Abstract: A micro electro mechanical system (MEMS) device is provided. The MEMS device includes: a stage which operates in a vibration mode; an axle which supports the stage and allows rotation of the stage; and a capacitive sensor which detects rotation of the stage. The capacitive sensor includes: a sensing arm which extends from the stage; driving combs which extend from the sensing arm and rotated together with the stage; fixed combs which are fixedly supported for engagement with the driving combs, the fixed combs including surfaces overlapping opposite surfaces of the driving combs in accordance with the rotation of the driving combs; and a capacitance sensing portion which detects a capacitance change of the driving combs and the fixed combs. Therefore, the MEMS device performs precise scanning by structurally preventing deformation of the stage having a light reflecting surface.

Abstract: A micro-electro mechanical system (MEMS) device and a method of forming comb electrodes of the MEMS device are provided.

Abstract: A method of etching decoupled comb electrodes by self-alignment is provided The etching method is a self-alignment etching method for forming upper comb electrodes in a first silicon layer of a silicon on insulator (SOI) substrate and lower comb electrodes in a second silicon layer of the SOI substrate.

Abstract: A mirror structure and an optical scanner having the same which may achieve a high resolution since dynamic deformation is small while having a large driving angle. A plurality of vertical ribs are formed in a rear of the mirror of a scanner that reflects light, and are vertical to a torsional axis which is a center of vibration of the mirror. A horizontal rib is spaced apart from the torsional axis by a predetermined distance, and vertical to the vertical ribs. Optimum design parameters such as a size of the mirror, a moment of inertia, a driving angle, and dynamic deformation which are relevant to each other may be derived. Accordingly, the mirror may rotate at high speed and emit an image signal to a precise location.

Abstract: Method for fabricating a gyroscope including: fabricating a SMS wafer where a first wafer, a metal film, and a second wafer are sequentially stacked; forming a cantilever or a bridge shaped-structure on the relevant portion of the first wafer through the photolithography process; attaching to the surface of the first wafer, a first cap made of glass and having a predetermined space for sealing the movable structure in a vacuum state; separating and removing the metal film and the second wafer from the first wafer; and attaching to the backside of the first wafer, the second cap which is structurally and materially symmetric to the first cap. The SMS wafer is fabricated by depositing the metal film on the second wafer and bonding the first wafer on the metal film using metal paste or material of polymer series. With lower material costs, improvements in performance and characteristics can be achieved.

Abstract: A method and apparatus for vacuum-mounting at least one micro electro mechanical system (MEMS) on a substrate includes a gas injecting section for injecting an inert gas into a vacuum chamber; a substrate aligning section for aligning a semiconductor substrate and a cover, the cover having a cavity formed therein and a getter attached to an interior surface of the cavity; a bonding section for bonding the semiconductor substrate and the cover together; and a controlling section for controlling the substrate aligning section to align the semiconductor and the cover, for controlling the gas injecting section to inject the inert gas into the vacuum chamber, and for controlling the bonding section to bond the semiconductor substrate and the cover together after the inert gas is injected.

Abstract: A method of manufacturing a floating structure capable of providing increased device yield. The method includes: a) forming an insulation film, a predetermined area of which is removed, between a first substrate and a second substrate; and b) forming a floating structure in the removed predetermined area.

Abstract: A method of forming a via hole through a glass wafer includes depositing a material layer on an outer surface of the glass wafer, the material layer having a selection ratio higher than that of the glass wafer, forming a via-patterned portion on one side of the material layer, performing a first etching in which the via-patterned portion is etched to form a preliminary via hole, eliminating any remaining patterning material used in the formation of the via-patterned portion, performing a second etching in which the preliminary via hole is etched to form a via hole having a smooth surface and extending through the glass wafer, and eliminating the material layer. The method according to the present invention is able to form a via hole through a glass wafer without allowing formation of an undercut or minute cracks, thereby increasing the yield and reliability of MEMS elements.

Abstract: A rotary gyroscope includes a base plate, an intermediate structure, including a driven element floating over the base plate and supported by a driving supporter radially extending therefrom, the driven element performing an oscillating motion with respect to a first axis, which is normal to a center plane thereof, a driving electrode driving the driven element, and a sensing element disposed in the driven element and connected to the driven element by a sensing connector to oscillate together with the driven element and concurrently to perform a sensing motion with respect to a third axis, which is normal to the first axis and any second axis, which is parallel to a center plane, due to a Coriolis force when an angular velocity is inputted from the second axis, and a cover covering the intermediate structure and having a sensing electrode to detect the sensing motion of the sensing element.

Abstract: A vertical MEMS gyroscope by horizontal driving includes a substrate, a support layer fixed on an upper surface of an area of the substrate, a driving structure floating above the substrate and having a portion fixed to an upper surface of the support layer and another portion in parallel with the fixed portion, the driving structure having a predetermined area capable of vibrating in a predetermined direction parallel to the substrate, a detecting structure fixed to the driving structure on a same plane as the driving structure, and having a predetermined area capable of vibrating in a vertical direction with respect to the substrate, a cap wafer bonded with the substrate positioned above the driving structure and the detecting structure, and a fixed vertical displacement detection electrode formed at a predetermined location of an underside of the cap wafer, for detecting displacement of the detecting structure in the vertical direction.

Abstract: Method for fabricating a gyroscope including: fabricating a SMS wafer where a first wafer, a metal film, and a second wafer are sequentially stacked; forming a cantilever or a bridge shaped-structure on the relevant portion of the first wafer through the photolithography process; attaching to the surface of the first wafer, a first cap made of glass and having a predetermined space for sealing the movable structure in a vacuum state; separating and removing the metal film and the second wafer from the first wafer; and attaching to the backside of the first wafer, the second cap which is structurally and materially symmetric to the first cap. The SMS wafer is fabricated by depositing the metal film on the second wafer and bonding the first wafer on the metal film using metal paste or material of polymer series. With lower material costs, improvements in performance and characteristics can be achieved.

Abstract: A metal wiring method for an undercut in a MEMS packaging process includes disposing a MEMS element on a silicon substrate, welding a glass wafer to an upper portion of the silicon substrate having the MEMS element disposed thereon, the glass wafer having a hole formed therein for connecting a metal wiring, depositing a thin metal film for the metal wiring in the hole, and ion-mealing the deposited thin metal film. By the ion-mealing, the method is capable of connecting a metal wiring to a via hole having an undercut.

Abstract: A golf putter having a virtual hitting face frontward offset from an actual hitting face of a putter head is disclosed. The golf putter comprises a putter head having a hitting face, a toe part and a heel part, a hosel connected on the putter head, a shaft which is formed with a grip at an upper end thereof, a shaft receiving part connected to the hosel to receive a lower end of the shaft; and a virtual hitting position decision plate which, when a golfer look downward at the hitting face, covers the hitting face, and has a virtual hitting face at a position forwardly offset from the hitting face.

Abstract: A rotary gyroscope includes a base plate, an intermediate structure, including a driven element floating over the base plate as supported by a driving supporter radially extending therefrom, the driven element performing an oscillating motion with respect to a first axis, which is vertical to a center plane thereof, a driving electrode driving the driven element, and a sensing element disposed in the driven element and connected to the driven element by a sensing connector to oscillate together with the driven element and concurrently to perform a sensing motion with respect to a third axis, which is vertical to the first axis and any second axis, which is parallel to a center plane, due to a Coriolis force when an angular velocity is inputted from the second axis, and a cover covering the intermediate structure and having a sensing electrode to detect the sensing motion of the sensing element.

Abstract: A vertical MEMS gyroscope by horizontal driving includes a substrate, a support layer fixed on an upper surface of an area of the substrate, a driving structure floating above the substrate and having a portion fixed to the upper surface of the support layer and another portion in parallel with the fixed portion, the driving structure having a predetermined area capable of vibrating in a predetermined direction parallel to the substrate, a detection structure fixed to the driving structure on a same plane as the driving structure, and having a predetermined area capable of vibrating in a vertical direction with respect to the substrate, a cap wafer bonded with the substrate positioned above the driving structure and the detection structure, and a fixed vertical displacement detection electrode formed at a predetermined location of an underside of the cap wafer, for detecting displacement of the detection structure in the vertical direction.

Abstract: A metal wiring method for an undercut in a MEMS packaging process includes disposing a MEMS element on a silicon substrate, welding a glass wafer to an upper portion of the silicon substrate having the MEMS element disposed thereon, the glass wafer having a hole formed therein for connecting a metal wiring, depositing a thin metal film for the metal wiring in the hole, and ion-mealing the deposited thin metal film. By the ion-mealing, the method is capable of connecting a metal wiring to a via hole having an undercut.

Abstract: A high-vacuum packaged microgyroscope for detecting the inertial angular velocity of an object and a method for manufacturing the same. In the high-vacuum packaged microgyroscope, a substrate with an ASIC circuit for signal processing is mounted onto another substrate including a suspension structure of a microgyroscope in the form of a flip chip. Also, the electrodes of the suspension structure and the ASIC circuit can be exposed to the outside through polysilicon interconnection interposed between double passivation layers. The short interconnection between the suspension structure and the ASIC circuit can reduce the device in size and prevents generation of noise, thereby increasing signal detection sensitivity. In addition, by sealing the two substrates at low temperatures, for example, at 363 to 400° C. using co-melting reaction between metal, for example, Au, and Si in a vacuum, the degree of vacuum in the device increases.

Abstract: A method and apparatus for vacuum-mounting at least one micro electro mechanical system (MEMS) on a substrate includes a gas injecting section for injecting an inert gas into a vacuum chamber; a substrate aligning section for aligning a semiconductor substrate and a cover, the cover having a cavity formed therein and a getter attached to an interior surface of the cavity; a bonding section for bonding the semiconductor substrate and the cover together; and a controlling section for controlling the substrate aligning section to align the semiconductor and the cover, for controlling the gas injecting section to inject the inert gas into the vacuum chamber, and for controlling the bonding section to bond the semiconductor substrate and the cover together after the inert gas is injected.

Abstract: A method of forming a via hole through a glass wafer includes depositing a material layer on an outer surface of the glass wafer, the material layer having a selection ratio higher than that of the glass wafer, forming a via-patterned portion on one side of the material layer, performing a first etching in which the via-patterned portion is etched to form a preliminary via hole, eliminating any remaining patterning material used in the formation of the via-patterned portion, performing a second etching in which the preliminary via hole is etched to form a via hole having a smooth surface and extending through the glass wafer, and eliminating the material layer. The method according to the present invention is able to form a via hole through a glass wafer without allowing formation of an undercut or minute cracks, thereby increasing the yield and reliability of MEMS elements.

Abstract: A micro-electro mechanical system (MEMS) switch having a single anchor is provided. The MEMS switch includes a substrate; grounding lines installed on the substrate to be distant away from each other; signal transmission lines positioned at predetermined intervals between the grounding lines; an anchor placed between the signal transmission lines; a driving electrode that encircles the anchor while not being in contact with the anchor, the signal transmission lines and the grounding lines; and a moving plate that is positioned on the driving electrode to be overlapped with portions of the signal transmission lines, and connected to the anchor elastically.