Patents by Inventor Seong-Heon Jeong

Seong-Heon Jeong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11183697
    Abstract: A fuel cell separator includes a first separator plate and a second separator plate for an anode or a cathode. The first and second separator plates are adjacent to each other for assembly in a fuel cell stack. A first protrusion is formed at an edge portion of the first separator plate and protrudes toward the second separator plate arranged facing the first separator plate. A second protrusion is formed at an edge portion of the second separator plate and protrudes toward the first separator plate arranged facing the second separator plate. With the first and second separator plates adjacent to each other, since side surfaces of the first and second protrusions push each other, assembly positions of the first and second separator plates are regulated. The first and second protrusions are arranged such that opposing side surfaces thereof are spaced from each other. A third gasket is arranged in a gap between the first and second protrusions.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: November 23, 2021
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Soo Jin Lim, Byeong-Heon Jeong, Seong Il Heo
  • Patent number: 11171340
    Abstract: A unit cell for a fuel cell is provided. The unit cell includes an insert including a Membrane-Electrode Assembly having a first pair of electrode layers formed on a first surface of a polymer electrolyte membrane and a second pair of electrode layers formed on a second surface of the polymer electrolyte membrane, an elastomer frame bonded at a rim of the insert in an outer area of the insert, the elastomer frame having a reaction surface through-hole in which the insert is disposed formed therein and having a plurality of frame manifold through-holes, through which a reactant gas can flow or be discharged, formed at both sides of and spaced apart from the reaction surface through-hole, and a pair of separators, each separator disposed on a respective side of the insert and the elastomer frame.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: November 9, 2021
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Jin Hyeok Yoo, Byeong-Heon Jeong, Seong Il Heo
  • Publication number: 20210175636
    Abstract: An antenna system includes: a ground conductor; a substrate; a pair of planar dipole conductors disposed such that at least a portion of the substrate is disposed between the ground conductor and the pair of dipole conductors; a pair of energy couplers each electrically connected to a respective one of the pair of dipole conductors; and a pair of isolated lobes including electrically-conductive material. The pair of isolated lobes are electrically separate from the pair of dipole conductors and the pair of energy couplers, and disposed between the pair of dipole conductors and the ground conductor.
    Type: Application
    Filed: December 5, 2019
    Publication date: June 10, 2021
    Inventors: Jon LASITER, Donald William KIDWELL, JR., Ravindra Vaman SHENOY, Mohammad Ali TASSOUDJI, Jeremy Darren DUNWORTH, Vladimir Aparin, Yu-Chin OU, Seong Heon JEONG
  • Patent number: 11005161
    Abstract: Methods, systems, and devices for wireless communications are described. An antenna structure for wideband coverage may include a first bowtie antenna disposed in a first plane. The first bowtie antenna may be, for example, an elliptical bowtie antenna or a triangular bowtie antenna. The antenna structure may also include a plurality of additional bowtie antennas, each of the plurality of additional bowtie antennas disposed in a different plane parallel to the first plane. The first bowtie antenna and the plurality of additional bowtie antennas may be stacked in a first direction perpendicular to the first plane to form a bowtie antenna stack. The antenna structure may include a plurality of bowtie antenna stacks. The antenna structure may also include a staggered conductive wall.
    Type: Grant
    Filed: October 17, 2018
    Date of Patent: May 11, 2021
    Assignee: QUALCOMM Incorporated
    Inventors: Seong Heon Jeong, Mohammad Ali Tassoudji, Alireza Mohammadian, Jorge Fabrega Sanchez, Taesik Yang
  • Patent number: 10750640
    Abstract: Disclosed is a method and apparatus for mitigating temperature spikes and dissipating heat. The apparatus for mitigating temperature spikes and dissipating heat comprises one or more heatsinks, one or more sensors, one or more phase change materials and one or more processors coupled to the one or more sensors. The one or more processors may be configured to obtain one or more sensor measurements and may be configured to determine whether to store heat or dissipate heat based on the one or more sensor measurements. In response to a determination to dissipate heat, the one or more processors may be configured to dissipate heat from the one or more processors, the one or more phase change materials or both using the one or more heatsinks. Furthermore, in response to a determination to store heat, store heat from the one or more processors using the one or more phase change materials.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: August 18, 2020
    Assignee: QUALCOMM Incorporated
    Inventors: Sean Charles Andrews, Seong Heon Jeong, William Henry Von Novak, III
  • Patent number: 10734332
    Abstract: In conventional packaging strategies for mm wave applications, the size of the package is dictated by the antenna size, which is often much larger than the RFIC (radio frequency integrated circuit). Also, the operations are often limited to a single frequency which limits their utility. In addition, multiple addition build-up layers are required to provide the necessary separation between the antennas and ground layers. To address these issues, it is proposed to provide a device that includes an antenna package, an RFIC package, and an interconnect assembly between the antenna and the RFIC packages. The interconnect assembly may comprise a plurality of interconnects with high aspect ratios and configured to connect one or more antennas of the antenna package with an RFIC of the RFIC package. An air gap may be formed in between the antenna package and the RFIC package for performance improvement.
    Type: Grant
    Filed: December 12, 2017
    Date of Patent: August 4, 2020
    Assignee: QUALCOMM Incorporated
    Inventors: Jon Bradley Lasiter, Ravindra Vaman Shenoy, Donald William Kidwell, Jr., Mohammad Ali Tassoudji, Vladimir Aparin, Seong Heon Jeong, Jeremy Dunworth, Alireza Mohammadian, Mario Francisco Velez, Chin-Kwan Kim
  • Patent number: 10547208
    Abstract: Exemplary embodiments of the present disclosure are related to a wireless power resonator and method that includes a wireless power transmit element. The wireless power transmit element may include a substantially planar transmit antenna configured to generate a magnetic field and formed from a conductive trace including a plurality of distributed inductive elements along the conductive trace. The transmit element may further include a filter formed from selected ones of the plurality of distributed inductive elements of the planar transmit antenna and configured to generate at least one frequency response.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: January 28, 2020
    Assignee: QUALCOMM Incorporated
    Inventors: Seong Heon Jeong, Francesco Carobolante, William Henry Von Novak, III
  • Publication number: 20200006846
    Abstract: Certain aspects of the present disclosure provide a glass ceramic antenna package having a large bandwidth (e.g., 19 GHz) for millimeter wave (mmWave) applications, for example. The antenna package generally includes an antenna element comprising a first substrate layer and a second substrate layer, wherein the first substrate layer comprises an antenna, wherein the second substrate layer comprises shielding elements and feed lines, and wherein the feed lines are electrically coupled to the antenna. The antenna package also includes a lead frame adjacent to one or more lateral surfaces of the antenna element.
    Type: Application
    Filed: June 29, 2018
    Publication date: January 2, 2020
    Inventors: Jon LASITER, Seong Heon JEONG, Ravindra Vaman SHENOY, Jeremy Darren DUNWORTH, Mohammad Ali TASSOUDJI
  • Publication number: 20190379102
    Abstract: An antenna package comprising a chip package including a plurality of feed lines, a first half antenna subassembly electrically coupled to the feed lines, and a second half antenna subassembly electrically coupled to the feed lines, wherein the first and second half antenna subassemblies point away from each other in a direction substantially perpendicular to the chip package. The antenna subassemblies may be millimeter (mm) wave antennas covering from approximately 24 to 43.5 GHz. The antenna subassemblies include a flex substrate formed from printed circuit boards (PCB) or flex-film PCB.
    Type: Application
    Filed: June 11, 2018
    Publication date: December 12, 2019
    Inventors: Jon LASITER, Ravindra Vaman SHENOY, Mohammad Ali TASSOUDJI, Seong Heon JEONG, Jeremy Darren DUNWORTH
  • Patent number: 10476304
    Abstract: An apparatus for wirelessly coupling power via a first magnetic field may include an electrically conductive casing portion configured to generate a second magnetic field in response to eddy currents induced in the electrically conductive casing portion by the first magnetic field. The electrically conductive casing portion may include a non-conductive area and a first slot. A power receiving element wound around the non-conductive area and crossing over the first slots can couple to the second magnetic field to output electrical current to wirelessly power or charge a load.
    Type: Grant
    Filed: May 6, 2016
    Date of Patent: November 12, 2019
    Assignee: QUALCOMM Incorporated
    Inventor: Seong Heon Jeong
  • Patent number: 10461428
    Abstract: A multi-layer laminate antenna includes: a feed line configured to convey electricity; a radiator coupled to the feed line, comprising metal disposed in a first layer of the antenna, and having an edge of a length to radiate energy at a radiating frequency; and dummy metal disposed in a second layer of the antenna that is different from the first layer of the antenna; where a first portion of the dummy metal is configured such that any linear edge of the first portion of the dummy metal disposed outside an area of the second layer overlapped by the radiator is less than half of a radiating wavelength corresponding to the radiating frequency.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: October 29, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Seong Heon Jeong, Mohammad Ali Tassoudji
  • Patent number: 10411493
    Abstract: Certain aspects of the present disclosure are generally directed to apparatus and techniques for wireless charging. One example apparatus generally includes a plurality of inductive elements and signal generation circuitry coupled to the plurality of inductive elements and configured to generate a plurality of signals, where at least two signals of the plurality of signals have different magnitudes. In certain aspects, the signal generation circuitry is configured to drive the plurality of inductive elements using the plurality of signals, where at least one first inductive element of the plurality of inductive elements is driven using at least one first signal of the plurality of signals having a first phase and at least one second inductive element of the plurality of inductive elements is driven using at least one second signal of the plurality of signals having a second phase different from the first phase.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: September 10, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: William Henry Von Novak, III, Mark White, II, Seong Heon Jeong
  • Publication number: 20190267713
    Abstract: A multi-layer laminate antenna includes: a feed line configured to convey electricity; a radiator coupled to the feed line, comprising metal disposed in a first layer of the antenna, and having an edge of a length to radiate energy at a radiating frequency; and dummy metal disposed in a second layer of the antenna that is different from the first layer of the antenna; where a first portion of the dummy metal is configured such that any linear edge of the first portion of the dummy metal disposed outside an area of the second layer overlapped by the radiator is less than half of a radiating wavelength corresponding to the radiating frequency.
    Type: Application
    Filed: February 23, 2018
    Publication date: August 29, 2019
    Inventors: Seong Heon JEONG, Mohammad Ali TASSOUDJI
  • Patent number: 10390468
    Abstract: The present disclosure describes aspects of a wireless power-transmission shield for a wireless charger. The wireless charger includes a wireless power transmitter configured to generate an alternating magnetic field at a charging frequency. As a result of the alternating magnetic field, a spurious electromagnetic field is further generated at a spurious frequency different than the charging frequency. The wireless charger includes a shield having an associated conductivity or an associated impedance. The shield is configured to be substantially transparent to the alternating magnetic field based on the charging frequency and the associated conductivity of the shield or the associated impedance of the shield. The shield is further configured to be lossy to the spurious electromagnetic field based on the spurious frequency and the associated conductivity of the shield or the associated impedance of the shield.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: August 20, 2019
    Assignee: QUALCOMM Incorporated
    Inventor: Seong Heon Jeong
  • Patent number: 10381875
    Abstract: A method and system for providing wireless power transfer through a metal object is provided. In one aspect, an apparatus for wirelessly receiving power via a magnetic field is provided. The apparatus includes a metal cover including an inner portion and an outer portion. The outer portion is configured to form a loop around the inner portion of the metal cover. The outer portion is configured to inductively couple power via the magnetic field. The apparatus includes a receive circuit electrically coupled to the outer portion and configured to receive a current from the outer portion generated in response to the magnetic field. The receive circuit is configured to charge or power a load based on the current.
    Type: Grant
    Filed: February 6, 2015
    Date of Patent: August 13, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Seong Heon Jeong, Mei-Li Chi, Curtis Gong, David George Fern, Francesco Carobolante
  • Publication number: 20190229560
    Abstract: An apparatus is disclosed that implements ultrasonic power transmission with impedance detection. In an example aspect, the apparatus includes an array of ultrasonic transducers and an acoustic-impedance detection system. The acoustic-impedance detection system is configured to transmit an ultrasonic detection pulse from an ultrasonic transducer of the array. Based on the ultrasonic detection pulse, the acoustic-impedance detection system can determine an acoustic impedance at the ultrasonic transducer. Based on the acoustic impedance, the acoustic-impedance detection system can transmit an ultrasonic charging signal.
    Type: Application
    Filed: January 19, 2018
    Publication date: July 25, 2019
    Inventors: William Henry Von Novak, III, Seong Heon Jeong, Cody Wheeland
  • Patent number: 10361588
    Abstract: An electronic device is disclosed, having electronic components and a metal case configured to house the electronic components. A power receiving element may be disposed on the metal case near an edge thereof. The power receiving element may couple with a magnetic field that emanates from the edge of the metal case, when the metal case is exposed to an externally generated magnetic field, to wirelessly receive power from the externally generated magnetic field.
    Type: Grant
    Filed: May 6, 2016
    Date of Patent: July 23, 2019
    Assignee: QUALCOMM Incorporated
    Inventor: Seong Heon Jeong
  • Patent number: 10333350
    Abstract: An apparatus for wireless power reception in an electronic device may include a casing configured to house electronic components of the electronic device. The casing may include a non-conductive support substrate and a metal layer disposed on the support substrate. The apparatus may include a power receiving element configured to magnetically couple to an externally generated magnetic field to produce power for one or more of the electronic components of the electronic device.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: June 25, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Randy Standke, Seong Heon Jeong
  • Patent number: 10333334
    Abstract: An electronic apparatus may include an electrically conductive body configured to magnetically couple to a first magnetic field. A first tuning element may be connected to the electrically conductive body. An electrically conductive coil may be wound about an opening defined by the electrically conductive body, and configured to magnetically couple to a second magnetic field.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: June 25, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Seong Heon Jeong, Charles Edward Wheatley, Francesco Carobolante, Mark White, II
  • Patent number: 10333352
    Abstract: Certain aspects of the present disclosure relate to methods and apparatus for controlling a power level of wireless power transfer. Certain aspects provide a wireless power receiver. The wireless power receiver includes an antenna and a rectifier. The rectifier includes a first diode and a second diode. The wireless power receiver further includes a resistor in parallel with the first diode. A first terminal of the resistor is coupled to a first terminal of the first diode. A second terminal of the resistor is coupled to a second terminal of the first diode.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: June 25, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: William Henry Von Novak, III, Linda Stacey Irish, Cody Burton Wheeland, Seong Heon Jeong