Abstract: Disclosed embodiments relate to apparatuses, systems, and methods for transmitting/receiving data. In some embodiments, a system includes a server operative to collect data from remote apparatuses and transmit the collected data to a client group, and at least one client group including at least one client, the client group checking data received from the server and acquiring data requested by the client.

Abstract: Disclosed are a card socket device and an electronic apparatus including the same. The card socket device includes a seat portion configured to receive an attachable card; and one or more connection terminal portions formed in the seat portion and configured to form an electrical connection with one or more connection pads formed in a bottom surface of the attachable card, wherein the seat portion is configured such that a space accommodating the attachable card is upwardly opened.

Abstract: A contents providing method is implemented with a computer including at least one processor and a memory. The method includes: registering contents by matching time information with data received from a first user terminal, and storing the data in association with the time information; receiving a request for access to the registered contents; establishing a conversation interface with a messenger account related to the registered contents in response to the request for access; and reproducing the registered contents as a real-time conversation by providing the data through the conversation interface in an order corresponding to the time information.

Abstract: Semiconductor packages including stacked semiconductor chips are provided. The semiconductor packages may include first semiconductor chips and a second semiconductor chip that are stacked sequentially on a board. The semiconductor packages may also include a wiring layer on the memory chips and the wiring layer may include redistribution patterns and redistribution pads. Each of the memory chips may include a data pad. The data pads of the first semiconductor chips may be electrically connected to the board via the second semiconductor chip, some of redistribution patterns, and some of redistribution pads.

Abstract: The present disclosure relates to a monitoring technique for an Advanced-Surface Movement Guidance and Control Systeni (A-SMGCS) in real time. In the system for monitoring the A-SMGCS, which comprises the A-SMGCS and a high-level device for monitoring the A-SMGCS, an A-SMGCS server includes a monitoring module and a plurality of information transmit modules, each of which has its own status information and action information, and the monitoring module receives status information and action information sent from the plurality of information transmit modules and transmits them to the high-level device in real time.

Abstract: Disclosed are a method and an apparatus for calculating a distance in a contents delivery network.

Abstract: A stacked semiconductor package including a first printed circuit board and a second printed circuit board is provided. The first printed circuit board may include a first surface upon which a first semiconductor chip is mounted and a second surface upon which at least one connecting structure is attached. The first printed circuit board may further include at least one thermal via and a heat sink and the at least one thermal via and the heat sink may be disposed under the first semiconductor chip with the heat sink being disposed between the first surface and the second surface. The second printed circuit board may include a third surface upon which a second semiconductor chip is mounted. The second printed circuit board may be disposed under the first printed circuit board with the at least one connecting structure connecting the first printed circuit board to the second printed circuit board.

Abstract: Disclosed are a card socket device and an electronic apparatus including the same. The card socket device includes a seat portion configured to receive an attachable card; and one or more connection terminal portions formed in the seat portion and configured to form an electrical connection with one or more connection pads formed in a bottom surface of the attachable card, wherein the seat portion is configured such that a space accommodating the attachable card is upwardly opened.

Abstract: A stacked semiconductor package including a first printed circuit board and a second printed circuit board is provided. The first printed circuit board may include a first surface upon which a first semiconductor chip is mounted and a second surface upon which at least one connecting structure is attached. The first printed circuit board may further include at least one thermal via and a heat sink and the at least one thermal via and the heat sink may be disposed under the first semiconductor chip with the heat sink being disposed between the first surface and the second surface. The second printed circuit board may include a third surface upon which a second semiconductor chip is mounted. The second printed circuit board may be disposed under the first printed circuit board with the at least one connecting structure connecting the first printed circuit board to the second printed circuit board.

Abstract: A semiconductor package comprising: a base substrate; a first semiconductor chip unit attached to the base substrate and including at least one first semiconductor chip; a second semiconductor chip unit stacked on the first semiconductor chip unit and including at least one second semiconductor chip; at least one third semiconductor chip disposed between the first semiconductor chip unit and the second semiconductor chip unit and having an area smaller than that of the at least one first semiconductor chip and that of the at least one second semiconductor chip; and an insulating material layer disposed between the first semiconductor chip unit and the second semiconductor chip unit to surround at least a portion of the at least one third semiconductor chip and having a thickness larger than that of the third semiconductor chip.

Abstract: A semiconductor chip is provided. The semiconductor chip includes a semiconductor substrate, a circuit on the substrate, an insulating layer formed on the circuit, and a plurality of electrically floating conductor lines formed on the insulating layer, at a major surface of the semiconductor chip.

Abstract: Provided are a socket, a semiconductor package, a test device and a method of manufacturing a semiconductor package. A socket to test a semiconductor package comprising a housing, a trench receiving a semiconductor package in the housing, at least one probe connected to the semiconductor package at a bottom of the trench, and at least one connector electrically connecting a plurality of contact points exposed at a side of the semiconductor package when the semiconductor package is inserted into the trench. A semiconductor package with contacts exposed from a side of a package substrate, and a method of manufacturing such a semiconductor package are also disclosed.

Abstract: Disclosed are a method for setting a plurality of sessions and a method for transmitting/receiving data using the same. According to an exemplary embodiment of the present invention, at least some of the data including attribute information of the data are received through initial sessions, the number of additional sessions for receiving the data is calculated by using the attribute information of the data, and the additional sessions are set as many as the calculated number of additional sessions. According to the exemplary embodiments of the present invention, various and complicated states of the communication network can be reflected to session setting as the configuration of the communication network becomes more and more complicated and the sessions depending on the state of the communication network can be set, thereby transmitting data more effectively.