Abstract: A semiconductor package includes a first semiconductor chip mounted on a substrate and a second semiconductor chip mounted on top of the first semiconductor chip. A plurality of metal lines is deposited on the top of the first chip, and the metal lines are isolated from circuitry in the first chip. Wire bonds connect pads on the second chip to metal lines on the first chip. Additional wired bonds connect the metal lines on the first chip to terminals on the substrate. Conductive through-silicon vias or solder bumps may replace the wire bonds, and additional chips may be included in the package.

Abstract: A semiconductor package, which may include a structure of a semiconductor package having a minimized mounting area and height. The semiconductor package may include a board, a first package comprising at least one first semiconductor chip, and disposed on the board so as to be supported, a second package comprising at least one second semiconductor chip, and disposed on the board so as be supported, and a third package that comprises at least one third semiconductor chip, the third package having a cross-sectional area greater than a cross-sectional area of the first package, the third package being disposed on the first package and the second package so as to be supported, wherein the cross-sectional areas of the third package and the first package are taken along a plane parallel to the board.