Patents by Inventor Seong Hee CHOI

Seong Hee CHOI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240151440
    Abstract: An embodiment multi-way coolant valve includes an outer housing including first to third outer inlets, first to third outer outlets, and a pump mount portion coupled to one of the outer outlets, an inner housing rotatably provided within the outer housing and including penetration holes corresponding to the outer inlets and outlets, a coolant line defined by a selective connection of the penetration holes such that the outer inlets and outlets are selectively connected, pads interposed between an interior circumference of the outer housing and an exterior circumference of the inner housing at locations of the outer inlets and outlets, respectively, and a driving device connected to a rotation center of the inner housing to selectively rotate the inner housing within the outer housing, wherein the inner housing is configured to rotate by a preset interval according to a selected vehicle mode.
    Type: Application
    Filed: May 10, 2023
    Publication date: May 9, 2024
    Inventors: Wan Je Cho, Namho Park, Seong-Bin Jeong, Yeonho Kim, Tae Hee Kim, Jae-Eun Jeong, Man Hee Park, Jae Yeon Kim, Hyunjae Lee, Seong Woo Jeong, Jung Bum Choi, Ho Sung Kang, Jeong Wan Han
  • Patent number: 11975091
    Abstract: A composition for enhancing protein strength according to the present invention contains an aminosilane compound capable of covalent binding with a protein of hair, scalp, skin, nails, leather, or textile, so that the protein and the amino silane compound form a covalent bond, and thus the composition can improve the protein strength enhancement effect and maximize the semi-permanent protein strength enhancement effect.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: May 7, 2024
    Assignee: LG Household & Health Care Ltd.
    Inventors: Seong Kil Son, Won Kyung Choi, Dong Wan Kim, Ji Hee Yoo, Jeong Rae Lee, Sang Min Lee
  • Patent number: 11968990
    Abstract: The present application relates to creamer comprising vegetable lipids, casein, maltose, phosphates, and allulose.
    Type: Grant
    Filed: March 8, 2022
    Date of Patent: April 30, 2024
    Assignee: CJ CHEILJEDANG CORPORATION
    Inventors: Young Mi Lee, Seong Bo Kim, Yang Hee Kim, Seong Jun Cho, Myung Sook Choi, Young Ji Han, Ji Young Choi, Su Jung Cho, Un Ju Jung, Eun Young Kwon
  • Publication number: 20240132021
    Abstract: An apparatus for controlling a discharge pressure of a fluid includes: a pump configured to suck the fluid through an inlet or to discharge the sucked fluid through an outlet; a distributor connected to the pump and to an injection nozzle provided by a sensor and configured to distribute the fluid discharged from the pump to the sensor; and a controller. The controller is configured to control the pump to operate selectively in accordance with detection of contamination of the sensor and to control operation of the distributor to be forcibly delayed during operation of the pump such that the fluid distributed to the sensor, when detected as being contaminated, is controlled to reach a selected required discharge pressure of different required discharge pressures selected in accordance with water amount information and a degree of contamination of the sensor.
    Type: Application
    Filed: April 30, 2023
    Publication date: April 25, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, DY AUTO CORPORATION
    Inventors: Young Joon Shin, Chan Mook Choi, Gyu Won Han, Jong Min Park, Jin Hee Lee, Jong Wook Lee, Min Wook Park, Seong Jun Kim, Hyeong Jun Kim, Sun Ju Kim
  • Patent number: 11958755
    Abstract: Provided are a barium titanate powder having spherical shape fine particles which have an average particle diameter (D50) in a range of about 140-270 nm, a tetragonal structure having a markedly improved tetragonality (c/a) in a range of 1.007-1.01 in contrast to the conventional composition, and at the same time, a markedly improved crystallinity in a range of 93-96%, thereby showing improved dielectric properties, and a manufacturing method thereof.
    Type: Grant
    Filed: May 17, 2022
    Date of Patent: April 16, 2024
    Assignee: Korea Inst. of Ceramic Engineering & Technology
    Inventors: Moon Hee Choi, Hyeon Jin Jung, Seong Hyeok Choi
  • Patent number: 11953958
    Abstract: A display includes: a display panel; and a panel bottom sheet disposed below the display panel, the panel bottom sheet including: a first heat dissipation layer; a second heat dissipation layer over the first heat dissipation layer, including a first opening formed completely through the second heat dissipation layer in a thickness direction; a heat dissipation coupling interlayer between the first heat dissipation layer and the second heat dissipation layer, and a heat dissipation substrate on the second heat dissipation layer.
    Type: Grant
    Filed: December 12, 2022
    Date of Patent: April 9, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventors: Kang Woo Lee, Boo Kan Ki, June Hyoung Park, Sun Hee Oh, Dong Hyeon Lee, Jeong In Lee, Hyuk Hwan Kim, Seong Sik Choi
  • Publication number: 20240105963
    Abstract: A method for manufacturing a gas diffusion layer for a fuel cell wherein carbon nanotubes are impregnated into Korean paper, thereby enhancing electroconductivity, and a gas diffusion layer manufactured thereby. The method for manufacturing a gas diffusion layer for a fuel cell which is to manufacture a gas diffusion layer as a constituent member of a unit cell in a fuel cell, includes a support preparation step of preparing a support with Korean paper; a dispersion preparation step of dispersing a carbon substance in a solvent to form a dispersion, a coating step of coating the support with the dispersion, and a thermal treatment step of thermally treating the dispersion-coated support to fix the carbon substance to the support.
    Type: Application
    Filed: March 6, 2023
    Publication date: March 28, 2024
    Inventors: Seung Tak Noh, Ji Han Lee, In Seok Lee, Jae Man Park, Won Jong Choi, Choong Hee Kim, Seong Hwang Kim, Jong Hoon Lee, Soo Jin Park, Seul Yi Lee
  • Patent number: 11938827
    Abstract: The present disclosure relates to a system for controlling a motor of a vehicle for increasing control accuracy of the motor for driving the vehicle, and an object of the present disclosure is to provide a system for controlling a motor of a vehicle, which may accurately perform a motor control even when a battery voltage (i.e., motor voltage) applied to the motor upon the driving control of the motor is changed.
    Type: Grant
    Filed: July 13, 2022
    Date of Patent: March 26, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Ho Sun Jang, Han Hee Park, Seong Min Kim, Ho Rim Choi, Seon Mi Lee, Tae Il Yoo, Seung Hyeon Bin
  • Publication number: 20220316208
    Abstract: A sound-absorbing non-combustible ceiling material and a method for manufacturing the same are disclosed. The method (S100) for manufacturing the sound-absorbing non-combustible ceiling material installed in a ceiling of a building includes a panel processing step (S1000) of processing each of a first panel including a metal and a second panel absorbing a sound wave; and a panel attaching step (S2000) of attaching the first panel and the second panel. The first panel includes a plurality of openings, and the first panel and the second panel are coupled by an adhesive layer to form the sound-absorbing non-combustible ceiling material.
    Type: Application
    Filed: May 28, 2021
    Publication date: October 6, 2022
    Applicant: ZENFIX CO., LTD.
    Inventors: Young Chul KWON, Seong-Hee CHOI, Chang-Seong YUN
  • Patent number: 11431097
    Abstract: A chip antenna module includes: a chip antenna including a body portion, a radiating portion, and a grounding portion, wherein the body portion is formed of a dielectric substance, and wherein the radiating portion and the grounding portion are disposed on different surfaces of the body portion from each other; and a substrate having a plurality of layers and including feeding pads bonded to the radiating portion, grounding pads bonded to the grounding portion, and dummy wiring layers disposed on at least one layer among the plurality of layers, below the feeding pads, wherein a resonance frequency of the chip antenna is determined by a number of the dummy wiring layers.
    Type: Grant
    Filed: March 4, 2021
    Date of Patent: August 30, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seong Hee Choi, Sang Jong Lee
  • Patent number: 11139551
    Abstract: A chip antenna module includes: a substrate including a feed wiring layer to provide a feed signal, a feeding via connected to the feed wiring layer, and a dummy via separated from the feed wiring layer; and a chip antenna disposed on a first surface of the substrate and including a body portion formed of a dielectric substance, a radiating portion that extends from a first surface of the body portion and is connected to the feeding via and the dummy via, and a grounding portion that extends from a second surface of the body portion opposite the first surface of the body portion.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: October 5, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seong Hee Choi, Sang Jong Lee
  • Publication number: 20210194135
    Abstract: A chip antenna module includes: a chip antenna including a body portion, a radiating portion, and a grounding portion, wherein the body portion is formed of a dielectric substance, and wherein the radiating portion and the grounding portion are disposed on different surfaces of the body portion from each other; and a substrate having a plurality of layers and including feeding pads bonded to the radiating portion, grounding pads bonded to the grounding portion, and dummy wiring layers disposed on at least one layer among the plurality of layers, below the feeding pads, wherein a resonance frequency of the chip antenna is determined by a number of the dummy wiring layers.
    Type: Application
    Filed: March 4, 2021
    Publication date: June 24, 2021
    Applicant: Samsung Electro-Mechanics., Ltd.
    Inventors: Seong Hee CHOI, Sang Jong LEE
  • Publication number: 20210175613
    Abstract: An antenna module includes: a board having a first surface including a ground region and a feed region; and chip antennas mounted on the first surface, each of the chip antennas including a first antenna and a second antenna. The first antenna and the second antenna each include a ground portion bonded to the ground region, and a radiation portion bonded to the feed region. A length of a radiating surface of the first antenna is greater than a mounting height of the first antenna, and a mounting height of the second antenna is greater than a length of a radiating surface of the second antenna. A horizontal spacing distance between the radiation portion of the first antenna and the ground region is greater than a horizontal spacing distance between the radiation portion of the second antenna and the ground region.
    Type: Application
    Filed: February 17, 2021
    Publication date: June 10, 2021
    Applicant: Samsung Electro-Mechanics.,Co., Ltd.
    Inventors: Seong Hee CHOI, Sang Jong LEE, Sung Yong AN, Jae Yeong KIM, Ju Hyoung PARK
  • Patent number: 11018418
    Abstract: A chip antenna includes a radiation portion having a block shape and a first surface and a second surface opposing each other, and configured to receive and radiate a feed signal as an electromagnetic wave; a first block made of a dielectric material and coupled to the first surface of the radiation portion; a second block made of a dielectric material and coupled to the second surface of the radiation portion; a ground portion having a block shape and coupled to the first block, and configured to reflect the electromagnetic wave radiated by the radiation portion back toward the radiation portion; and a director having a block shape and coupled to the second block, wherein an overall width of the ground portion, the first block, and the radiation portion is 2 mm or less, and the first block has a dielectric constant of 3.5 or more to 25 or less.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: May 25, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Yeong Kim, Sung Yong An, Sang Jong Lee, Seong Hee Choi, Kyu Bum Han, Jeong Ki Ryoo, Byeong Cheol Moon, Chang Hak Choi
  • Patent number: 10978785
    Abstract: An antenna module includes: a board having a first surface including a ground region and a feed region; and chip antennas mounted on the first surface, each of the chip antennas including a first antenna and a second antenna. The first antenna and the second antenna each include a ground portion bonded to the ground region, and a radiation portion bonded to the feed region. A length of a radiating surface of the first antenna is greater than a mounting height of the first antenna, and a mounting height of the second antenna is greater than a length of a radiating surface of the second antenna. A horizontal spacing distance between the radiation portion of the first antenna and the ground region is greater than a horizontal spacing distance between the radiation portion of the second antenna and the ground region.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: April 13, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seong Hee Choi, Sang Jong Lee, Sung Yong An, Jae Yeong Kim, Ju Hyoung Park
  • Patent number: 10971821
    Abstract: A chip antenna module includes: a chip antenna including a body portion, a radiating portion, and a grounding portion, wherein the body portion is formed of a dielectric substance, and wherein the radiating portion and the grounding portion are disposed on different surfaces of the body portion from each other; and a substrate having a plurality of layers and including feeding pads bonded to the radiating portion, grounding pads bonded to the grounding portion, and dummy wiring layers disposed on at least one layer among the plurality of layers, below the feeding pads, wherein a resonance frequency of the chip antenna is determined by a number of the dummy wiring layers.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: April 6, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seong Hee Choi, Sang Jong Lee
  • Patent number: 10842021
    Abstract: A printed circuit board includes a magnetic member including a magnetic layer, a first coil pattern disposed above the magnetic member, and having a planar spiral structure, and a second coil pattern disposed below the magnetic member, and having a planar spiral structure.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: November 17, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO. LTD.
    Inventors: Seung Jae Song, Seong Hee Choi, Sang Jong Lee, Mi Ja Han
  • Patent number: 10667386
    Abstract: A circuit board includes a first conductive layer, a second conductive layer, and a first insulating layer disposed between the first conductive layer and the second conductive layer, wherein the first conductive layer includes a signal line, the second conductive layer includes a ground line, and the ground line of the second conductive layer includes a pattern area patterned in a meander shape.
    Type: Grant
    Filed: February 4, 2019
    Date of Patent: May 26, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Han Kim, Seong Hee Choi, Dae Hyun Park
  • Publication number: 20200136255
    Abstract: A chip antenna module includes: a chip antenna including a body portion, a radiating portion, and a grounding portion, wherein the body portion is formed of a dielectric substance, and wherein the radiating portion and the grounding portion are disposed on different surfaces of the body portion from each other; and a substrate having a plurality of layers and including feeding pads bonded to the radiating portion, grounding pads bonded to the grounding portion, and dummy wiring layers disposed on at least one layer among the plurality of layers, below the feeding pads, wherein a resonance frequency of the chip antenna is determined by a number of the dummy wiring layers.
    Type: Application
    Filed: June 27, 2019
    Publication date: April 30, 2020
    Applicant: Samsung Electro-Mechanics., Ltd.
    Inventors: Seong Hee CHOI, Sang Jong LEE
  • Publication number: 20200091583
    Abstract: A chip antenna module includes: a substrate including a feed wiring layer to provide a feed signal, a feeding via connected to the feed wiring layer, and a dummy via separated from the feed wiring layer; and a chip antenna disposed on a first surface of the substrate and including a body portion formed of a dielectric substance, a radiating portion that extends from a first surface of the body portion and is connected to the feeding via and the dummy via, and a grounding portion that extends from a second surface of the body portion opposite the first surface of the body portion.
    Type: Application
    Filed: July 9, 2019
    Publication date: March 19, 2020
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seong Hee CHOI, Sang Jong LEE