Abstract: An optical assembly includes: a camera module; at least one actuator configured to move the camera module; and a connection substrate having one end connected to the camera module such that at least a portion of the connection substrate is configured to move along with movement of the camera module. The connection substrate includes a rigidity reduction portion reducing rigidity of the connection substrate in a portion of the substrate in which distortion or warpage occurs according to the movement of the camera module.

Abstract: The present disclosure provides a novel transition metal compound which exhibits excellent catalytic activity and is useful in the preparation of a polypropylene having high impact strength, and a method for preparing a homo polypropylene using the same.

Abstract: An electronic component module includes a semiconductor package having a first surface provided as a mounting surface and a second surface opposing the first surface, and including a semiconductor chip, a component package having a first surface facing the second surface of the semiconductor package, and a second surface opposing the first surface of the component package, the component package including a passive component, and a connector disposed on the second surface of the component package and having a connection surface configured to be mechanically coupled to an external device, the connector including a plurality of connection lines arranged on the connection surface.

Abstract: The present invention provides a polypropylene resin pellet that is environment friendly, has excellent workability, and enables preparation of fine denier fiber, and a method for preparing the same.

Abstract: A method for evaluating physical properties of a melt-blown plastic resin, and, more specifically, a novel method for evaluating physical properties are provided. When a particular plastic resin is processed by a melt-blown process, a stretching diameter value after the process of the plastic resin can be accurately derived from a physical property value measured using a specimen of the resin.

Abstract: Provided are a method of preparing a supported metallocene catalyst, and a method of preparing polypropylene using the catalyst prepared thereby. According to the present invention, provided is a supported metallocene catalyst capable of preparing an isotactic polypropylene polymer having a low xylene soluble content while having excellent catalytic activity.

Abstract: An electronic component module includes a semiconductor package having a first surface provided as a mounting surface and a second surface opposing the first surface, and including a semiconductor chip, a component package having a first surface facing the second surface of the semiconductor package, and a second surface opposing the first surface of the component package, the component package including a passive component, and a connector disposed on the second surface of the component package and having a connection surface configured to be mechanically coupled to an external device, the connector including a plurality of connection lines arranged on the connection surface.

Abstract: The present disclosure relates to a retina imaging method in which a light from a light source into two lights is dispersed, at least one eyeground image of the eyeball at a first magnification is obtained by adjusting the paths of the two lights incident on the eyeball, and a plurality of DIC images are obtained at a second magnification higher than the first magnification with respect to the retina of the entirety of the obtained at least one eyeground image by adjusting the paths of the two lights incident on the eyeball.

Abstract: A semiconductor package includes: a connection member having a first surface and a second surface opposing each other in a stacking direction of the semiconductor package and including an insulating member and a redistribution layer formed on the insulating member and having a redistribution via; a semiconductor chip disposed on the first surface of the connection member and having connection pads connected to the redistribution layer; an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip; a passivation layer disposed on the second surface of the connection member; UBM pads disposed on the passivation layer and overlapping the redistribution vias in the stacking direction; and UBM vias connecting the UBM pads to the redistribution layer through the passivation layer, not overlapping the redistribution vias with respect to the stacking direction, and having a non-circular cross section.

Abstract: A robot control system includes: an interface configured to receive a user input; a controller configured to generate a motion command corresponding to the user input and a motion command group including the motion command, and generate hardware interpretable data by analyzing the motion command; and a driver configured to drive a motion of at least one hardware module based on the hardware interpretable data to be interpreted by the at least one hardware module.

Abstract: A semiconductor package includes: a connection member having a first surface and a second surface opposing each other in a stacking direction of the semiconductor package and including an insulating member and a redistribution layer formed on the insulating member and having a redistribution via; a semiconductor chip disposed on the first surface of the connection member and having connection pads connected to the redistribution layer; an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip; a passivation layer disposed on the second surface of the connection member; UBM pads disposed on the passivation layer and overlapping the redistribution vias in the stacking direction; and UBM vias connecting the UBM pads to the redistribution layer through the passivation layer, not overlapping the redistribution vias with respect to the stacking direction, and having a non-circular cross section.

Abstract: The present disclosure relates to a polypropylene for injection having a high content of ultra-high molecular weight and excellent rigidity, and a method for preparing the same.

Abstract: A fan-out semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, an encapsulant sealing at least a portion of the inactive surface, a first connection member disposed on the active surface and including a redistribution layer and a first via electrically connecting the connection pad to the redistribution layer, a passivation layer disposed on the first connection member, and an under-bump metal layer including an external connection pad disposed on the passivation layer and a second via connecting the external connection pad to the redistribution layer. In a vertical direction, the first and second vias are disposed within the external connection pad and do not overlap each other.

Abstract: A fan-out semiconductor package includes: a semiconductor chip having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads; a passivation layer disposed on the connection member and having openings exposing at least portions of the redistribution layer; metal members disposed in the openings of the passivation layer and connected to the exposed redistribution layer; and electrical connection structures disposed on the passivation layer and connected to the metal members, wherein the electrical connection structures have heights hierarchically differentiated from one another depending on sizes of the metal members.

Abstract: A data storage device and a method for operating the data storage device are disclosed. The data storage device may include an interface receiving a command and data from a host, a cache temporarily storing the received data, a memory non-temporarily storing the data stored in the cache, and a controller controlling the memory and the cache based on the command received from the host. The command may include charge rate of a battery supplying a power to the data storage device. The controller may determine whether or not the data storage device is an idle state, and determine an active operation mode of the data storage device based on the charge rate of the battery, when the data storage device is the idle state.

Abstract: A method of producing a methacrylate block copolymer includes operations of (a) preparing a polymer solution comprising a methacrylate polymer block by polymerizing a methacrylate monomer using a polymerization initiator and a reversible addition-fragmentation chain transfer (RAFT) agent in the presence of water or an organic solvent; (b) preparing a polymer solution comprising an acrylate polymer block-containing methacrylate diblock copolymer by adding an acrylate monomer and a styrene monomer to the polymer solution prepared in operation (a); (c) preparing a polymer solution comprising a methacrylate polymer block-containing methacrylate triblock copolymer by adding a methacrylate monomer to the polymer solution prepared in operation (b); and (d) collecting a polymer prepared after operations (b) and (c) and removing the RAFT agent present at a terminal of the polymer by using an amine-based organic material.

Abstract: Provided are a semiconductor device and a semiconductor system. A semiconductor device includes a non-volatile memory; a device interface circuit which receives an input/output (I/O) request from a host; and a device controller which executes a data access according to the I/O request on the non-volatile memory, and transmits an interrupt to the host a predetermined time before completion of the data access.

Abstract: A semiconductor package includes a support member having a first surface and a second surface, and having a through-hole, a first metal layer for shielding disposed on an internal sidewall of the through-hole and the first surface and the second surface of the support member, a connection member disposed on the first surface of the support member, and having a redistribution layer, a semiconductor chip disposed in the through-hole, an encapsulant sealing the semiconductor chip located in the through-hole, and covering the second surface of the support member, a second metal layer for shielding disposed on the encapsulant, and connected to the first metal layer for shielding by a connecting trench via passing through the encapsulant, and a reinforcing via disposed in a region, overlapping the trench via for connection, of the support member, and connected to the first metal layer for shielding.

Abstract: A semiconductor package includes a support member having a first surface and a second surface, and having a through-hole, a first metal layer for shielding disposed on an internal sidewall of the through-hole and the first surface and the second surface of the support member, a connection member disposed on the first surface of the support member, and having a redistribution layer, a semiconductor chip disposed in the through-hole, an encapsulant sealing the semiconductor chip located in the through-hole, and covering the second surface of the support member, a second metal layer for shielding disposed on the encapsulant, and connected to the first metal layer for shielding by a connecting trench via passing through the encapsulant, and a reinforcing via disposed in a region, overlapping the trench via for connection, of the support member, and connected to the first metal layer for shielding.

Abstract: A fan-out sensor package includes: a core member including a wiring layer including a plurality of layers and having a through-hole; an integrated circuit (IC) for a sensor disposed in the through-hole; an encapsulant encapsulating at least portions of the core member and the IC for a sensor; and a connection member disposed on the core member and the IC for a sensor and including a plurality of circuit layers, wherein the circuit layer includes sensing patterns detecting a change in capacitance.