Abstract: Disclosed is an accelerator which includes a first to a K-th stage performing an NTT (Number Theoretic Transform) operation of first input data including a polynomial of a homomorphic ciphertext, the first to K-th stages being connected in series, and a first assist circuit generating a first to a K-th enable signal based on a degree of the polynomial of the first input data. Each of the first to K-th stages performs a butterfly operation of the first input data or corresponding output data of a previous stage in response to that the corresponding enable signal among the first to K-th enable signals indicates a first logical value, and bypasses the first input data or the corresponding output data of the previous stage in response to that the corresponding enable signal among the first to K-th enable signals indicates a second logical value.

Abstract: A surface-treated inorganic nanoparticle including an inorganic nanoparticle, a first dispersant connected to the inorganic nanoparticle, and a second dispersant connected to the inorganic nanoparticle, wherein a molecular weight (MW) of the first dispersant is different from a molecular weight (MW) of the second dispersant.

Abstract: A lens module is provided. The lens module includes at least one refractive index distribution lens; and a lens barrel configured to accommodate the at least one refractive index distribution lens, wherein the at least one refractive index distribution lens is composed of a single layer, and includes a plastic material.

Abstract: A lens includes an optical unit, and a rib unit extending outwardly in a radial direction of the optical portion, wherein the rib unit includes a light transmitting region and a light blocking region, and the light blocking region is disposed in the rib unit.

Abstract: A lens device includes a lens including an optical unit, and a rib portion extending outwardly of the optical unit in a radial direction, where the rib portion includes a light transmission region and a light blocking region, and where the light blocking region is disposed inside of the rib portion. The light blocking region may include a non-polar colorant. The lens may include a cyclic olefin compound. The lens device may include one or more lenses with rib portions with light transmission regions and light blocking regions, and may be a lens assembly with the one or more lenses.

Abstract: The present disclosure relates to a light emitting module and a display apparatus using the same. Specifically, one embodiment of the present disclosure provides a light emitting module including: a light emitting structure configured to emit light; and a light transmitting layer configured to transmit light emitted from the light emitting structure, wherein the light transmitting layer has a light scattering region in which one or more voids for refracting the light are formed.

Abstract: A lens includes a lens unit, an uneven layer formed on at least a portion of a surface of the lens unit, a buffer layer covering the uneven layer and having a shape conforming to an uneven surface of the uneven layer, and a water-repellent layer covering the buffer layer.

Abstract: A lens module is provided. The lens module includes at least one refractive index distribution lens; and a lens barrel configured to accommodate the at least one refractive index distribution lens, wherein the at least one refractive index distribution lens is composed of a single layer, and includes a plastic material.

Abstract: A lens includes a light-transmitting portion and a light-shielding portion adjacent to at least a portion of the light-transmitting portion and integrated with the light-transmitting portion. The light-shielding portion includes at least one of carbon nanotubes and carbon black.

Abstract: The present disclosure relates to a gas injection stabilization device and comprises: a fixed volume part having a first gas space with a fixed volume; at least one variable volume part which is in communication with the fixed volume part, and which has a volume that varies due to a gas introduced to and discharged from the fixed volume part, and which has a second gas space connected to the first gas space; a gas supply part which is connected to the fixed volume part and receives a supply of a gas from an external gas supply device; and a gas discharge part which is connected to the fixed volume part and discharges a gas to an external surgical space.

Abstract: A method of dyeing a lens, and a method of manufacturing a lens assembly is provided. The method includes an operation of dipping the lens in a dyeing solution containing a non-polar dye.

Abstract: A semiconductor package includes a semiconductor chip having an active surface, on which a connection pad is disposed, and an inactive surface disposed to oppose the active surface, a heat dissipation member, disposed on the inactive surface of the semiconductor chip, having a plurality of holes and including a graphite-based material, an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member, and a connection member, disposed on the active surface of the semiconductor chip, including a redistribution layer electrically connected to the connection pad. 0<b<0.6a, in which “a” denotes a planar area of the heat dissipation member and “b” denotes a sum of planar areas of the plurality of holes on a plane.

Abstract: A semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface; a heat dissipation member disposed on the inactive surface of the semiconductor chip and including a graphite material; an adhesive member disposed between the semiconductor chip and the heat dissipation member; an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member; and an interconnect structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad. The encapsulant covers at least a portion of aside surface of the adhesive member.

Abstract: An insulating film includes an insulating layer and a surface bonding layer disposed on the insulating layer. The surface bonding layer includes a radical generation element and a coordinate bond element. In the surface bonding layer, a/b is 0.05 or more and 0.35 or less, in which ‘a’ is an atom content of the coordinate bond element and ‘b’ is an atom content of the radical generation element.

Abstract: A lens assembly includes a lens barrel formed of a first material, and a lens holder coupled to the lens barrel and formed of a second material, wherein a bonding portion in which the lens barrel and the lens holder are bonded to each other includes a mixed layer in which the first material and the second material are mixed with each other, and the bonding portion includes one or more voids.

Abstract: A photoresist developer composition contains: a quaternary alkyl ammonium compound; and a corrosion inhibitor. The corrosion inhibitor contains a silane-based compound and an azole-based compound A manufacturing method of a semiconductor package includes using the photoresist developer composition.

Abstract: A camera module includes a lens module including a lens, and a base module configured to accommodate the lens module therein. A fluorinated lubricant is disposed on a portion of at least one of the lens module and the base module, the fluorinated lubricant includes a fluorescent material capable of emitting fluorescent light when illuminated with ultraviolet (UV) light.

Abstract: A semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface; a heat dissipation member disposed on the inactive surface of the semiconductor chip and including a graphite material; an adhesive member disposed between the semiconductor chip and the heat dissipation member; an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member; and an interconnect structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad. The encapsulant covers at least a portion of aside surface of the adhesive member.

Abstract: A semiconductor package includes a semiconductor chip having an active surface, on which a connection pad is disposed, and an inactive surface disposed to oppose the active surface, a heat dissipation member, disposed on the inactive surface of the semiconductor chip, having a plurality of holes and including a graphite-based material, an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member, and a connection member, disposed on the active surface of the semiconductor chip, including a redistribution layer electrically connected to the connection pad. 0<b<0.6a, in which “a” denotes a planar area of the heat dissipation member and “b” denotes a sum of planar areas of the plurality of holes on a plane.

Abstract: A fan-out semiconductor package includes a connection member including an insulating layer and a redistribution layer, a semiconductor chip disposed on the connection member, an encapsulant encapsulating the semiconductor chip, and an electromagnetic radiation blocking layer disposed above the semiconductor chip and including a base layer in which a plurality of degassing holes are formed and a porous blocking portion filled in the plurality of degassing holes.