Abstract: An electrode lead for achieving the above object is provided. The electrode lead includes a first electrode lead having one end connected to an electrode tab protruding from one side of an electrode assembly, a second electrode lead having one end connected to the other end of the first electrode lead and the other end protruding to the outside of a battery case accommodating the electrode assembly, and a connection part configured to connect the first electrode lead to the second electrode lead, wherein the connection part is formed by a cured adhesive applied between the first electrode lead and the second electrode lead. The adhesive is formed by a mixture of a conductor and a solvent. The solvent is formed by a mixture of a polymer and a diluent. The solvent contains 5 wt % to 15 wt % of the diluent.

Abstract: To solve the above problem, a method for manufacturing an electrode lead according to an embodiment of the present invention includes: a step of manufacturing each of a first electrode lead and a second electrode lead by cutting a metal plate; a step of applying an adhesive to at least one of one end of the first electrode lead or the other end of the second electrode lead; a step of forming a lead stack by bonding the one end of the first electrode lead and the other end of the second electrode lead to each other; a step of placing the lead stack on a die; and a step of applying heat and pressure to a connection portion of the lead stack, in which the first electrode lead and the second electrode lead are connected to each other, by using a pressing device.

Abstract: A multi-core dielectric circular waveguide (MCDCW) is described. A hybrid mode excitation for multi-core dielectric filled circular waveguide fed parabolic antenna is also described. A multi-core dielectric circular waveguide with four cylinders of different relative permittivity (?r) inside each other is used to generate the hybrid mode (HE11) directly without need for coupling TE11 and TM11 modes as in prior art corrugated waveguide feeders. This mode is preferable to be used as operating mode to feed the reflector. Four concentric cylinders of different relative permittivity ?r are used as an example.

Abstract: An apparatus is disclosed for an antenna with a conductive cage. In an example aspect, the apparatus includes a ground plane with at least one opening. The apparatus also includes at least one antenna assembly with at least one radiating element, at least one feed via, and a conductive cage. The radiating element is implemented on a first plane that is substantially parallel to the ground plane. The feed via is connected to the at least one radiating element and is configured to connect to at least one transmission line through the opening. The conductive cage includes at least three ground vias, which are connected to the ground plane at positions that are distributed around the opening. Lengths of the at least three ground vias extend a portion of a distance between the ground plane and the radiating element.

Abstract: An antenna system includes: a ground conductor; a substrate; a pair of planar dipole conductors disposed such that at least a portion of the substrate is disposed between the ground conductor and the pair of dipole conductors; a pair of energy couplers each electrically connected to a respective one of the pair of dipole conductors; and a pair of isolated lobes including electrically-conductive material. The pair of isolated lobes are electrically separate from the pair of dipole conductors and the pair of energy couplers, and disposed between the pair of dipole conductors and the ground conductor.

Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.

Abstract: An apparatus is disclosed for an antenna with a conductive cage. In an example aspect, the apparatus includes a ground plane with at least one opening. The apparatus also includes at least one antenna assembly with at least one radiating element, at least one feed via, and a conductive cage. The radiating element is implemented on a first plane that is substantially parallel to the ground plane. The feed via is connected to the at least one radiating element and is configured to connect to at least one transmission line through the opening. The conductive cage includes at least three ground vias, which are connected to the ground plane at positions that are distributed around the opening. Lengths of the at least three ground vias extend a portion of a distance between the ground plane and the radiating element.

Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.

Abstract: An antenna package comprising a chip package including a plurality of feed lines, a first half antenna subassembly electrically coupled to the feed lines, and a second half antenna subassembly electrically coupled to the feed lines, wherein the first and second half antenna subassemblies point away from each other in a direction substantially perpendicular to the chip package. The antenna subassemblies may be millimeter (mm) wave antennas covering from approximately 24 to 43.5 GHz. The antenna subassemblies include a flex substrate formed from printed circuit boards (PCB) or flex-film PCB.

Abstract: Certain aspects of the present disclosure provide a glass ceramic antenna package having a large bandwidth (e.g., 19 GHz) for millimeter wave (mmWave) applications, for example. The antenna package generally includes an antenna element comprising a first substrate layer and a second substrate layer, wherein the first substrate layer comprises an antenna, wherein the second substrate layer comprises shielding elements and feed lines, and wherein the feed lines are electrically coupled to the antenna. The antenna package also includes a lead frame adjacent to one or more lateral surfaces of the antenna element.

Abstract: Systems and methods for enabling infinite wireless charging of unmanned aerial systems (UASs) are provided. A UAS detects sources of power and wirelessly charges itself by collecting ambient electromagnetic energy from a power infrastructure. A UAS in accordance with features and aspects described herein is autonomous, may always be wirelessly charged (e.g., with high induced voltage), and can make use of weak energy. Moreover, various charging techniques can be used, such as in-flight, trickle, perching, and/or parking. Dynamic flight is supported using multi-angle MIMO coils. Additionally or alternatively, faster charging can be achieved with a supercapacitor and slower charging can be achieved with a battery.

Abstract: An antenna system includes: a ground conductor; a substrate; a pair of planar dipole conductors disposed such that at least a portion of the substrate is disposed between the ground conductor and the pair of dipole conductors; a pair of energy couplers each electrically connected to a respective one of the pair of dipole conductors; and a pair of isolated lobes including electrically-conductive material. The pair of isolated lobes are electrically separate from the pair of dipole conductors and the pair of energy couplers, and disposed between the pair of dipole conductors and the ground conductor.

Abstract: Methods, systems, and devices for wireless communications are described. An antenna structure for wideband coverage may include a first bowtie antenna disposed in a first plane. The first bowtie antenna may be, for example, an elliptical bowtie antenna or a triangular bowtie antenna. The antenna structure may also include a plurality of additional bowtie antennas, each of the plurality of additional bowtie antennas disposed in a different plane parallel to the first plane. The first bowtie antenna and the plurality of additional bowtie antennas may be stacked in a first direction perpendicular to the first plane to form a bowtie antenna stack. The antenna structure may include a plurality of bowtie antenna stacks. The antenna structure may also include a staggered conductive wall.

Abstract: Disclosed is a method and apparatus for mitigating temperature spikes and dissipating heat. The apparatus for mitigating temperature spikes and dissipating heat comprises one or more heatsinks, one or more sensors, one or more phase change materials and one or more processors coupled to the one or more sensors. The one or more processors may be configured to obtain one or more sensor measurements and may be configured to determine whether to store heat or dissipate heat based on the one or more sensor measurements. In response to a determination to dissipate heat, the one or more processors may be configured to dissipate heat from the one or more processors, the one or more phase change materials or both using the one or more heatsinks. Furthermore, in response to a determination to store heat, store heat from the one or more processors using the one or more phase change materials.

Abstract: In conventional packaging strategies for mm wave applications, the size of the package is dictated by the antenna size, which is often much larger than the RFIC (radio frequency integrated circuit). Also, the operations are often limited to a single frequency which limits their utility. In addition, multiple addition build-up layers are required to provide the necessary separation between the antennas and ground layers. To address these issues, it is proposed to provide a device that includes an antenna package, an RFIC package, and an interconnect assembly between the antenna and the RFIC packages. The interconnect assembly may comprise a plurality of interconnects with high aspect ratios and configured to connect one or more antennas of the antenna package with an RFIC of the RFIC package. An air gap may be formed in between the antenna package and the RFIC package for performance improvement.

Abstract: Exemplary embodiments of the present disclosure are related to a wireless power resonator and method that includes a wireless power transmit element. The wireless power transmit element may include a substantially planar transmit antenna configured to generate a magnetic field and formed from a conductive trace including a plurality of distributed inductive elements along the conductive trace. The transmit element may further include a filter formed from selected ones of the plurality of distributed inductive elements of the planar transmit antenna and configured to generate at least one frequency response.

Abstract: Certain aspects of the present disclosure provide a glass ceramic antenna package having a large bandwidth (e.g., 19 GHz) for millimeter wave (mmWave) applications, for example. The antenna package generally includes an antenna element comprising a first substrate layer and a second substrate layer, wherein the first substrate layer comprises an antenna, wherein the second substrate layer comprises shielding elements and feed lines, and wherein the feed lines are electrically coupled to the antenna. The antenna package also includes a lead frame adjacent to one or more lateral surfaces of the antenna element.

Abstract: An antenna package comprising a chip package including a plurality of feed lines, a first half antenna subassembly electrically coupled to the feed lines, and a second half antenna subassembly electrically coupled to the feed lines, wherein the first and second half antenna subassemblies point away from each other in a direction substantially perpendicular to the chip package. The antenna subassemblies may be millimeter (mm) wave antennas covering from approximately 24 to 43.5 GHz. The antenna subassemblies include a flex substrate formed from printed circuit boards (PCB) or flex-film PCB.

Abstract: An apparatus for wirelessly coupling power via a first magnetic field may include an electrically conductive casing portion configured to generate a second magnetic field in response to eddy currents induced in the electrically conductive casing portion by the first magnetic field. The electrically conductive casing portion may include a non-conductive area and a first slot. A power receiving element wound around the non-conductive area and crossing over the first slots can couple to the second magnetic field to output electrical current to wirelessly power or charge a load.

Abstract: A multi-layer laminate antenna includes: a feed line configured to convey electricity; a radiator coupled to the feed line, comprising metal disposed in a first layer of the antenna, and having an edge of a length to radiate energy at a radiating frequency; and dummy metal disposed in a second layer of the antenna that is different from the first layer of the antenna; where a first portion of the dummy metal is configured such that any linear edge of the first portion of the dummy metal disposed outside an area of the second layer overlapped by the radiator is less than half of a radiating wavelength corresponding to the radiating frequency.