Abstract: A semiconductor wafer cleaning composition for used in a semiconductor device manufacturing process and a method of cleaning a semiconductor wafer using the cleaning composition are provided. The cleaning composition includes surfactants represented by Formula 1 and Formula 2, respectively, an organic or inorganic acid, and water occupying for the remaining proportion. The cleaning method is a method of immersing a semiconductor wafer in the cleaning composition for 100 to 500 seconds. The cleaning composition and the cleaning method according to the present disclosure provide an incredibility improved removal rate and an effective cleaning power for contaminants, especially organic wax, during a process of polishing the surface of a wafer used to manufacture semiconductor devices, thereby providing a super-cleaned wafer surface, resulting in production of reliable semiconductor devices.

Abstract: A non-volatile memory device including a substrate including a first area and a second area, a mold structure on the substrate, the mold structure including gate electrodes and mold insulating films alternately stacked on each other in a stepwise manner, an interlayer insulating film covering the mold structure, a channel structure on the first area, the channel structure extending through the mold structure and connected to the gate electrodes, and a through-contact on the second area and extending through the interlayer insulating film, the through-contact including a first portion in a first trench and a second portion in a second trench, the first portion including a liner film along a sidewall and a bottom surface of the first trench and a filling film on the liner film, wherein the filling film being a multi-grain conductive material, and the second portion being a single grain conductive material, may be provided.

Abstract: A wafer level package includes: a substrate; an element portion disposed on one surface of the substrate; a cap disposed on the substrate to cover the element portion; a connection portion electrically connected to the element portion; and a bonding portion disposed on an outer side of the connection portion, wherein the bonding portion is disposed on a first surface of one of the substrate and the cap, wherein one end portion of the connection portion is disposed on a second surface having a step difference from the first surface, and wherein the connection portion and the bonding portion are formed of a eutectic material.

Abstract: A curable composition is provided. The curable composition can eliminate or minimize the generation of bubbles inside the cured product after the initiation reaction of the curable monomer, prevent expansion of a material when used to encapsulate a device, and provide a uniform cured product to solve the problem of separation between the upper and lower substrates bonded together, thereby improving device encapsulation performance.

Abstract: Provided is a chemical test apparatus for testing a chemical used to process a substrate, the chemical test apparatus including a first line providing an inlet through which the chemical is introduced, and a passage through which the chemical moves, a second line having an end and another end connected to two separate points of the first line, and providing a passage in which the chemical introduced into the first line is filled, a discharge line connected to a lower end of the first line, and a valve disposed between the first line and the discharge line at least below portions of the first line connected to the second line, to open or close a passage through which the chemical moves from the first line to the discharge line.

Abstract: The present disclosure relates to an electronic device, and more specifically, to an electronic device including a printed circuit board including a heat-generating element arranged on one surface thereof, and a heat transfer coin provided such that one surface of the heat transfer coin comes into contact with a portion of the other surface of the printed circuit board, opposite to the heat-generating element, so as to dissipate heat generated from the heat-generating element. Accordingly, the present disclosure provides an advantage of improving heat dissipation performance without increasing the thickness of the printed circuit board.

Abstract: A communication apparatus is provided to include an apparatus enclosure that includes a substrate seating surface and at least one or more connection grooves formed on the substrate seating surface, a first printed circuit board disposed on the substrate seating surface, a second printed circuit board disposed on the substrate seating surface on one side of the first printed circuit board, and at least one or more connectors disposed within the connection groove and configured to electrically connect the first printed circuit board and the second printed circuit board.

Abstract: The present invention relates to a signal shielding apparatus and an antenna apparatus including same, and in particular, comprises a shield cover which is stacked and disposed on a printed board assembly (hereinafter, abbreviated to “PBA”), in which a plurality of signal-related components are mounted on one side thereof to prevent leakage of a signal from the plurality of signal-related components, wherein a grooved shield cover seating groove is formed in one surface of the PBA, and an insertion end insertably seated in the shield cover seating groove is integrally formed in the other surface from among one surface and the other surface of the shield cover, the other surface facing the one surface of the PBA, thereby providing advantages in that an increase in the manufacturing cost may be prevented, EMI shielding may be facilitated, and heat dissipation performance may be significantly improved.

Abstract: A hair dye dispenser according to an embodiment of the present invention includes a housing having an opening hole formed on one side of which a hair dye is provided, a plurality of cartridges disposed inside the housing and accommodating at least one dyeing material, a main body in which the plurality of cartridges are rotatably disposed, a main motor for rotating the main body so that a first cartridge of the plurality of cartridges is located adjacent to the opening hole, a discharge module for discharging the dyeing material contained in the first cartridge, and an accommodating body in which a basket accommodating the dyeing material discharged by the discharge module is placed, wherein the discharge module may include an elevating body that pressurizes the first cartridge when moving up and is separated from the first cartridge when moving down.

Abstract: The present disclosure relates to an armrest tilting device provided on a seat and capable of tilting and adjusting an armrest capable of supporting a user’s arm. The armrest tilting device includes: a shaft which is installed on a seat and has one end installed on an armrest in such a way as to be relatively rotated; a housing which is fastened to the armrest and supports the shaft in the state where the shaft is installed on the armrest; a bracket which is fastened and fixed to the shaft; a ratchet which is rotatably fastened to a hinge member fastened to the bracket; a sector gear portion which is fastened to and rotates together with the armrest and is engaged with the ratchet; a guide plate which is provided on the sector gear portion and where the ratchet moves in one area while being separated from the sector gear portion; and an elastic member which applies an elastic force such that ratchet gear teeth formed on the ratchet are meshed with sector gear teeth formed on the sector gear portion.

Abstract: One embodiment of the present invention provides a welding wire accommodation-container cover comprising: a blocking part which has a shape corresponding to a transverse cross section of a container body part, and which covers the opening of the container body part; side-forming parts which are connected to the blocking part, and which are bent from the blocking part so as to be fitted to encompass the outer side surface of the upper portion of the container body part; side-fixing parts which are alternately provided with the side-forming parts along the side of the blocking part, and which fix neighboring side-forming parts; and a cut part which is formed at the blocking part, and which can be cut so that a welding wire wound around the container body part can be withdrawn to the outside.

Abstract: A heat management system includes a reservoir tank which stores a coolant and can replenish, with the coolant, a coolant line connected to the reservoir tank; a flow path transition valve which is connected to the downstream side, according to the flow direction of the coolant, of the reservoir tank and can control the flow direction of the coolant; and a coolant circulation pump which is connected to the downstream side, according to the flow direction of the coolant, of the flow path transition valve and pumps the coolant along the coolant line, wherein, through the layout structure of the reservoir tank, flow path transition valve, and coolant circulation pump, the distance between parts constituting a coolant system of a vehicle is minimized, and the overall flow of the coolant is formed in the direction of gravity, and, thereby, a pressure drop of the coolant can be reduced.

Abstract: An embodiment of the present invention provides a storage container for welding wire, the storage container comprising: an outer shell which has an outer bottom support portion formed at the bottom thereof and within which a wire storage portion for storing coiled welding wire is formed; a bottom part which is seated on and coupled to the outer bottom support portion; an inner shell which comes into close contact with the inner surface of the outer shell and has an inner bottom support portion formed at the bottom thereof and seated on the bottom part; and a cover which is formed to correspond to the shape of the outer shell and closes the top of the outer shell.

Abstract: The present invention provides a vapor injection module and a heat pump system using the same, the vapor injection module including an expansion valve configured to allow a condensed refrigerant to pass therethrough or expand a condensed refrigerant in accordance with an air conditioning mode, and a gas-liquid separator configured to receive the refrigerant from the expansion valve and separate the refrigerant into a gaseous refrigerant and a liquid refrigerant, in which the expansion valve has a plurality of expansion regions and performs operations of allowing the refrigerant to pass therethrough, performing first-stage expansion on the refrigerant, or performing second-stage expansion on the refrigerant in accordance with arrangement positions of the expansion regions.

Abstract: An embodiment of the present invention provides a retainer ring for welding wire, the retainer ring comprising: a pressure plate which is disposed on a welding wire stack wound and stored in a receiving container so as to press the welding wire stack, and has an opening formed at the center thereof; and a plurality of guide wings which are provided at the outer circumference of the pressure plate to come into contact with the inner wall of the receiving container and each comprise a flexible body that can be changed in shape.

Abstract: The present invention provides a vapor injection module including a first expansion means configured to block a flow of a condensed refrigerant or expand the condensed refrigerant and transmit the refrigerant to a gas-liquid separator in accordance with an air conditioning mode, the gas-liquid separator configured to receive the refrigerant from the first expansion means and separate the refrigerant into a gaseous refrigerant and a liquid refrigerant, and a second expansion means configured to allow the condensed refrigerant to pass therethrough, expand the condensed refrigerant, or expand the liquid refrigerant separated in the gas-liquid separator in accordance with the air conditioning mode.

Abstract: A heat management system of the present invention comprises: a coolant heater for heating coolant; a first coolant pump which is connected to a coolant inlet or a coolant outlet of the coolant heater to pump the coolant and is coupled to the coolant heater; and a second coolant pump which is connected to a battery side to pump the coolant and is coupled to the coolant heater, wherein the coolant heater, the first coolant pump, and the second coolant pump are arranged in an engine room of a vehicle. Thus, a loss of coolant pressure can be reduced in a pipe which connects components constituting a coolant system of the vehicle, such that the performance of the system is improved and noise and vibration in the interior of the vehicle may be reduced.

Abstract: The present invention relates to a hybrid system for water treatment, desalination, and chemical production. The hybrid system of the present invention includes a photoanode, an anode chamber, an anion exchange membrane, a middle chamber, a cation exchange membrane, a cathode chamber, and a cathode. In the middle chamber, saltwater or seawater is desalinated by photoelectrochemical electrodialysis. Chloride ions are generated during the desalination, transferred to the anode chamber, and activated by the photoanode. In the anode chamber, wastewater is treated by the activated chloride ions. In the cathode chamber, at least one chemical species selected from the group consisting of water, oxygen, and carbon dioxide is reduced by electrons supplied from the photoanode.

Abstract: The present invention provides a vapor injection module including a first expansion means having an inlet port into which a refrigerant is introduced, and first line and second line connected to the inlet port so that the introduced refrigerant flows therethrough, the first expansion means being disposed at a connection portion between the first line and the second line and configured to control a flow direction of the refrigerant and whether to expand the refrigerant depending on an air conditioning mode, a gas-liquid separator connected to the first line and configured to separate the introduced refrigerant into a liquid refrigerant and a gaseous refrigerant, a second expansion means connected to a movement passage through which the liquid refrigerant separated in the gas-liquid separator flows, the second expansion means being configured to expand the introduced refrigerant, and a first outlet port connected to the second line and the second expansion means.

Abstract: An electronic device comprising a nonvolatile memory, a memory controller configured to control the nonvolatile memory, and a host connected to the memory controller. In response to a first write signal received from the host, the memory controller is configured to provide the first write signal to the nonvolatile memory, the nonvolatile memory is configured to perform a write operation based on the provided first write signal, generate first metadata based on a result of performing the write operation, and provide the generated first metadata to the host. The host is configured to determine whether to perform garbage collection for the nonvolatile memory using a neural network model trained based on the provided first metadata or the first write signal, provide a garbage collection request signal to the memory controller in response to determining to perform garbage collection.