Abstract: The liquefied gas storage tank includes a primary barrier, a primary insulation wall, a secondary barrier, and a secondary insulation wall. In a state where unit elements are arranged adjacent to each other, each of the unit elements being formed by stacking the secondary insulation wall, the secondary barrier, and a fixed insulation wall which is a part of the primary insulation wall, the primary insulation wall may comprise: a connection insulation wall provided in the space between the adjacent fixed insulation walls; first slits formed between the fixed insulation walls and the connection insulation wall when the connection insulation wall is inserted and installed between the adjacent fixed insulation walls; a plurality of second slits formed in a lengthwise direction and a widthwise direction of the fixed insulation walls; and a first insulating filler material for filling the first slits.

Abstract: A display device includes a timing controlling part generating an image data, a data control signal and a gate control signal; a data driving part generating a data voltage using the image data and the data control signal; a gate driving part generating a gate voltage using the gate control signal; a display panel including a plurality of subpixels and displaying an image using the data voltage and the gate voltage; and a plurality of first MUX switches and a plurality of second MUX switches sequentially transmitting the data voltage to two of a same color among the plurality of subpixels.

Abstract: A cycloidal reducer includes a reduction unit configured to reduce a torque input and an output unit configured to transfer the reduced output to the outside. A cycloidal rotor that is one constituent element of the reduction unit has a tooth-type protrusion formed in the shape of a circular arc. Thus, the level of difficulty of process is decreased more than when the tooth-type protrusion in the related art is formed in the shape of a broken line. In addition, rotor pins are accommodated in through-holes, respectively, that are equally spaced in the cycloidal rotor. A bushing is formed that fills a gap between the through-hole and the rotor pin is formed in order for the rotor pin to stably transfer rotational power. Accordingly, the advantage of effectively distributing a load and stably transferring a reduction torque to the outside is provided.

Abstract: Methods, systems, and media for presenting media content in response to a channel change request are provided. In some implementations, methods for presenting media content in response to a channel change request are provided, the methods comprising: causing media content provided on a first channel to be presented in a first display area on a first screen; receiving, at a hardware processor, a request to switch to a second channel; in response to receiving the request to switch to the second channel, causing thumbnail content corresponding to the second channel to be presented in the first display area; determining whether media content provided on the second channel is ready for presentation; and in response to determining that the media content provided on the second channel is ready for presentation, causing the media content provided on the second channel to be presented in the first display area.

Abstract: In an air mobility vehicle, an engine operates as required to provide mechanical driving force or electric energy. A battery is charged with the electric energy from the engine. Main rotors operate using the electric energy of the battery and electric power generated by the engine to perform takeoff, landing, and cruising. Auxiliary rotors are disposed at or adjacent to the center of gravity of a vehicle body and mechanically connected to the engine via a clutch. The auxiliary rotors perform the takeoff, the landing, or the cruising by receiving the mechanical driving force from the engine when the clutch is in an engaged position. A controller monitors the states of the battery and the main rotors and controls the operations of the engine and the clutch.

Abstract: A semiconductor package includes a base including a first bonding structure; and a first semiconductor chip, including a second bonding structure, the second bonding structure being coupled to the first bonding structure of the base, wherein the first bonding structure includes: a test pad; a first pad being electrically connected to the test pad; and a first insulating layer, wherein the second bonding structure includes: a second pad being electrically connected to the first pad; and a second insulating layer being in contact with the first insulating layer, and wherein at least a portion of the test pad is in contact with the second insulating layer.

Abstract: A semiconductor package includes a base structure having a base pad, a first semiconductor chip on the base structure, and having a first connection pad bonded to the base pad, a first bonding structure including an base insulation layer of a base structure and a first lower insulation layer of the first semiconductor chip bonded to the base insulation layer, a second semiconductor chip on the first semiconductor chip, and having a second connection pad connected to the first through-electrode, and a second bonding structure including a first upper insulation layer of the first semiconductor chip, and a second lower insulation layer of the second semiconductor chip bonded to the first upper insulation layer, and the first upper insulation layer has a dummy insulation portion extending onto the base structure around the first semiconductor chip.

Abstract: A semiconductor package includes a first semiconductor chip having a first face and a second face opposite thereto. The first semiconductor chip includes a first wiring layer having a surface that forms the first face. A second semiconductor chip disposed on the first face of the first semiconductor chip includes a second wiring layer directly contacting the first wiring layer. A first mold layer is disposed on one lateral side of the first semiconductor chip and directly contacts the second wiring layer. A first via penetrates the first mold layer. A width of the first wiring layer and the first semiconductor chip in a horizontal direction are substantially the same. A width of the second wiring layer and the second semiconductor chip in the horizontal direction are substantially the same. A height of the first via and the first semiconductor chip in the vertical direction are substantially the same.

Abstract: A method for charging a battery includes: determining a first charging section, in which a current charging rate of the battery is located, from among a plurality of charging sections predetermined based on a functional relation between a state of charge of the battery and an open circuit voltage of an anode of the battery; and charging the battery for the first charging section with a first charging rate corresponding to the first charging section.

Abstract: The present invention relates to a water purifier with an ice maker, and more particularly to a water purifier with an ice maker, wherein a guide member for guiding ice may stably guide ice separated while moving together with a tray member, and the guide member does not interfere with a purified water storage part even in a case where the tray member rotates such that the purifier can increase the capacity of the purified water storage part and thus can improve user convenience.

Abstract: A method for charging a battery includes: determining a first charging section, in which a current charging rate of the battery is located, from among a plurality of charging sections predetermined based on a functional relation between a state of charge of the battery and an open circuit voltage of an anode of the battery; and charging the battery for the first charging section with a first charging rate corresponding to the first charging section.

Abstract: Disclosed are interconnection structures, semiconductor packages including the same, and methods of fabricating the same.

Abstract: A storage device assembly is provided. The storage device assembly includes a latch assembly having a body and a hook mounted on the body, the hook having elasticity and having distal ends thereof bend away from the body; and a storage device to be joined to the latch assembly. The storage device includes a memory module including a memory connector, and a first enclosure and a second enclosure that encase the memory module except for an opening through which the memory connector is accessible. The first enclosure includes fixing holes corresponding to the distal ends of the hook and configured to accommodate the distal ends of the hook in a configuration in which the storage device is joined to the latch assembly.

Abstract: A semiconductor package includes a substrate, a first semiconductor chip on the substrate, a second semiconductor chip on the first semiconductor chip so that the first semiconductor chip is vertically between the second semiconductor chip and the substrate, a first molding layer adjacent to a sidewall of the first semiconductor chip on the substrate, the first molding layer formed of a first molding material, and a second molding layer adjacent to a sidewall of the second semiconductor chip on the substrate so that the first molding layer is vertically between the second molding layer and the substrate. The second molding layer is formed of a second molding material different from the first molding material.

Abstract: A is constructed such that upper and lower shafts, which are coaxial, are rotated in opposite directions using a single coil winding, simplifying the structure of the motor apparatus and reducing the numbers of sensors and controllers to be mounted thereon.

Abstract: A magnetic gear may include a stator, having a stator core having a plurality of teeth extending toward a rotation shaft and a plurality of coils wound around the plurality of teeth, a rotor, having a rotor core disposed inside the stator and fixed to the rotation shaft and a plurality of permanent magnets attached to the external surface of the rotor core, and a pole-piece unit, having a plurality of first pole pieces and a plurality of second pole pieces arranged radially about the rotation shaft between the stator core and the rotor core such that the plurality of first pole pieces and the plurality of second pole pieces are alternately arranged in a circumferential direction thereof.

Abstract: Disclosed are interconnection structures, semiconductor packages including the same, and methods of fabricating the same.

Abstract: An electronic device is disclosed. An electronic device comprises: a first memory in which an operating system and an application program executed on the operating system are stored; a second memory; a processor for loading at least some codes among codes corresponding to an application program from the first memory to the second memory, and when access information of the codes loaded in the second memory is received from a kernel of an operating system, accessing an area in which the loaded codes are stored, on the basis of the received information and executing the application program; and a snoop for monitoring access to an area in which a preset code, the access of which has been limited, from among codes loaded in the second memory is stored.

Abstract: A motor apparatus has a cooling structure capable of effectively cooling the motor by inducing a fluid flow into the motor. In particular, the motor apparatus includes: a first part having a first flow path and a motor installed thereon; a second part having a second flow path and configured to be rotatably mounted on the first part and connected to the motor; and a turbine portion coupled to the second part and including disks stacked on one another forming spaces therebetween. When the turbine portion is rotated together with the second part, air is drawn through the first flow path or the second flow path and introduced into an opening hole of each of the disks, and the air is discharged into the spaces formed between the respective disks to cool the motor.

Abstract: A method of fabricating a semiconductor device includes forming an interlayer dielectric on a substrate, the interlayer dielectric including first and second openings respectively disposed in first and second regions formed separately in the substrate; forming a first conductive layer filling the first and second openings; etching the first conductive layer such that a bottom surface of the first opening is exposed and a portion of the first conductive layer in the second opening remains; and forming a second conductive layer filling the first opening and a portion of the second opening.