Abstract: A junction passage control system based on a location of an OHT using a power line communication, includes: an OHT controller mounted on an OHT which moves along tracks; and a central controller that is installed in a junction section of the tracks and controls junction passing of a plurality of OHTs, wherein power lines are laid on the tracks in a zone from a start point of the junction section to an end point of the junction section, and the central controller and the OHT controller transmit and receive data for a junction passage control through power line communication to and from each other.

Abstract: The present invention relates to a method for dealing with a loss of coolant accident in a nuclear power plant, and a system therefor. The method for dealing with a loss of coolant accident in a nuclear power plant, according to the present invention, comprises the steps of: determining a fracture size and a fracture position; determining an accident level on the basis of the determined fracture size and fracture position; and activating safeguards according to the accident level.

Abstract: A vehicle bumper and method therefor are provided. The vehicle bumper includes a panel part forming a part of a vehicle body of a vehicle, and a reinforcement part which is disposed on the panel part through a long fiber injection (LFI) process. The reinforcement part reinforces rigidity of the panel part.

Abstract: The present invention relates to a method for dealing with anticipated transient without scram in a nuclear power plant, and a system therefor. The method for dealing with anticipated transient without scream in a nuclear power plant, according to the present invention, comprises the steps of: identifying the pressure of a pressurizer; determining an accident level on the basis of the determined pressure of the pressurizer; and activating safeguards related to the pressure, according to the accident level.

Abstract: The present invention relates to an improved vehicle bumper in which a plurality of panel units are connectable through one reinforcing part and a method of manufacturing the same. The vehicle bumper includes a panel unit including a first panel forming a main protection area and a second panel coupled to the first panel and forming an additional protection area at one side of the main protection area, and a reinforcing panel disposed on non-exposed surfaces of the first panel and the second panel and fixing the first panel and the second panel to each other.

Abstract: The technology relates to an integrated circuit (IC) package. The IC package may include a packaging substrate, an IC die, and an integrated voltage regulator die. The IC die may include a metal layer and a silicon layer. The metal layer may be connected to the packaging substrate. The integrated voltage regulator die may be positioned adjacent to the silicon layer and connected to the packaging substrate via one or more through mold vias or through dielectric vias. The IC die may be an application specific integrated circuit (ASIC) die.

Abstract: There is provided a method of determining a depth of a damage layer formed on a back surface of the substrate. The method comprises irradiating the damage layer with first light and second light; detecting the first light and the second light reflected or scattered by defects in the damage layer; determining a first penetration depth of the first light and a second penetration depth of the second light based on a first wavelength of the first light and a second wavelength of the second light; and determining the depth of the damage layer based on the first penetration depth and the second penetration depth.

Abstract: An external lighting apparatus delivers various messages through selective lighting by applying a lighting function to the exterior of a vehicle. The apparatus includes a light source module with a plurality of light sources and a light guide in which light emitted from the light sources is incident. The light guide reflects the incident light so that the light travels in different areas. The apparatus has a light cover composed of a plurality of transmission parts into which the light, travelling in different areas via the light guide, is incident. The light is emitted to different lighting areas through each transmission part to create a plurality of illumination images.

Abstract: A magnetic memory device includes a lower contact plug on a substrate and a data storage structure on the lower contact plug. The data storage structure includes a bottom electrode, a magnetic tunnel junction pattern, and a top electrode that are sequentially stacked on the lower contact plug. The lower contact plug and the data storage structure have a first thickness and a second thickness, respectively, in a first direction perpendicular to a top surface of the substrate. The first thickness of the lower contact plug is about 2.0 to 3.6 times the second thickness of the data storage structure.

Abstract: A method of manufacturing a chip assembly comprises joining an in-process unit to a printed circuit board; reflowing a bonding material disposed between and electrically connecting the in-process unit with the printed circuit board, the bonding material having a first reflow temperature; and then joining a heat distribution device to the plurality of semiconductor chips using a thermal interface material (“TIM”) having a second reflow temperature that is lower than the first reflow temperature. The in-process unit further comprises a substrate having an active surface, a passive surface, and contacts exposed at the active surface; an interposer electrically connected to the substrate; a plurality of semiconductor chips overlying the substrate and electrically connected to the substrate through the interposer, and a stiffener overlying the substrate and having an aperture extending therethrough, the plurality of semiconductor chips being positioned within the aperture.

Abstract: An external lighting apparatus delivers various messages through selective lighting by applying a lighting function to the exterior of a vehicle. The apparatus includes a light source module with a plurality of light sources and a light guide in which light emitted from the light sources is incident. The light guide reflects the incident light so that the light travels in different areas. The apparatus has a light cover composed of a plurality of transmission parts into which the light, travelling in different areas via the light guide, is incident. The light is emitted to different lighting areas through each transmission part to create a plurality of illumination images.

Abstract: An electrodeionization filter includes: a housing having a water inlet and a water outlet; a first electrode installed inside the housing in a spiral shape; a second electrode installed inside the housing in a spiral shape so as to be spaced apart from the first electrode; and an ion exchange module installed between the first electrode and the second electrode for adsorbing or desorbing ionic substances contained in water introduced by an application of electricity. At least one of the first electrode and the second electrode has a structure in which a center portion thereof is denser than a peripheral region thereof. Accordingly, the lifespan of the electrodes of the electrodeionization filter can be increased, and the assembly of the electrodes and related parts can be easily facilitated.

Abstract: A magnetic memory device includes a lower contact plug on a substrate and a data storage structure on the lower contact plug. The data storage structure includes a bottom electrode, a magnetic tunnel junction pattern, and a top electrode that are sequentially stacked on the lower contact plug. The lower contact plug and the data storage structure have a first thickness and a second thickness, respectively, in a first direction perpendicular to a top surface of the substrate. The first thickness of the lower contact plug is about 2.0 to 3.6 times the second thickness of the data storage structure.

Abstract: The technology relates to an integrated circuit (IC) package in which an interconnection interface chiplet and/or interconnection interface circuit are relocated, partitioned, and/or decoupled from a main or core IC die and/or high-bandwidth memory (HBM) components in an integrated component package.

Abstract: An integrated circuit package including a substrate configured to receive one or more high-bandwidth memory (HBM) stacks on the substrate, an interposer positioned on the substrate and configured to receive a logic die on the interposer, a plurality of interposer channels formed in the interposer and connecting the logic die to the one or more HBM stacks, and a plurality of substrate traces formed in the substrate and configured to interface the plurality of interposer channels to the one or more HBM stacks.

Abstract: The present disclosure may be a deep learning-based method for improving feature map compression efficiency, wherein feature maps can be selectively transmitted from an encoder, and untransmitted feature maps can be predicted and generated after restoring the image quality of the transmitted feature maps using a deep neural network.

Abstract: A method for producing a lead-free X-ray shielding material using bismuth iodide is provided, the method including a first step of producing porous PDMS (Polydimethylsiloxane); a second step of producing a mixed solution of BiI3 and THF; and a third step of immersing the porous PDMS into the mixed solution such that the BiI3 is loaded into the porous PDMS to produce a BiI3-PDMS composite material.

Abstract: The technology relates to an integrated circuit (IC) package. The IC package may include a substrate. An IC die may be mounted to the substrate. One or more photonic modules may be attached to the substrate and one or more serializer/deserializer (SerDes) interfaces may connect the IC die to the one or more photonic modules. The IC die may be an application specific integrated circuit (ASIC) die and the one or more photonic modules may include a photonic integrated circuit (PIC) and fiber array. The one or more photonic modules may be mounted to one or more additional substrates which may be attached to the substrate via one or more sockets.

Abstract: Disclosed is a method of manufacturing a transparent stretchable substrate according to various embodiments of the present disclosure. The method may include generating a substrate part formed of an elastic material, generating an auxetic including a plurality of unit structures on the substrate part, and generating a fixing part on the substrate part on which the auxetic is generated.

Abstract: An IC die includes a temperature control element suitable for three-dimensional IC package with enhanced thermal control and management. The temperature control element may be formed as an integral part of an IC die that may assist temperature control of the IC die when in operation. The temperature control element may include a heat dissipation material disposed therein to assist dissipating thermal energy generated by the plurality of devices in the IC die during operation.