealing resin provided over the surface of the wiring board to cover the semiconductor chip, and a low-elasticity resin provided between the wiring board and the sealing resin. The low-elasticity resin is arranged outside of an area on which the semiconductor chip is mounted. The low-elasticity resin has an elastic modulus lower than an elastic modulus of the sealing resin.

Abstract: Disclosed herein is a semiconductor device that comprises a wiring substrate, at least two semiconductor chips mounted on the wiring substrate, and at least one reinforcing substrate disposed so as to straddle at least portions of the two semiconductor chips.