Abstract: An optical semiconductor lighting apparatus including a housing with a first end portion and a second end portion that is open, a light source module disposed in the housing, a fan disposed adjacent to the light source module in the housing, the fan rotating in a first direction to blow air toward the light source module, and a reflector disposed adjacent to the second end portion of the housing, the reflector enhancing an illumination scope. A moving path, in which at least a portion of the air drawn into the housing by the fan externally flows through the light source module, is formed in the housing.

Abstract: A first heat sinking path formed in a forming direction of a heat sink unit disposed radially in a housing where a light emitting module is mounted. A second heat sinking path is formed along an edge of the light emitting module. By providing a light engine concept in which a light emitting module, an optical member, and a heat sink unit are included and a bottom surface is gradually widened from one side to the other side, an optical semiconductor lighting apparatus can reduce a total weight of a product, can further improve heat dissipation efficiency by inducing natural convection, is simple in the product assembly and installation, and is easy in maintenance, and can provide products with high reliability by increasing the arrangement efficiency of semiconductor optical devices per unit area.

Abstract: The lighting device comprising: a reflector comprising a reflective part; a heat radiating body comprising a wall disposed around the reflective part of the reflector, wherein the wall comprises a bottom surface and a top surface; a light emitter comprising a substrate disposed on the bottom surface of the wall of the heat radiating body and a plurality of light emitting devices disposed on the substrate; and a cover comprising a reflective surface disposed under the bottom surface and reflecting a first light from the light emitting devices to the reflective part of the reflector, and having an opening emitting a second light from the reflective part of the reflector to outside.

Abstract: An optical semiconductor lighting apparatus includes: a light emitting module including one or more semiconductor optical devices; a switching mode power supply (SMPS) connected to the light emitting module; a housing disposed to be adjacent to the light emitting module, in which the housing has both ends opened and accommodates the SMPS; a first heat dissipation unit disposed at an inner side of the housing; and a second heat dissipation unit disposed radially at an outer side of the housing and formed from an outer side of one end portion of the housing to the edge of the light emitting module. The first heat dissipation unit includes a plurality of heat dissipation plates through which the heat pipe penetrates, and a plurality of vent portions formed on the heat dissipation plates.

Abstract: The lighting apparatus includes a body including a recess which is defined by an inner wall; a reflector which is disposed within the recess of the body and faces the inner wall of the body, and includes a reflective surface reflecting light to the outside of the recess of the body; and a light source which is disposed within the recess of the body and emits light toward the reflective surface of the reflector.

Abstract: A first heat sinking path formed in a forming direction of a heat sink unit disposed radially in a housing where a light emitting module is mounted. A second heat sinking path is formed along an edge of the light emitting module. By providing a light engine concept in which a light emitting module, an optical member, and a heat sink unit are included and a bottom surface is gradually widened from one side to the other side, an optical semiconductor lighting apparatus can reduce a total weight of a product, can further improve heat dissipation efficiency by inducing natural convection, is simple in the product assembly and installation, and is easy in maintenance, and can provide products with high reliability by increasing the arrangement efficiency of semiconductor optical devices per unit area.

Abstract: A light emitting diode array including apertures, a line printer head using the light emitting diode array, and a method of manufacturing the light emitting diode array. The light emitting diode array includes the apertures that are formed in a substrate and restrict tunnels of light emitted from a plurality of light emitting diodes. Also, a lens that refracts the light transmitted through the plurality of apertures is included.

Abstract: A lighting device including a heat radiating body defining a cavity and a circumference, a reflective structure within the cavity, a light emitting module unit on the circumference of the heat radiating body, and a cover disposed under the light emitting module unit and reflecting light emitted from the light emitting module unit to the reflective structure, such light then being reflected by the reflective structure to the outside of the heat radiating body.

Abstract: A shadow mask, a method of manufacturing the shadow mask, and a method of forming a thin film using the shadow mask are provided. The shadow mask includes an upper layer and a lower layer. The upper layer includes a first opening. The lower layer is formed on a lower surface of the upper layer around the first opening and includes an opening having the same size as the first opening. When the thin film is formed using the shadow mask, the lower layer of the shadow mask is close to the edge of a cavity of a substrate, and a position on which the thin film may be formed as defined by the lower layer of the shadow mask. Therefore, the thickness of the thin film can be uniform.

Abstract: A lens integrated light emitting diode array, a line printer head using the light emitting diode array, and a method of manufacturing the light emitting diode array. The light emitting diode array includes a plurality of light emitting diodes formed on a surface of a transparent substrate and a plurality of lenses formed on another surface opposite to the surface of the transparent substrate, wherein the plurality of light emitting diodes are divided into a plurality of groups to be arranged to respectively correspond to the plurality of lenses.

Abstract: Disclosed is a lighting device. The lighting device includes: a substrate; a light emitting device disposed on the substrate; a driving unit supplying electric power to the light emitting device and connected to the substrate through a conductive line; a heat radiating body radiating heat from the light emitting devices and comprising a hole through which the conductive line to pass; and an insulator coupled with the hole and having a opening.

Abstract: The lighting apparatus comprises: a first and a second light sources comprising a plurality of a light emitting devices disposed on one side of a substrate respectively; a heat radiating body which radiates heat from the plurality of the light emitting devices, comprises a space for housing the first and the second light source, and comprises an opening allowing light emitted from the plurality of the light emitting devices of the first and the second light sources to be emitted; and, a reflector being disposed on the heat radiating body and comprising a reflective surface for reflecting the light emitted from the light emitting devices of the first and the second light sources to the opening of the heat radiating body, and wherein the reflective surface of the reflector comprises two surfaces, and wherein the ends of the two surfaces are in contact with each other at a predetermined angle.

Abstract: An optical semiconductor based illuminating apparatus including a housing having an opening portion, a lighting unit disposed adjacent to the housing that includes at least one optical semiconductor, a power supply mounted within the housing that supplies power to the lighting unit, and a gate unit connected to the opening part that opens and shuts the inner housing.

Abstract: The present invention relates to a luminous element, and more particularly, to a luminous element for a backlight unit with a plurality of luminous chips mounted on a substrate. The present invention provides a luminous element for a backlight unit, in which luminous chips are arranged on a substrate so that the manufacturing process and cost can be reduced and the size of a substrate is minimized when manufacturing the luminous element, thereby minimizing the size of a backlight unit. Further, the present invention provides a luminous element for a backlight unit, in which luminance uniformity can be increased by optimizing the viewing angle of the luminous element.

Abstract: The lighting apparatus comprises: a first and a second light sources comprising a plurality of a light emitting devices disposed on one side of a substrate respectively; a heat radiating body which radiates heat from the plurality of the light emitting devices, comprises a space for housing the first and the second light source, and comprises an opening allowing light emitted from the plurality of the light emitting devices of the first and the second light sources to be emitted; and, a reflector being disposed on the heat radiating body and comprising a reflective surface for reflecting the light emitted from the light emitting devices of the first and the second light sources to the opening of the heat radiating body, and wherein the reflective surface of the reflector comprises two surfaces, and wherein the ends of the two surfaces are in contact with each other at a predetermined angle.

Abstract: The lighting apparatus includes a body including a recess which is defined by an inner wall; a reflector which is disposed within the recess of the body and faces the inner wall of the body, and includes a reflective surface reflecting light to the outside of the recess of the body; and a light source which is disposed within the recess of the body and emits light toward the reflective surface of the reflector.

Abstract: Disclosed is a lighting apparatus. The lighting apparatus includes: a first and a second light emitting diode (LED) module including a plurality of LEDs disposed on one side of a substrate respectively; a heat radiating body which radiates heat from the plurality of the LEDs, includes a space for housing the first and the second LED modules, and includes an opening allowing light emitted from the plurality of the LEDs of the first and the second LED modules to be emitted; and, a reflector being disposed on the heat radiating body and reflecting the light emitted from the plurality of the LEDs of the first and the second LED modules to the opening.

Abstract: The lighting apparatus includes a first light emitting diode (LED) module, a second LED module and a reflector. The first LED module includes a first plurality of LEDs disposed on one side of a first substrate. The second LED module includes a second plurality of LEDs disposed on one side of a second substrate. The reflector is disposed between the first LED module and the second LED module and may reflect in a light emission direction light emitted from the plurality of the LEDs. Additionally, when the light emitted from the plurality of the LEDs is reflected by a reflective surface of the reflector, and is projected to a plane, images of outermost light sources are distributed on the plane to substantially have a circular shape.

Abstract: Disclosed is a backlight panel employing a white light emitting diode. The white light emitting diode includes a blue light emitting diode chip and red and green phosphors positioned over the blue light emitting diode chip. Accordingly, since the backlighting can be performed using white light with distinct red, green and blue wavelengths, the color reproducibility can be enhanced. Further, since the white light can be implemented with a single light emitting diode, the manufacturing costs and thickness of the backlight panel can also be reduced.