Abstract: A fan-out semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, an encapsulant sealing at least a portion of the inactive surface, a first connection member disposed on the active surface and including a redistribution layer and a first via electrically connecting the connection pad to the redistribution layer, a passivation layer disposed on the first connection member, and an under-bump metal layer including an external connection pad disposed on the passivation layer and a second via connecting the external connection pad to the redistribution layer. In a vertical direction, the first and second vias are disposed within the external connection pad and do not overlap each other.

Abstract: The present disclosure provides a composition for preparing a lightweight transparent composite, a method of preparing a composite using the same, and a composite prepared by the method. The lightweight transparent composite having excellent impact resistance, scratch resistance, weather resistance, and high hardness can be prepared by thermally curing a mixture of a glass fiber reinforcement having a refractive index of 1.4 to 1.6 and a curable resin having a deviation in refractive index of ?0.005 to +0.005 from the glass fiber reinforcement. When the lightweight transparent composite is applied to transparent windows for automobiles, the lightweight transparent composite can be useful in enhancing fuel efficiency, achieving easier handling characteristics due to reduction in vehicle center of gravity, and improving juddering and dimensional stability even during car driving due to excellent hardness.

Abstract: A conductive adhesive includes an adhesive of 80 to 90 wt % and a conductive fiber of 10 to 20 wt %. The conductive adhesive according to the present disclosure has excellent conductivity by mixing the conductive fiber with the one-component adhesive or the two-component adhesive to make electric conduction smoother, and to improve adhesion properties and durability regarding temperature changes.

Abstract: A semiconductor package includes: a connection member having a first surface and a second surface opposing each other in a stacking direction of the semiconductor package and including an insulating member and a redistribution layer formed on the insulating member and having a redistribution via; a semiconductor chip disposed on the first surface of the connection member and having connection pads connected to the redistribution layer; an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip; a passivation layer disposed on the second surface of the connection member; UBM pads disposed on the passivation layer and overlapping the redistribution vias in the stacking direction; and UBM vias connecting the UBM pads to the redistribution layer through the passivation layer, not overlapping the redistribution vias with respect to the stacking direction, and having a non-circular cross section.

Abstract: A method of producing a methacrylate block copolymer includes operations of (a) preparing a polymer solution comprising a methacrylate polymer block by polymerizing a methacrylate monomer using a polymerization initiator and a reversible addition-fragmentation chain transfer (RAFT) agent in the presence of water or an organic solvent; (b) preparing a polymer solution comprising an acrylate polymer block-containing methacrylate diblock copolymer by adding an acrylate monomer and a styrene monomer to the polymer solution prepared in operation (a); (c) preparing a polymer solution comprising a methacrylate polymer block-containing methacrylate triblock copolymer by adding a methacrylate monomer to the polymer solution prepared in operation (b); and (d) collecting a polymer prepared after operations (b) and (c) and removing the RAFT agent present at a terminal of the polymer by using an amine-based organic material.

Abstract: A fan-out semiconductor package includes: a semiconductor chip having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads; a passivation layer disposed on the connection member and having openings exposing at least portions of the redistribution layer; metal members disposed in the openings of the passivation layer and connected to the exposed redistribution layer; and electrical connection structures disposed on the passivation layer and connected to the metal members, wherein the electrical connection structures have heights hierarchically differentiated from one another depending on sizes of the metal members.

Abstract: A fan-out sensor package includes: a core member including a wiring layer including a plurality of layers and having a through-hole; an integrated circuit (IC) for a sensor disposed in the through-hole; an encapsulant encapsulating at least portions of the core member and the IC for a sensor; and a connection member disposed on the core member and the IC for a sensor and including a plurality of circuit layers, wherein the circuit layer includes sensing patterns detecting a change in capacitance.

Abstract: An ultra-low silicon wire for welding having excellent porosity resistance and electrodeposition coating properties is provided. The ultra-low silicon wire for welding having excellent porosity resistance and electrodeposition coating properties includes: by wt %, 0.001 to 0.30% of C; 0.15% or less of Si; 0.50 to 3.00% of Mn; 0.030% or less of P; 0.030% or less of S; and a balance of Fe and inevitable impurities.

Abstract: Provided is a cell-level retinal disease detection apparatus including a light imaging means configured to emit light to an eyeball and a light processing means which receives light reflected by the eyeball and processes and compensates light for an astigmatism aberration thereof which occurs at the eyeball to compensate. Here, the light processing means includes a wavefront sensor which senses the astigmatism aberration of the reflected light which occurs due to the eyeball and a light compensation mirror which compensates the light based on the sensed astigmatism aberration, and compensates for a difference in the astigmatism aberration to detect a disease of a retina of the eyeball.

Abstract: A fan-out semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, an encapsulant sealing at least a portion of the inactive surface, a first connection member disposed on the active surface and including a redistribution layer and a first via electrically connecting the connection pad to the redistribution layer, a passivation layer disposed on the first connection member, and an under-bump metal layer including an external connection pad disposed on the passivation layer and a second via connecting the external connection pad to the redistribution layer. In a vertical direction, the first and second vias are disposed within the external connection pad and do not overlap each other.

Abstract: A data storage device and a method for operating the data storage device are disclosed. The data storage device may include an interface receiving a command and data from a host, a cache temporarily storing the received data, a memory non-temporarily storing the data stored in the cache, and a controller controlling the memory and the cache based on the command received from the host. The command may include charge rate of a battery supplying a power to the data storage device. The controller may determine whether or not the data storage device is an idle state, and determine an active operation mode of the data storage device based on the charge rate of the battery, when the data storage device is the idle state.

Abstract: A fan-out semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, an encapsulant sealing at least a portion of the inactive surface, a first connection member disposed on the active surface and including a redistribution layer and a first via electrically connecting the connection pad to the redistribution layer, a passivation layer disposed on the first connection member, and an under-bump metal layer including an external connection pad disposed on the passivation layer and a second via connecting the external connection pad to the redistribution layer. In a vertical direction, the first and second vias are disposed within the external connection pad and do not overlap each other.

Abstract: Provided is a cell-level retinal disease detection apparatus including a light imaging means configured to emit light to an eyeball and a light processing means which receives light reflected by the eyeball and processes and compensates light for an astigmatism aberration thereof which occurs at the eyeball to compensate. Here, the light processing means includes a wavefront sensor which senses the astigmatism aberration of the reflected light which occurs due to the eyeball and a light compensation mirror which compensates the light based on the sensed astigmatism aberration, and compensates for a difference in the astigmatism aberration to detect a disease of a retina of the eyeball.

Abstract: A robot control system includes: an interface configured to receive a user input; a controller configured to generate a motion command corresponding to the user input and a motion command group including the motion command, and generate hardware interpretable data by analyzing the motion command; and a driver configured to drive a motion of at least one hardware module based on the hardware interpretable data to be interpreted by the at least one hardware module.

Abstract: A bumper back-beam for a vehicle is provided. The bumper back beam includes a glass fiber mat reinforced plastic composite and a carbon fiber reinforced plastic composite disposed within the glass fiber reinforced plastic composite. The glass fiber mat reinforced plastic composite includes polypropylene at about 45 to 60 wt. %, glass fiber at about 35 to 45 wt. %, a crosslink agent at about 0.1 to 10 wt. %, peroxide at 0.1 to 4 wt. %, and an antioxidant at about 0.1 to 4 wt. %. The carbon fiber reinforced plastic composite includes a thermoplastic resin at about 40 to 60 wt. % and a carbon reinforced fiber at about 40 to 60 wt. % arranged in a predetermined direction.

Abstract: A high-flow and high-impact polyolefin resin composition comprises: about 5 to 96% by weight of an isotactic polypropylene-based resin; about 1 to 15% by weight of a low molecular weight atactic polypropylene resin having weight average molecular weight of about 10,000 to 100,000 g/mol; about 1 to 20% by weight of an ultra-high molecular weight atactic polypropylene resin having weight average molecular weight of about 1,000,000 to 2,500,000 g/mol; about 1 to 40% by weight of an inorganic filler; and about 1 to 20% by weight of a rubber.

Abstract: The present disclosure provides a composition for preparing a lightweight transparent composite, a method of preparing a composite using the same, and a composite prepared by the method. The lightweight transparent composite having excellent impact resistance, scratch resistance, weather resistance, and high hardness can be prepared by thermally curing a mixture of a glass fiber reinforcement having a refractive index of 1.4 to 1.6 and a curable resin having a deviation in refractive index of ?0.005 to +0.005 from the glass fiber reinforcement. When the lightweight transparent composite is applied to transparent windows for automobiles, the lightweight transparent composite can be useful in enhancing fuel efficiency, achieving easier handling characteristics due to reduction in vehicle center of gravity, and improving juddering and dimensional stability even during car driving due to excellent hardness.

Abstract: A conductive adhesive includes an adhesive of 80 to 90 wt % and a conductive fiber of 10 to 20 wt %. The conductive adhesive according to the present disclosure has excellent conductivity by mixing the conductive fiber with the one-component adhesive or the two-component adhesive to make electric conduction smoother, and to improve adhesion properties and durability regarding temperature changes.

Abstract: Disclosed are a carbon fiber composite having high conductivity and a method for preparing the same. The carbon fiber composite may comprise a carbon fiber reinforcement material that includes a carbon fiber and a conductive metal-plated carbon fiber, such that the carbon fiber composite may be used when lightning occurs due to its high conductivity. Further, the carbon fiber composite may also achieve lightweight by using the carbon fiber.

Abstract: A bumper back-beam for a vehicle is provided. The bumper back beam includes a glass fiber mat reinforced plastic composite and a carbon fiber reinforced plastic composite disposed within the glass fiber reinforced plastic composite. The glass fiber mat reinforced plastic composite includes polypropylene at about 45 to 60 wt. %, glass fiber at about 35 to 45 wt. %, a crosslink agent at about 0.1 to 10 wt. %, peroxide at 0.1 to 4 wt. %, and an antioxidant at about 0.1 to 4 wt. %. The carbon fiber reinforced plastic composite includes a thermoplastic resin at about 40 to 60 wt. % and a carbon reinforced fiber at about 40 to 60 wt. % arranged in a predetermined direction.