Abstract: Disclosed is a method of fabricating a PCB including an embedded passive chip, in which the passive chip is mounted on the PCB and an insulator is then laminated on the PCB, or in which a blind hole for receiving the passive chip is formed in the PCB and the passive chip is mounted in the blind hole.

Abstract: Disclosed herein are a printed circuit board with embedded capacitors therein and a process for manufacturing the printed circuit board. The embedded capacitors are formed by applying a photosensitive insulating resin to a printed circuit board inner layer, and applying a high dielectric polymer capacitor paste thereto.

Abstract: Disclosed is a method of producing a printed circuit board (PCB) with an embedded resistor, in which a resistor with a desired shape and volume is precisely formed using a resistor paste so that resistance values according to a position of the PCB are uniform, thereby a laser trimming process is omitted or minimally utilized. The method has advantages in that a production time of the PCB is shortened and productivity is improved because an operation condition is rapidly set without being greatly affected by the position precision of a printing device. Other advantages of the method are that the resistor paste with a relatively uniform thickness is secured through a screen printing process, thereby easily forming the resistor and improving resistance tolerance.

Abstract: Disclosed herein are a printed circuit board with embedded capacitors therein and a process for manufacturing the printed circuit board. The embedded capacitors are formed by applying a photosensitive insulating resin to a printed circuit board inner layer, and applying a high dielectric polymer capacitor paste thereto.

Abstract: Disclosed herein is a printed circuit board with embedded capacitors therein which comprises inner via holes filled with a high dielectric polymer capacitor paste composed of a composite of BaTiO3 and an epoxy resin, and a process for manufacturing the printed circuit board.

Abstract: Disclosed is a printed circuit board which is advantageous in terms of high capacitance by embedding capacitors comprising polymer capacitor pastes with high-dielectric constant coated on an inner layer of the printed circuit board and then semi-dried to a state of B-stage.

Abstract: Disclosed herein are a printed circuit board with embedded capacitors therein and a process for manufacturing the printed circuit board. The embedded capacitors are formed by applying a photosensitive insulating resin to a printed circuit board inner layer, and applying a high dielectric polymer capacitor paste thereto.

Abstract: Disclosed are a PCB with buried or embedded resistors and a method for manufacturing the same. The PCB comprises: a resinous, electrically insulating substrate; a circuit pattern formed on the substrate; at least a pair of spaced resistor terminations, formed in a certain pattern on the substrate, each comprising a metal pad covered with a conductive protective layer; a thin-film resistor formed between the resistor terminations with electrical connection thereto; and an over-coating layer formed of one-part ink, covering the resistor and the resistor terminations. To be provided with a desired resistance, optionally, the resistor may be grooved by laser trimming. The PCB can have a desired resistor resistance which is uniform without being affected by environmental factors.

Abstract: The present invention relates to a novel pharmaceutical composition of a self-emulsifying matrix preparation, which is a preparation for transmucosal or transdermal absorption in which a self-emulsifying drug delivery system is grafted to a polymeric matrix preparation. For this, fatty alcohol, fatty acid or their derivatives of 6 to 20 carbon atoms having a drug absorption-accelerating action through the skin or mucous membrane is used as an oil phase. Also, to increase the drug content in the matrix, a liquid phase material having a boiling point of 100° C. or more is used as a solution adjuvant. Using such materials, the self-emulsifying system with a surfactant is prepared. A hydrophilic or hydrophobic polymer is added and dissolved in the self-emulsifying system, and the resulting mixture is dried to prepare the matrix preparation containing the self-emulsifying system.