Patents by Inventor Seong Hwan Park

Seong Hwan Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11953958
    Abstract: A display includes: a display panel; and a panel bottom sheet disposed below the display panel, the panel bottom sheet including: a first heat dissipation layer; a second heat dissipation layer over the first heat dissipation layer, including a first opening formed completely through the second heat dissipation layer in a thickness direction; a heat dissipation coupling interlayer between the first heat dissipation layer and the second heat dissipation layer, and a heat dissipation substrate on the second heat dissipation layer.
    Type: Grant
    Filed: December 12, 2022
    Date of Patent: April 9, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventors: Kang Woo Lee, Boo Kan Ki, June Hyoung Park, Sun Hee Oh, Dong Hyeon Lee, Jeong In Lee, Hyuk Hwan Kim, Seong Sik Choi
  • Patent number: 11925084
    Abstract: A display panel can include a substrate, a light-emitting element including an emission region on the substrate, a reference voltage line adjacent to the light-emitting element, and a branch line connected to the reference voltage line to apply a reference voltage to light-emitting element. The light-emitting element can emit light on the emission region in a direction of the substrate. Further, the branch line can include a semiconductor layer, and the semiconductor layer of the branch line can overlap the emission region.
    Type: Grant
    Filed: December 16, 2022
    Date of Patent: March 5, 2024
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Dong Yoon Lee, Kwang Yong Choi, Seong Hwan Hwang, Byeong Uk Gang, Hye Min Park
  • Publication number: 20230197342
    Abstract: A ceramic electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; a first band electrode disposed on a portion of the first surface adjacent to the third surface; a second band electrode disposed on another portion of the first surface adjacent to the fourth surface; and insulating members disposed between the first and second band electrodes disposed on the first surface and spaced apart from each other, wherein the first surface is exposed through a space between the plurality of insulating members.
    Type: Application
    Filed: March 28, 2022
    Publication date: June 22, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seong Hwan PARK, Kyung Moon JUNG, Sung Jun LIM
  • Patent number: 11674875
    Abstract: A fluid medium monitoring apparatus of the present invention comprises: a light source unit for irradiating light; a first collimator unit for collimating light irradiated from the light source unit; a flow cell unit in which a fluid medium flows and light is allowed to absorb the wavelength of the fluid medium while proceeding along the moving direction of the fluid medium; and a light detection unit for detecting the wavelength of the light passing through the flow cell unit.
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: June 13, 2023
    Assignees: ZEUS CO., LTD., ZEUS ENP CO., LTD.
    Inventors: Hyun Kook Park, Chang Ho Choi, Seong Hwan Park
  • Publication number: 20230141373
    Abstract: A composite electronic component includes a ceramic electronic component including a body, comprising a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode; and an interposer including a substrate, disposed below the body, and a connection electrode disposed on the substrate and connected to the external electrode by a connection member. The external electrode includes a first electrode layer including metal particles and an insulating resin.
    Type: Application
    Filed: April 12, 2022
    Publication date: May 11, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyung Moon Jung, Seong Hwan Park, Sung Jun Lim
  • Publication number: 20220349814
    Abstract: A flow cell device of the present invention comprises a flow path part in which a flow medium flows, and a flow cell part in which a flow path is formed.
    Type: Application
    Filed: March 20, 2020
    Publication date: November 3, 2022
    Applicants: ZEUS CO., LTD., ZEUS ENP CO., LTD.
    Inventors: Hyun Kook PARK, Seong Hwan PARK
  • Publication number: 20220189796
    Abstract: The present invention relates to an etching device and an etching method thereof, the etching device comprising: an etchant supply unit for supplying an etchant to an etching chamber; a rinsing liquid supply unit for supplying a rinsing liquid to the etching chamber; a cleaning liquid supply unit for supplying a cleaning liquid to the etching chamber; and a first pressurization maintaining unit for maintaining at least one of the etching chamber and the etchant supply unit in a pressurized atmosphere.
    Type: Application
    Filed: April 22, 2020
    Publication date: June 16, 2022
    Applicant: ZEUS CO., LTD.
    Inventors: Seung Hoon LEE, Sung Won MO, Yang Ho LEE, Jeong Hyun BAE, Seong Hwan PARK, Hyun Dong CHO
  • Publication number: 20220115248
    Abstract: The present invention relates to an etching device using an etching chamber, comprising: an etchant storage chamber in which an etchant is stored; a connection unit communicating with the etching liquid storage chamber; an etching chamber which is connected with the etching liquid storage chamber through the connection unit, and in which an object is etched; and a pressurization maintaining unit for maintaining the etching liquid storage chamber and/or the etching chamber in a pressurized atmosphere.
    Type: Application
    Filed: April 22, 2020
    Publication date: April 14, 2022
    Applicant: ZEUS CO., LTD.
    Inventors: Seung Hoon LEE, Sung Won MO, Yang Ho LEE, Jeong Hyun BAE, Seong Hwan PARK, Hyun Dong CHO
  • Publication number: 20220108897
    Abstract: The present invention relates to an etching device comprising: an etching chamber; an opening/closing unit for opening/closing the etching chamber; and a locking unit for selectively locking the opening/closing unit.
    Type: Application
    Filed: April 22, 2020
    Publication date: April 7, 2022
    Applicant: ZEUS CO., LTD.
    Inventors: Seung Hoon LEE, Sung Won MO, Joo Hyoung LEE, Beom Su KI, Seong Hwan PARK, Hyun Dong CHO
  • Publication number: 20220057314
    Abstract: A fluid medium monitoring apparatus of the present invention comprises: a light source unit for irradiating light; a first collimator unit for collimating light irradiated from the light source unit; a flow cell unit in which a fluid medium flows and light is allowed to absorb the wavelength of the fluid medium while proceeding along the moving direction of the fluid medium; and a light detection unit for detecting the wavelength of the light passing through the flow cell unit.
    Type: Application
    Filed: March 20, 2020
    Publication date: February 24, 2022
    Applicants: ZEUS CO., LTD., ZEUS ENP CO., LTD.
    Inventors: Hyun Kook PARK, Chang Ho CHOI, Seong Hwan PARK
  • Patent number: 11244921
    Abstract: A semiconductor package is provided. The semiconductor package includes a connection structure, a semiconductor chip, and a connection metal. The connection structure includes a redistribution layer and a connection via layer. The semiconductor chip is disposed on the connection structure, and includes a connection pad. The connection metal is disposed on the connection structure and is electrically connected to the connection pad by the connection structure. The connection via layer includes a connection via having a major axis and a minor axis, and in a plan view, the minor axis of the connection via intersects with the connection metal.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: February 8, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chang Eun Joo, Sung Hoan Kim, Kyung Moon Jung, Yong Hwan Kwon, Young Kyu Lim, Seong Hwan Park
  • Publication number: 20210296140
    Abstract: A double tube structure flow cell apparatus according to the present disclosure includes: a first flow path formation part connected to a medium inlet part such that a fluid medium is introduced into the medium inlet part and having a first flow path part such that the fluid medium flows in the first flow path part; a second flow path formation part having a second flow path part in communication with the first flow path part and connected to a medium discharge part such that the fluid medium of the second flow path part is discharged through the medium discharge part; and a bubble discharge part connected to the first flow path formation part to discharge air bubbles mixed with the fluid medium of the first flow path part.
    Type: Application
    Filed: February 12, 2021
    Publication date: September 23, 2021
    Applicants: ZEUS CO., LTD., ZEUS ENP CO., LTD.
    Inventors: Hyun Kook PARK, Seong Hwan PARK
  • Patent number: 11119259
    Abstract: The present invention relates to a flexible color filter. More specifically, the present invention is characterized in that a separation layer, a protective layer, a black matrix layer and a pixel layer are sequentially laminated, wherein the protective layer comprises one or more polymers selected from polymers represented by chemical formula 1 or chemical formula 2.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: September 14, 2021
    Assignee: Dongwoo Fine-Chem Co., Ltd.
    Inventors: Sung Hoon Cho, Sang Kook Kim, Seong Hwan Park, Seung June Park
  • Patent number: 10894390
    Abstract: A film touch sensor includes a separation layer, a protective layer disposed on the separation layer, and an electrode pattern layer which is disposed on the protective layer and includes an insulation layer formed by curing an insulation layer forming composition comprising a polymer having a repeating unit represented by Formula 1 or 2, such that it is possible to suppress thermal damage which may occur in high-temperature deposition and annealing processes, and significantly reduce an occurrence rate of cracks during peeling-off the same from a carrier substrate.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: January 19, 2021
    Assignee: DONGWOO FINE-CHEM CO., LTD.
    Inventors: Sang Kook Kim, Seong Hwan Park, Seung June Park, Sung Hoon Cho
  • Patent number: 10887983
    Abstract: A printed circuit board includes a circuit layer and a ground layer disposed above the circuit layer. The ground layer includes ground layer sections each having metal members, arranged in parallel in one direction on a plane. Areas of the metal members of adjacent ground layer sections are different from each other. The areas of the metal members are determined based on respective areas of circuits of the circuit layer corresponding to respective ground layer sections.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: January 5, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung-Jun Lim, Seong-Hwan Park, Kyung-Ho Lee, Kyung-Moon Jung, Chul-Kyu Kim
  • Patent number: 10870260
    Abstract: A film touch sensor includes a separation layer, a protective layer which is disposed on the separation layer and is a cured layer of a polymer having a repeating unit represented by Formula 1 or 2, and an electrode pattern layer disposed on the protective layer, such that it is possible to suppress thermal damage such as wrinkles, or cracks of an protective layer, which may occur in high-temperature deposition and annealing processes, and significantly reduce an occurrence rate of cracks during peeling-off the same from a carrier substrate.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: December 22, 2020
    Assignee: DONGWOO FINE-CHEM CO., LTD.
    Inventors: Sang Kook Kim, Seong Hwan Park, Seung June Park, Sung Hoon Cho
  • Patent number: 10866661
    Abstract: A film touch sensor includes a separation layer; a protective layer disposed on the separation layer, and an electrode pattern layer which is disposed on the protective layer and includes an insulation layer that is a cured layer of a binder resin including (a-1) a resin in which at least a part of a phenolic hydroxyl group or a carboxyl group is protected with an acid decomposable group, (a-2) an acrylic resin containing an epoxy group, and (a-3) an acrylic resin containing an oxetane group, such that it is possible to suppress thermal damage such as wrinkles, or cracks of the insulation layer, which may occur in high-temperature deposition and annealing processes, and significantly reduce an occurrence rate of cracks during peeling-off the same from a carrier substrate.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: December 15, 2020
    Assignee: DONGWOO FINE-CHEM CO., LTD.
    Inventors: Sang Kook Kim, Seong Hwan Park, Min Ju Lim, Sung Hoon Cho
  • Publication number: 20200365545
    Abstract: A semiconductor package is provided. The semiconductor package includes a connection structure, a semiconductor chip, and a connection metal. The connection structure includes a redistribution layer and a connection via layer. The semiconductor chip is disposed on the connection structure, and includes a connection pad. The connection metal is disposed on the connection structure and is electrically connected to the connection pad by the connection structure. The connection via layer includes a connection via having a major axis and a minor axis, and in a plan view, the minor axis of the connection via intersects with the connection metal.
    Type: Application
    Filed: December 20, 2019
    Publication date: November 19, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chang Eun JOO, Sung Hoan KIM, Kyung Moon JUNG, Yong Hwan KWON, Young Kyu LIM, Seong Hwan PARK
  • Patent number: 10824286
    Abstract: A film touch sensor includes a separation layer, a first protection layer on the separation layer, and an electrode pattern layer on the first protection layer. An alkoxy group having 1 to 5 carbon atoms from the separation layer, and at least one substituent group of a hydroxyl group, a carboxyl group or an amide group from the first protection layer are reacted with each other to form a chemical bond between the separation layer and the first protection layer. Thus, electrode damages and cracks are prevented during a detaching process from a carrier substrate to improve flexibility and durability of the film touch sensor.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: November 3, 2020
    Assignee: DONGWOO FINE-CHEM CO., LTD.
    Inventors: Sang Kook Kim, Seung June Park, Seong Hwan Park, Sung Hoon Cho
  • Patent number: 10800372
    Abstract: Provided is a seam-sealed curtain airbag cushion that makes a panel with a fabric to which a silicone coating liquid is applied and doubly couples a first panel and a second panel constituting the panel by means of a silicone sealant and a sewing yarn so as to maintain the internal pressure thereof for a period of time in the event of a side crush or vehicle overturning. The seam-sealed curtain airbag cushion has the improvements in the tensile strength and tearing strength and is not deteriorated in performance even under various external environments.
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: October 13, 2020
    Assignees: IHC CO., LTD., DUAL CO., LTD.
    Inventors: Sang Kwon Kim, Seong Hwan Park