Abstract: A semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface; a heat dissipation member disposed on the inactive surface of the semiconductor chip and including a graphite material; an adhesive member disposed between the semiconductor chip and the heat dissipation member; an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member; and an interconnect structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad. The encapsulant covers at least a portion of aside surface of the adhesive member.

Abstract: A semiconductor package includes a semiconductor chip having an active surface, on which a connection pad is disposed, and an inactive surface disposed to oppose the active surface, a heat dissipation member, disposed on the inactive surface of the semiconductor chip, having a plurality of holes and including a graphite-based material, an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member, and a connection member, disposed on the active surface of the semiconductor chip, including a redistribution layer electrically connected to the connection pad. 0<b<0.6a, in which “a” denotes a planar area of the heat dissipation member and “b” denotes a sum of planar areas of the plurality of holes on a plane.

Abstract: A fan-out semiconductor package includes a connection member including an insulating layer and a redistribution layer, a semiconductor chip disposed on the connection member, an encapsulant encapsulating the semiconductor chip, and an electromagnetic radiation blocking layer disposed above the semiconductor chip and including a base layer in which a plurality of degassing holes are formed and a porous blocking portion filled in the plurality of degassing holes.

Abstract: A fan-out semiconductor package includes a semiconductor chip having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, a heat dissipation member attached to the inactive surface of the semiconductor chip and having a thickness greater than a thickness of the semiconductor chip, an encapsulant encapsulating at least a portion of each of the semiconductor chip and the heat dissipation member, and a connection member disposed on the active surface of the semiconductor chip and including redistribution layers electrically connected to the connection pads, wherein the heat dissipation member is a complex of carbon and a metal.

Abstract: A lens assembly includes a lens barrel formed of a first material, and a lens holder coupled to the lens barrel and formed of a second material, wherein a bonding portion in which the lens barrel and the lens holder are bonded to each other includes a mixed layer in which the first material and the second material are mixed with each other, and the bonding portion includes one or more voids.

Abstract: A camera module includes a lens module including a lens, and a base module configured to accommodate the lens module therein. A fluorinated lubricant is disposed on a portion of at least one of the lens module and the base module, the fluorinated lubricant includes a fluorescent material capable of emitting fluorescent light when illuminated with ultraviolet (UV) light.

Abstract: A fan-out semiconductor package includes a semiconductor chip having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, a heat dissipation member attached to the inactive surface of the semiconductor chip and having a thickness greater than a thickness of the semiconductor chip, an encapsulant encapsulating at least a portion of each of the semiconductor chip and the heat dissipation member, and a connection member disposed on the active surface of the semiconductor chip and including redistribution layers electrically connected to the connection pads, wherein the heat dissipation member is a complex of carbon and a metal.

Abstract: A fan-out semiconductor package includes a connection member including an insulating layer and a redistribution layer, a semiconductor chip disposed on the connection member, an encapsulant encapsulating the semiconductor chip, and an electromagnetic radiation blocking layer disposed above the semiconductor chip and including a base layer in which a plurality of degassing holes are formed and a porous blocking portion filled in the plurality of degassing holes.

Abstract: A fan-out semiconductor package includes a core member having a through-hole; a semiconductor chip disposed in the through-hole of the core member and having an active surface on which connection pads are disposed and an inactive surface disposed to oppose the active surface; a heat radiating member directly bonded to the inactive surface of the semiconductor chip; an encapsulant encapsulating at least a portion of the semiconductor chip; and a connection member disposed on the active surface of the semiconductor chip and including redistribution layers electrically connected to the connection pads of the semiconductor chip.

Abstract: A photoresist developer composition contains: a quaternary alkyl ammonium compound; and a corrosion inhibitor. The corrosion inhibitor contains a silane-based compound and an azole-based compound A manufacturing method of semiconductor package includes using the photoresist developer composition.

Abstract: A cleaning composition contains: 0.5 to 5 wt % of an acid; 1 to 20 wt % of an amine-based compound; 0.2 to 5 wt % of a corrosion inhibitor including a silane-based compound; and a balance of pure water. A cleaning composition contains: 1 to 10 wt % of a quaternary alkyl ammonium compound; 0.5 to 5 wt % of a corrosion inhibitor including at least one selected from the group consisting of a silane-based compound, an ammonium nitrate compound, and an ammonium phosphate compound; and a balance of pure water.

Abstract: An exemplary embodiment of the present invention provides a cooling device including: a tub which is disposed above a cooling target and has an accommodation space that accommodates a coolant supplied from the outside; and spray nozzles which are installed in the accommodation space, each of the spray nozzles having one or more coolant inlet ports into which the coolant flows, the spray nozzles being disposed to be spaced apart from a central portion of the accommodation space toward an edge portion of the accommodation space, and the spray nozzles spraying the coolant, which flows in through the coolant inlet port, toward the cooling target, in which heights of the coolant inlet ports are in proportion to distances at which the spray nozzles are spaced apart from the central portion of the accommodation space.

Abstract: A mattress and a method of adjusting the pressure of a mattress are provided. The method includes a first process of measuring internal pressure before a user lies on a mattress having at least two zones in which cells having a closed inner space filled with fluid are formed, a second process of measuring an increase in the internal pressure of each cell occurring when the user lies on the mattress, and an average pressure adjusting process of adjusting an amount of the fluid introduced into each cell of the mattress based on a pressure variation caused by a difference between the internal pressure detected from each cell in the first process and the internal pressure detected from each cell in the second process.

Abstract: A mattress and a method of adjusting the pressure of a mattress are provided. The method includes a first process of measuring internal pressure before a user lies on a mattress having at least two zones in which cells having a closed inner space filled with fluid are formed, a second process of measuring an increase in the internal pressure of each cell occurring when the user lies on the mattress, and an average pressure adjusting process of adjusting an amount of the fluid introduced into each cell of the mattress based on a pressure variation caused by a difference between the internal pressure detected from each cell in the first process and the internal pressure detected from each cell in the second process.

Abstract: Disclosed herein is a method for repairing a via in which a dimple phenomenon occurs, in the case in which a dimple error occurs at the time of a process of forming the via used for electrically connecting between layers of a multi-layers circuit board. The method for repairing a via according to an exemplary embodiment of the present invention includes judging whether or not a dimple error occurs in a via; and repairing the via in which the dimple error occurs.

Abstract: Disclosed herein is a solder paste droplet ejection apparatus including: a nozzle cap forming an appearance and including a heating electric wire provided inside thereof; a nozzle unit formed inside the nozzle cap, spaced apart from the nozzle cap, and surrounded by the nozzle cap; an ejection probe formed inside the nozzle unit, spaced apart from the nozzle unit, and surrounded by the nozzle unit; and a transfer unit formed in a top portion of the nozzle cap and used for a minute movement, wherein a solder paste supplied in a space between the nozzle unit and the ejection probe is ejected in a droplet shape along the ejection probe.

Abstract: Disclosed herein are a solder sheet and a soldering method using the same. The solder sheet includes: a plurality of solder rods arranged to have a uniform height h and an area density N; and a support having an adhesive formed on one surface thereof and supporting the plurality of solder rods such that one end of each of the plurality of solder rods is attached to be perpendicular to the surface on which the adhesive is formed. Solder bumps can be formed on soldering portions of the substrate by using the solder sheet through a single process without a mask, and thus, the process can be simplified, costs can be reduced, and a defect rate can be lowered, thereby enhancing reliability.

Abstract: Disclosed herein is a reflow inspection system. The reflow inspection system according to an embodiment of the present invention includes an oven, a stage on which a reflow inspection target is placed inside the oven, and which includes a temperature detecting sensor for detecting a temperature of the reflow inspection target formed on one side thereof; a light source unit formed on one side of the oven and irradiating the reflow inspection target with light, an imaging unit sucking smoke generated in the reflow inspection target, and obtaining image information of the reflow inspection target to thereby transmit the obtained image information to the outside, an image processing unit processing the image information obtained in the imaging unit, and a control unit connected to the stage, the temperature detecting sensor, and the image processing unit to perform control of a reflow inspection process.

Abstract: Disclosed herein is a nano-patterning system including a nano-patterning apparatus. The nano-patterning apparatus includes: a holder unit including a transfer unit and an insulating unit; a tip unit inserted into the holder unit, downwardly protruded, and having a flow channel; a flow path having one end connected to the flow channel through one side of the transfer unit or the insulating unit and extending to the outside to serve as a movement path allowing a nano-patterning material to move therealong; a pressing unit pressing the nano-patterning material at one side of the flow path; and a storage unit connected to the other end of the flow path and storing the nano-patterning material.

Abstract: Disclosed herein is a specimen conveyance apparatus including: a main body having a plate-like shape and including a storage chamber having a recess-like shape formed thereon; a cover member covering the main body; a sealing member inserted between the main body and the cover member and blocking the storage chamber and the outside; a suction pipe installed within the main body, having a suction valve, and sucking external air; a filter installed within the main body, removing a reactive gas and particulate foreign material from air sucked through the suction pipe, and allowing an inert gas to pass therethrough toward the storage chamber; a discharge pipe installed within the main body, having a discharge valve, and discharging a gas to the outside; and a pump discharging a gas present in the storage chamber to the outside through the discharge pipe.