Patents by Inventor Seong Hee CHOI
Seong Hee CHOI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240151440Abstract: An embodiment multi-way coolant valve includes an outer housing including first to third outer inlets, first to third outer outlets, and a pump mount portion coupled to one of the outer outlets, an inner housing rotatably provided within the outer housing and including penetration holes corresponding to the outer inlets and outlets, a coolant line defined by a selective connection of the penetration holes such that the outer inlets and outlets are selectively connected, pads interposed between an interior circumference of the outer housing and an exterior circumference of the inner housing at locations of the outer inlets and outlets, respectively, and a driving device connected to a rotation center of the inner housing to selectively rotate the inner housing within the outer housing, wherein the inner housing is configured to rotate by a preset interval according to a selected vehicle mode.Type: ApplicationFiled: May 10, 2023Publication date: May 9, 2024Inventors: Wan Je Cho, Namho Park, Seong-Bin Jeong, Yeonho Kim, Tae Hee Kim, Jae-Eun Jeong, Man Hee Park, Jae Yeon Kim, Hyunjae Lee, Seong Woo Jeong, Jung Bum Choi, Ho Sung Kang, Jeong Wan Han
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Patent number: 11975091Abstract: A composition for enhancing protein strength according to the present invention contains an aminosilane compound capable of covalent binding with a protein of hair, scalp, skin, nails, leather, or textile, so that the protein and the amino silane compound form a covalent bond, and thus the composition can improve the protein strength enhancement effect and maximize the semi-permanent protein strength enhancement effect.Type: GrantFiled: September 10, 2021Date of Patent: May 7, 2024Assignee: LG Household & Health Care Ltd.Inventors: Seong Kil Son, Won Kyung Choi, Dong Wan Kim, Ji Hee Yoo, Jeong Rae Lee, Sang Min Lee
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Patent number: 11968990Abstract: The present application relates to creamer comprising vegetable lipids, casein, maltose, phosphates, and allulose.Type: GrantFiled: March 8, 2022Date of Patent: April 30, 2024Assignee: CJ CHEILJEDANG CORPORATIONInventors: Young Mi Lee, Seong Bo Kim, Yang Hee Kim, Seong Jun Cho, Myung Sook Choi, Young Ji Han, Ji Young Choi, Su Jung Cho, Un Ju Jung, Eun Young Kwon
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Publication number: 20240132021Abstract: An apparatus for controlling a discharge pressure of a fluid includes: a pump configured to suck the fluid through an inlet or to discharge the sucked fluid through an outlet; a distributor connected to the pump and to an injection nozzle provided by a sensor and configured to distribute the fluid discharged from the pump to the sensor; and a controller. The controller is configured to control the pump to operate selectively in accordance with detection of contamination of the sensor and to control operation of the distributor to be forcibly delayed during operation of the pump such that the fluid distributed to the sensor, when detected as being contaminated, is controlled to reach a selected required discharge pressure of different required discharge pressures selected in accordance with water amount information and a degree of contamination of the sensor.Type: ApplicationFiled: April 30, 2023Publication date: April 25, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, DY AUTO CORPORATIONInventors: Young Joon Shin, Chan Mook Choi, Gyu Won Han, Jong Min Park, Jin Hee Lee, Jong Wook Lee, Min Wook Park, Seong Jun Kim, Hyeong Jun Kim, Sun Ju Kim
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Patent number: 11958755Abstract: Provided are a barium titanate powder having spherical shape fine particles which have an average particle diameter (D50) in a range of about 140-270 nm, a tetragonal structure having a markedly improved tetragonality (c/a) in a range of 1.007-1.01 in contrast to the conventional composition, and at the same time, a markedly improved crystallinity in a range of 93-96%, thereby showing improved dielectric properties, and a manufacturing method thereof.Type: GrantFiled: May 17, 2022Date of Patent: April 16, 2024Assignee: Korea Inst. of Ceramic Engineering & TechnologyInventors: Moon Hee Choi, Hyeon Jin Jung, Seong Hyeok Choi
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Patent number: 11953958Abstract: A display includes: a display panel; and a panel bottom sheet disposed below the display panel, the panel bottom sheet including: a first heat dissipation layer; a second heat dissipation layer over the first heat dissipation layer, including a first opening formed completely through the second heat dissipation layer in a thickness direction; a heat dissipation coupling interlayer between the first heat dissipation layer and the second heat dissipation layer, and a heat dissipation substrate on the second heat dissipation layer.Type: GrantFiled: December 12, 2022Date of Patent: April 9, 2024Assignee: Samsung Display Co., Ltd.Inventors: Kang Woo Lee, Boo Kan Ki, June Hyoung Park, Sun Hee Oh, Dong Hyeon Lee, Jeong In Lee, Hyuk Hwan Kim, Seong Sik Choi
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Publication number: 20240105963Abstract: A method for manufacturing a gas diffusion layer for a fuel cell wherein carbon nanotubes are impregnated into Korean paper, thereby enhancing electroconductivity, and a gas diffusion layer manufactured thereby. The method for manufacturing a gas diffusion layer for a fuel cell which is to manufacture a gas diffusion layer as a constituent member of a unit cell in a fuel cell, includes a support preparation step of preparing a support with Korean paper; a dispersion preparation step of dispersing a carbon substance in a solvent to form a dispersion, a coating step of coating the support with the dispersion, and a thermal treatment step of thermally treating the dispersion-coated support to fix the carbon substance to the support.Type: ApplicationFiled: March 6, 2023Publication date: March 28, 2024Inventors: Seung Tak Noh, Ji Han Lee, In Seok Lee, Jae Man Park, Won Jong Choi, Choong Hee Kim, Seong Hwang Kim, Jong Hoon Lee, Soo Jin Park, Seul Yi Lee
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Patent number: 11938827Abstract: The present disclosure relates to a system for controlling a motor of a vehicle for increasing control accuracy of the motor for driving the vehicle, and an object of the present disclosure is to provide a system for controlling a motor of a vehicle, which may accurately perform a motor control even when a battery voltage (i.e., motor voltage) applied to the motor upon the driving control of the motor is changed.Type: GrantFiled: July 13, 2022Date of Patent: March 26, 2024Assignees: Hyundai Motor Company, Kia CorporationInventors: Ho Sun Jang, Han Hee Park, Seong Min Kim, Ho Rim Choi, Seon Mi Lee, Tae Il Yoo, Seung Hyeon Bin
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Publication number: 20220316208Abstract: A sound-absorbing non-combustible ceiling material and a method for manufacturing the same are disclosed. The method (S100) for manufacturing the sound-absorbing non-combustible ceiling material installed in a ceiling of a building includes a panel processing step (S1000) of processing each of a first panel including a metal and a second panel absorbing a sound wave; and a panel attaching step (S2000) of attaching the first panel and the second panel. The first panel includes a plurality of openings, and the first panel and the second panel are coupled by an adhesive layer to form the sound-absorbing non-combustible ceiling material.Type: ApplicationFiled: May 28, 2021Publication date: October 6, 2022Applicant: ZENFIX CO., LTD.Inventors: Young Chul KWON, Seong-Hee CHOI, Chang-Seong YUN
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Patent number: 11431097Abstract: A chip antenna module includes: a chip antenna including a body portion, a radiating portion, and a grounding portion, wherein the body portion is formed of a dielectric substance, and wherein the radiating portion and the grounding portion are disposed on different surfaces of the body portion from each other; and a substrate having a plurality of layers and including feeding pads bonded to the radiating portion, grounding pads bonded to the grounding portion, and dummy wiring layers disposed on at least one layer among the plurality of layers, below the feeding pads, wherein a resonance frequency of the chip antenna is determined by a number of the dummy wiring layers.Type: GrantFiled: March 4, 2021Date of Patent: August 30, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Seong Hee Choi, Sang Jong Lee
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Patent number: 11139551Abstract: A chip antenna module includes: a substrate including a feed wiring layer to provide a feed signal, a feeding via connected to the feed wiring layer, and a dummy via separated from the feed wiring layer; and a chip antenna disposed on a first surface of the substrate and including a body portion formed of a dielectric substance, a radiating portion that extends from a first surface of the body portion and is connected to the feeding via and the dummy via, and a grounding portion that extends from a second surface of the body portion opposite the first surface of the body portion.Type: GrantFiled: July 9, 2019Date of Patent: October 5, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seong Hee Choi, Sang Jong Lee
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Publication number: 20210194135Abstract: A chip antenna module includes: a chip antenna including a body portion, a radiating portion, and a grounding portion, wherein the body portion is formed of a dielectric substance, and wherein the radiating portion and the grounding portion are disposed on different surfaces of the body portion from each other; and a substrate having a plurality of layers and including feeding pads bonded to the radiating portion, grounding pads bonded to the grounding portion, and dummy wiring layers disposed on at least one layer among the plurality of layers, below the feeding pads, wherein a resonance frequency of the chip antenna is determined by a number of the dummy wiring layers.Type: ApplicationFiled: March 4, 2021Publication date: June 24, 2021Applicant: Samsung Electro-Mechanics., Ltd.Inventors: Seong Hee CHOI, Sang Jong LEE
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Publication number: 20210175613Abstract: An antenna module includes: a board having a first surface including a ground region and a feed region; and chip antennas mounted on the first surface, each of the chip antennas including a first antenna and a second antenna. The first antenna and the second antenna each include a ground portion bonded to the ground region, and a radiation portion bonded to the feed region. A length of a radiating surface of the first antenna is greater than a mounting height of the first antenna, and a mounting height of the second antenna is greater than a length of a radiating surface of the second antenna. A horizontal spacing distance between the radiation portion of the first antenna and the ground region is greater than a horizontal spacing distance between the radiation portion of the second antenna and the ground region.Type: ApplicationFiled: February 17, 2021Publication date: June 10, 2021Applicant: Samsung Electro-Mechanics.,Co., Ltd.Inventors: Seong Hee CHOI, Sang Jong LEE, Sung Yong AN, Jae Yeong KIM, Ju Hyoung PARK
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Patent number: 11018418Abstract: A chip antenna includes a radiation portion having a block shape and a first surface and a second surface opposing each other, and configured to receive and radiate a feed signal as an electromagnetic wave; a first block made of a dielectric material and coupled to the first surface of the radiation portion; a second block made of a dielectric material and coupled to the second surface of the radiation portion; a ground portion having a block shape and coupled to the first block, and configured to reflect the electromagnetic wave radiated by the radiation portion back toward the radiation portion; and a director having a block shape and coupled to the second block, wherein an overall width of the ground portion, the first block, and the radiation portion is 2 mm or less, and the first block has a dielectric constant of 3.5 or more to 25 or less.Type: GrantFiled: November 9, 2018Date of Patent: May 25, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong Kim, Sung Yong An, Sang Jong Lee, Seong Hee Choi, Kyu Bum Han, Jeong Ki Ryoo, Byeong Cheol Moon, Chang Hak Choi
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Patent number: 10978785Abstract: An antenna module includes: a board having a first surface including a ground region and a feed region; and chip antennas mounted on the first surface, each of the chip antennas including a first antenna and a second antenna. The first antenna and the second antenna each include a ground portion bonded to the ground region, and a radiation portion bonded to the feed region. A length of a radiating surface of the first antenna is greater than a mounting height of the first antenna, and a mounting height of the second antenna is greater than a length of a radiating surface of the second antenna. A horizontal spacing distance between the radiation portion of the first antenna and the ground region is greater than a horizontal spacing distance between the radiation portion of the second antenna and the ground region.Type: GrantFiled: June 28, 2019Date of Patent: April 13, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Seong Hee Choi, Sang Jong Lee, Sung Yong An, Jae Yeong Kim, Ju Hyoung Park
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Patent number: 10971821Abstract: A chip antenna module includes: a chip antenna including a body portion, a radiating portion, and a grounding portion, wherein the body portion is formed of a dielectric substance, and wherein the radiating portion and the grounding portion are disposed on different surfaces of the body portion from each other; and a substrate having a plurality of layers and including feeding pads bonded to the radiating portion, grounding pads bonded to the grounding portion, and dummy wiring layers disposed on at least one layer among the plurality of layers, below the feeding pads, wherein a resonance frequency of the chip antenna is determined by a number of the dummy wiring layers.Type: GrantFiled: June 27, 2019Date of Patent: April 6, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Seong Hee Choi, Sang Jong Lee
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Patent number: 10842021Abstract: A printed circuit board includes a magnetic member including a magnetic layer, a first coil pattern disposed above the magnetic member, and having a planar spiral structure, and a second coil pattern disposed below the magnetic member, and having a planar spiral structure.Type: GrantFiled: February 26, 2020Date of Patent: November 17, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO. LTD.Inventors: Seung Jae Song, Seong Hee Choi, Sang Jong Lee, Mi Ja Han
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Patent number: 10667386Abstract: A circuit board includes a first conductive layer, a second conductive layer, and a first insulating layer disposed between the first conductive layer and the second conductive layer, wherein the first conductive layer includes a signal line, the second conductive layer includes a ground line, and the ground line of the second conductive layer includes a pattern area patterned in a meander shape.Type: GrantFiled: February 4, 2019Date of Patent: May 26, 2020Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Han Kim, Seong Hee Choi, Dae Hyun Park
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Publication number: 20200136255Abstract: A chip antenna module includes: a chip antenna including a body portion, a radiating portion, and a grounding portion, wherein the body portion is formed of a dielectric substance, and wherein the radiating portion and the grounding portion are disposed on different surfaces of the body portion from each other; and a substrate having a plurality of layers and including feeding pads bonded to the radiating portion, grounding pads bonded to the grounding portion, and dummy wiring layers disposed on at least one layer among the plurality of layers, below the feeding pads, wherein a resonance frequency of the chip antenna is determined by a number of the dummy wiring layers.Type: ApplicationFiled: June 27, 2019Publication date: April 30, 2020Applicant: Samsung Electro-Mechanics., Ltd.Inventors: Seong Hee CHOI, Sang Jong LEE
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Publication number: 20200091583Abstract: A chip antenna module includes: a substrate including a feed wiring layer to provide a feed signal, a feeding via connected to the feed wiring layer, and a dummy via separated from the feed wiring layer; and a chip antenna disposed on a first surface of the substrate and including a body portion formed of a dielectric substance, a radiating portion that extends from a first surface of the body portion and is connected to the feeding via and the dummy via, and a grounding portion that extends from a second surface of the body portion opposite the first surface of the body portion.Type: ApplicationFiled: July 9, 2019Publication date: March 19, 2020Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seong Hee CHOI, Sang Jong LEE