Patents by Inventor Seok Hong
Seok Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20220203950Abstract: Disclosed herein a hydraulic supply apparatus includes a motor coupled to a modulator block including flow paths and valves for adjusting brake hydraulic pressure therein, the motor having a stator and a rotor; a sleeve coupled to the rotor to rotate together, and including an accommodating space inside and a first screw thread provided on an inner circumferential surface thereof; a screw shaft provided in the accommodating space, and including a second screw thread meshing with the first screw thread on an outer circumferential surface thereof to convert a rotational motion of the sleeve into a linear motion; and a piston connected to an end of the screw shaft; wherein a central axis of the piston is arranged eccentrically with respect to a central axis of the screw shaft.Type: ApplicationFiled: April 29, 2020Publication date: June 30, 2022Inventors: Kwang Seok HONG, Jin Yeong KIM
-
Publication number: 20220194566Abstract: A noise reduction system for air mobility, may include a plurality of propeller modules provided on the air mobility and each including an inverter, a motor electrically connected to the inverter, and a propeller mounted to the motor; and a control unit configured to perform PWM control of power to be provided to the inverters to reduce noise attributable to carrier frequencies generated by the plurality of inverters or reduce noise attributable to fundamental frequencies generated by the plurality of motors.Type: ApplicationFiled: July 16, 2021Publication date: June 23, 2022Applicants: Hyundai Motor Company, Kia CorporationInventors: Hee Kwang LEE, Hyun Seok Hong, Hyun Ki Cho
-
Publication number: 20220200419Abstract: A is constructed such that upper and lower shafts, which are coaxial, are rotated in opposite directions using a single coil winding, simplifying the structure of the motor apparatus and reducing the numbers of sensors and controllers to be mounted thereon.Type: ApplicationFiled: July 29, 2021Publication date: June 23, 2022Applicants: Hyundai Motor Company, Kia CorporationInventors: Hyun Seok HONG, Sang Hyun JUNG, Hee Kwang LEE
-
Publication number: 20220200265Abstract: An emergency power management system of a mobility, may include a fuse device connected to a battery and including a first circuit and a second circuit in which a first fuse and a second fuse are respectively provided and are connected in parallel, a pyro switch provided between the first circuit and the second circuit, and configured to establish electric connection with the first circuit in ordinary times and to release electric connection with the first circuit and to establish electric connection with the second circuit in a case of emergency, a determiner configured to determine abnormality of the first fuse based on current applied from the high-voltage battery or voltages at opposite end portions of the first fuse, and a controller configured to operate the pyro switch when abnormality occurs in the first fuse.Type: ApplicationFiled: July 30, 2021Publication date: June 23, 2022Applicants: Hyundai Motor Company, Kia CorporationInventors: Yoon Cheol JEON, Hyun Woo JUN, Hee Kwang LEE, Hyun Ki CHO, Gwi Taek KIM, Hyun Seok HONG, Woo Suk JUNG
-
Publication number: 20220181936Abstract: A magnetic gear may include a stator, having a stator core having a plurality of teeth extending toward a rotation shaft and a plurality of coils wound around the plurality of teeth, a rotor, having a rotor core disposed inside the stator and fixed to the rotation shaft and a plurality of permanent magnets attached to the external surface of the rotor core, and a pole-piece unit, having a plurality of first pole pieces and a plurality of second pole pieces arranged radially about the rotation shaft between the stator core and the rotor core such that the plurality of first pole pieces and the plurality of second pole pieces are alternately arranged in a circumferential direction thereof.Type: ApplicationFiled: July 22, 2021Publication date: June 9, 2022Applicants: Hyundai Motor Company, Kia CorporationInventors: Hyun Woo JUN, Woo Suk JUNG, Hyun Seok HONG, Hee Kwang LEE
-
Publication number: 20220172752Abstract: An internal voltage generation circuit may include an oscillation circuit, a signal generation circuit, and a pumping circuit. The oscillation circuit may generate an oscillation signal. The signal generation circuit may generate first and second pumping driving signals on the basis of the oscillation signal. The pumping circuit may generate a pumping voltage through a pumping operation on the basis of the first and second pumping driving signals.Type: ApplicationFiled: April 21, 2021Publication date: June 2, 2022Inventor: Seok In HONG
-
Publication number: 20220169225Abstract: Disclosed herein a hydraulic pressure supply apparatus of an electronic brake system includes a motor coupled to a modulator block having a flow path and a valve for adjusting braking hydraulic pressure therein, the motor having a stator and a rotor disposed to be spaced apart from an inner circumferential surface of the stator; a first gear configured to receive a rotational force from the rotor and rotating together with the rotor; a second gear provided with a piston on one side thereof and concentrically connected with the first gear in a ball screw manner to convert a rotational motion of the first gear into a linear motion; and an anti-rotation unit configured to prevent the second gear from rotating together with the first gear.Type: ApplicationFiled: March 12, 2020Publication date: June 2, 2022Inventors: Kwang Seok HONG, Jin Yeong KIM, Baik Kee SONG
-
Patent number: 11336176Abstract: An internal voltage generation circuit may include an oscillation circuit, a signal generation circuit, and a pumping circuit. The oscillation circuit may generate an oscillation signal. The signal generation circuit may generate first and second pumping driving signals on the basis of the oscillation signal. The pumping circuit may generate a pumping voltage through a pumping operation on the basis of the first and second pumping driving signals.Type: GrantFiled: April 21, 2021Date of Patent: May 17, 2022Assignee: SK hynix Inc.Inventor: Seok In Hong
-
Publication number: 20220149456Abstract: An air-cooled battery cooling system for an air mobility vehicle may ensure the cooling performance for batteries using air flows during the flight of the air mobility vehicle, since the cooling of the batteries is performed using an air flow in the top-bottom direction due to the hovering of the air mobility vehicle and an air flow in the front and rear direction due to the cruising of the air mobility vehicle, the efficient cooling performance for the batteries is ensured in a variety of flight modes. Furthermore, the batteries are securely fixed while being cooled by air flows via the heat transfer pads within the battery packs.Type: ApplicationFiled: July 19, 2021Publication date: May 12, 2022Applicants: Hyundai Motor Company, Kia CorporationInventors: Hyun Woo JUN, Woo Suk Jung, Hee Kwang Lee, Hyun Seok Hong
-
Publication number: 20220144443Abstract: A hybrid air mobility vehicle can make a long-distance flight through an efficient operation of an engine and a battery, and can reduce discomfort by reducing noise according to flight surroundings. The hybrid air mobility vehicle includes: an engine and a generator; a battery and a drive motor electrically connected to the generator; a first propeller connected to the drive motor and a second propeller connected to the generator through a clutch; and a controller that controls driving of the engine, the clutch, and the drive motor, based on a flight factor including at least one of a flight mode, a required power, a battery charging amount, or a surrounding flight environment of the hybrid air mobility vehicle.Type: ApplicationFiled: May 11, 2021Publication date: May 12, 2022Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Hee Kwang LEE, Hyun Seok HONG, Woo Suk JUNG, Keun Seok LEE, Hyun Woo JUN
-
Patent number: 11329024Abstract: A semiconductor package including a first device layer including first semiconductor devices, a first cover insulating layer, and first through-electrodes passing through at least a portion of the first device layer, a second device layer second semiconductor devices, a second cover insulating layer, and second through-electrodes passing through at least a portion of the second device layer, the second semiconductor devices vertically overlapping the first semiconductor devices, respectively, the second cover insulating layer in contact with the first cover insulating layer a third device layer including an upper semiconductor chip, the upper semiconductor chip vertically overlapping both at least two of first semiconductor devices and at least two of the second semiconductor devices, and device bonded pads passing through the first and second cover insulating layers, the device bonded pads electrically connecting the first and second through-electrodes to the upper semiconductor chip may be provided.Type: GrantFiled: July 29, 2020Date of Patent: May 10, 2022Assignee: Samsung Electronics Co., Ltd.Inventors: Ji-seok Hong, Jin-woo Park
-
Patent number: 11327112Abstract: According to an embodiment, a semiconductor device comprises a first monitoring pad and a second monitoring pad; a test circuit including an NMOS transistor having a drain and source coupled between a first voltage terminal and a common node, a PMOS transistor having a drain and source coupled between the common node and a second voltage terminal, a first switching element having a first terminal coupled to the common node via a first resistor and a second terminal coupled to the first monitoring pad, and a second switching element having a third terminal coupled to the common node via a second resistor and a fourth terminal coupled to the second monitoring pad; and a test control circuit suitable for controlling the test circuit.Type: GrantFiled: January 12, 2021Date of Patent: May 10, 2022Assignee: SK hynix Inc.Inventor: Yun Seok Hong
-
Publication number: 20220139927Abstract: The present disclosure provides a semiconductor memory device capable of improving reliability and performance. The semiconductor memory device comprises a substrate including a cell region and a peripheral region around the cell region, a cell region isolation film which defines the cell region, a bit line structure in the cell region, a first peripheral gate structure on the peripheral region of the substrate, the first peripheral gate structure comprising a first peripheral gate conduction film and a first peripheral capping film on the first peripheral gate conduction film, a peripheral interlayer insulating film around the first peripheral gate structure and an insertion interlayer insulating film on the peripheral interlayer insulating film and the first peripheral gate structure, and including a material different from the peripheral interlayer insulating film. An upper face of the peripheral interlayer insulating film is lower than an upper face of the first peripheral capping film.Type: ApplicationFiled: July 9, 2021Publication date: May 5, 2022Inventors: Ji Hoon CHANG, Jung-Hoon HAN, Ji Seok HONG, Dong-Sik PARK
-
Patent number: 11321478Abstract: A method for wirelessly connecting devices performed in a wireless connection system implemented with a computer includes: providing a list of devices capable of remote access with a user account of a user; connecting devices based on the list of devices capable of remote access; automatically updating a list of folders in the connected devices and a list of files included in the folders; and integrally managing files included in the connected devices.Type: GrantFiled: July 11, 2018Date of Patent: May 3, 2022Assignee: NHN Entertainment CorporationInventors: Yeonseong Chae, JiHae Kim, Jihye Kim, SeYoung Jang, Nam kyung Kim, BeomSeok Jang, Jin Kyung Lyu, MinKyu Lee, Junghwan Park, Yong Seok Hong, Jinwoo Kim, Yonghee Lee, JongNa Kim, Jinwoo Lee, Nam Jug Kim
-
Publication number: 20220130798Abstract: A semiconductor package including a first device layer including first semiconductor devices, a first cover insulating layer, and first through-electrodes passing through at least a portion of the first device layer, a second device layer second semiconductor devices, a second cover insulating layer, and second through-electrodes passing through at least a portion of the second device layer, the second semiconductor devices vertically overlapping the first semiconductor devices, respectively, the second cover insulating layer in contact with the first cover insulating layer a third device layer including an upper semiconductor chip, the upper semiconductor chip vertically overlapping both at least two of first semiconductor devices and at least two of the second semiconductor devices, and device bonded pads passing through the first and second cover insulating layers, the device bonded pads electrically connecting the first and second through-electrodes to the upper semiconductor chip may be provided.Type: ApplicationFiled: January 6, 2022Publication date: April 28, 2022Applicant: Samsung Electronics Co., Ltd.Inventors: Ji-seok HONG, Jin-woo PARK
-
Publication number: 20220126998Abstract: An apparatus for generating thrust for air transport includes a main thrust device, and an auxiliary thrust device configured to generate auxiliary thrust so as to enable an aircraft to vertically take off and land. The apparatus further includes: wings fixed to left and right sides of a fuselage of the aircraft, rotors installed on the wings and configured to generate thrust. In particular, the main thrust device provides driving force to the rotors using motors and an engine, and the auxiliary thrust device is installed in the fuselage and has a center of gravity configured to coincide with a center of gravity of the aircraft.Type: ApplicationFiled: May 4, 2021Publication date: April 28, 2022Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Woo Suk JUNG, Hee Kwang LEE, Hyun Seok HONG, Hyun Woo JUN
-
Publication number: 20220119100Abstract: In an air mobility vehicle, an engine operates as required to provide mechanical driving force or electric energy. A battery is charged with the electric energy from the engine. Main rotors operate using the electric energy of the battery and electric power generated by the engine to perform takeoff, landing, and cruising. Auxiliary rotors are disposed at or adjacent to the center of gravity of a vehicle body and mechanically connected to the engine via a clutch. The auxiliary rotors perform the takeoff, the landing, or the cruising by receiving the mechanical driving force from the engine when the clutch is in an engaged position. A controller monitors the states of the battery and the main rotors and controls the operations of the engine and the clutch.Type: ApplicationFiled: March 2, 2021Publication date: April 21, 2022Inventors: Woo Suk Jung, Hee Kwang Lee, Hyun Seok Hong, Hyun Woo Jun
-
Publication number: 20220123675Abstract: A method for determining a motor angle, may include deriving a sensor weight and a sensorless weight via a cross product of an actual current vector and a model-based sensored current vector and a cross product of the actual current vector and a model-based sensorless current vector; and determining a final motor angle by applying the sensor weight and the sensorless weight to each of a sensored angle and a sensorless angle.Type: ApplicationFiled: August 25, 2021Publication date: April 21, 2022Applicants: Hyundai Motor Company, Kia Corporation, POSTECH Research and Business Development FoundationInventors: Hee Kwang Lee, Hyun Seok Hong, Kwang Hee Nam, Tae Yeon Lee
-
Publication number: 20220122918Abstract: A semiconductor package includes a first semiconductor chip having a first face and a second face opposite thereto. The first semiconductor chip includes a first wiring layer having a surface that forms the first face. A second semiconductor chip disposed on the first face of the first semiconductor chip includes a second wiring layer directly contacting the first wiring layer. A first mold layer is disposed on one lateral side of the first semiconductor chip and directly contacts the second wiring layer. A first via penetrates the first mold layer. A width of the first wiring layer and the first semiconductor chip in a horizontal direction are substantially the same. A width of the second wiring layer and the second semiconductor chip in the horizontal direction are substantially the same. A height of the first via and the first semiconductor chip in the vertical direction are substantially the same.Type: ApplicationFiled: October 4, 2021Publication date: April 21, 2022Inventors: Byoung-Soo KWAK, Ji-Seok HONG
-
Publication number: 20220117107Abstract: A storage device assembly is provided. The storage device assembly includes a latch assembly having a body and a hook mounted on the body, the hook having elasticity and having distal ends thereof bend away from the body; and a storage device to be joined to the latch assembly. The storage device includes a memory module including a memory connector, and a first enclosure and a second enclosure that encase the memory module except for an opening through which the memory connector is accessible. The first enclosure includes fixing holes corresponding to the distal ends of the hook and configured to accommodate the distal ends of the hook in a configuration in which the storage device is joined to the latch assembly.Type: ApplicationFiled: April 12, 2021Publication date: April 14, 2022Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sung Chul HUR, Bum Jun KIM, Jung Soo KIM, Young Seok HONG