Abstract: A cover type touch switch structure includes: a seat housing embedded in a seat of a vehicle so as to be fastened to a seat frame; a switch housing disposed in the seat housing and including an outer surface which is coupled to the seat housing via a hook; a light-emitting unit which is disposed in the switch housing and stacked on the seat frame; and a knob unit which has a portion disposed in the switch housing and is stacked on the light-emitting unit.

Abstract: A method of retrieving a document according to an embodiment of the present application includes: acquiring a user retrieval query; calculating a user inquiry vector in a unit of sentence from the user retrieval query and acquiring a first document candidate group based on similarity between the calculated user inquiry vector and an embedding vector of a document stored in a retrieval database; acquiring a second document candidate group based on similarity between a text included in the user retrieval query and a text of the document stored in the retrieval database; and determining a summarization target document based on the first document candidate group and the second document candidate group.

Abstract: A hood-integrated vehicle body in which a hood, a bumper, and a fender are integrally formed into a single component so as to reduce the weight thereof is disclosed. The hood-integrated vehicle body includes a front vehicle body part, which is constructed such that a hood is integrally and rotatably connected to a front portion of the front vehicle body part and is openable at a rear side thereof, a lifting unit mounted to the front part of the vehicle so as to rotate the hood, and a locking unit, which is mounted to the front part of the vehicle so as to selectively engage the hood with the front part of the vehicle such that the engagement of the hood is released so as to allow the hood to be opened by means of the lifting unit upon manipulation for opening the hood.

Abstract: An inspecting apparatus capable of performing an inspection of equipment without destroying the equipment and semiconductor manufacturing equipment including the inspecting apparatus are provided. The inspecting apparatus includes: a measurement module measuring a first impedance at a first port, and a second impedance at a second port; a comparison module comparing the first and second impedances; and a determination module determining whether the equipment part is operating properly based on a result of the comparison of the first and second impedances, wherein the first impedance includes a first resistance and a first reactance, the second impedance includes a second resistance and a second reactance, and the determination module determines whether the equipment part is operating properly based on at least one of a result of the comparison of the first and second resistances and a result of the comparison of the first and second reactances.

Abstract: A memory device includes a plurality of memory planes, each including a plurality of memory banks; one or more plane groups, each comprising at least two memory planes sharing at least one peripheral circuit; a plurality of compressing circuits, each connected to a corresponding memory bank and outputting compressed data by compressing data read from the corresponding memory bank; a plurality of merge circuits, each receiving compressed data and at least one output control signal corresponding to a merge group of a plurality of merge groups, each merge circuit outputting, in response to at least one output control signal, merged data obtained by merging compressed data corresponding to memory banks grouped in the merge group; and an output buffer circuit latching and outputting the merged data in response to at least one output control signal. The merge group comprises at least two memory banks in a same plane group.

Abstract: A system on chip and a mobile device are provided, the mobile device including a processor that receives raw image data, processes the raw image data into floating-point format image data, and output the floating-point format image data; a memory that stores therein the floating-point format image data; and a display processing unit that receives the floating-point format image data stored in the memory therefrom, and performs high dynamic range (HDR) processing on the floating-point format image data.

Abstract: A method of manufacturing a chip assembly comprises joining an in-process unit to a printed circuit board; reflowing a bonding material disposed between and electrically connecting the in-process unit with the printed circuit board, the bonding material having a first reflow temperature; and then joining a heat distribution device to the plurality of semiconductor chips using a thermal interface material (“TIM”) having a second reflow temperature that is lower than the first reflow temperature. The in-process unit further comprises a substrate having an active surface, a passive surface, and contacts exposed at the active surface; an interposer electrically connected to the substrate; a plurality of semiconductor chips overlying the substrate and electrically connected to the substrate through the interposer, and a stiffener overlying the substrate and having an aperture extending therethrough, the plurality of semiconductor chips being positioned within the aperture.

Abstract: This disclosure relates to deep trench capacitors embedded in a package substrate on which an integrated circuit is mounted. In some aspects, a chip package includes an integrated circuit die that has a power distribution circuit for one or more circuits of the integrated circuit. The chip package also includes a substrate different from the integrated circuit and having a first surface on which the integrated circuit die is mounted and a second surface opposite the first surface. The substrate includes one or more cavities formed in at least one of the first surface or the second surface. The chip package also includes one or more deep trench capacitors disposed in at least one of the one or more cavities. Each deep trench capacitor is connected to the power distribution circuit by conductors.

Abstract: Disclosed are a display device and a method of manufacturing the display device. The display device includes a display panel on which a plurality of sub-pixels and lines connected to the sub-pixels and a driving circuit configured to drive the sub-pixels. The display panel further includes a plurality of protruded bank patterns disposed in the sub-pixels, and a light emitting element disposed in each of the bank patterns. The light emitting element includes a first electrode, a second electrode, a light emitting layer disposed between the first electrode and the second electrode, and a reflector that covers side surfaces of the light emitting layer and at least a portion of side surfaces of the first electrode. The reflector includes a first insulating layer, a second insulating layer, and a metal layer disposed between the first insulating layer and the second insulating layer.

Abstract: A method of operating a washing machine appliance includes measuring a humidity value with the humidity sensor and comparing the measured humidity value to an expected humidity value. The method also includes flagging a fault in response to the measured humidity value differing from the expected humidity value by at least a predetermined threshold.

Abstract: A junction passage control system based on a location of an OHT using a power line communication, includes: an OHT controller mounted on an OHT which moves along tracks; and a central controller that is installed in a junction section of the tracks and controls junction passing of a plurality of OHTs, wherein power lines are laid on the tracks in a zone from a start point of the junction section to an end point of the junction section, and the central controller and the OHT controller transmit and receive data for a junction passage control through power line communication to and from each other.

Abstract: The present invention relates to a method for dealing with a loss of coolant accident in a nuclear power plant, and a system therefor. The method for dealing with a loss of coolant accident in a nuclear power plant, according to the present invention, comprises the steps of: determining a fracture size and a fracture position; determining an accident level on the basis of the determined fracture size and fracture position; and activating safeguards according to the accident level.

Abstract: A vehicle bumper and method therefor are provided. The vehicle bumper includes a panel part forming a part of a vehicle body of a vehicle, and a reinforcement part which is disposed on the panel part through a long fiber injection (LFI) process. The reinforcement part reinforces rigidity of the panel part.

Abstract: The present invention relates to an improved vehicle bumper in which a plurality of panel units are connectable through one reinforcing part and a method of manufacturing the same. The vehicle bumper includes a panel unit including a first panel forming a main protection area and a second panel coupled to the first panel and forming an additional protection area at one side of the main protection area, and a reinforcing panel disposed on non-exposed surfaces of the first panel and the second panel and fixing the first panel and the second panel to each other.

Abstract: The present invention relates to a method for dealing with anticipated transient without scram in a nuclear power plant, and a system therefor. The method for dealing with anticipated transient without scream in a nuclear power plant, according to the present invention, comprises the steps of: identifying the pressure of a pressurizer; determining an accident level on the basis of the determined pressure of the pressurizer; and activating safeguards related to the pressure, according to the accident level.

Abstract: The technology relates to an integrated circuit (IC) package. The IC package may include a packaging substrate, an IC die, and an integrated voltage regulator die. The IC die may include a metal layer and a silicon layer. The metal layer may be connected to the packaging substrate. The integrated voltage regulator die may be positioned adjacent to the silicon layer and connected to the packaging substrate via one or more through mold vias or through dielectric vias. The IC die may be an application specific integrated circuit (ASIC) die.

Abstract: There is provided a method of determining a depth of a damage layer formed on a back surface of the substrate. The method comprises irradiating the damage layer with first light and second light; detecting the first light and the second light reflected or scattered by defects in the damage layer; determining a first penetration depth of the first light and a second penetration depth of the second light based on a first wavelength of the first light and a second wavelength of the second light; and determining the depth of the damage layer based on the first penetration depth and the second penetration depth.

Abstract: An external lighting apparatus delivers various messages through selective lighting by applying a lighting function to the exterior of a vehicle. The apparatus includes a light source module with a plurality of light sources and a light guide in which light emitted from the light sources is incident. The light guide reflects the incident light so that the light travels in different areas. The apparatus has a light cover composed of a plurality of transmission parts into which the light, travelling in different areas via the light guide, is incident. The light is emitted to different lighting areas through each transmission part to create a plurality of illumination images.

Abstract: A magnetic memory device includes a lower contact plug on a substrate and a data storage structure on the lower contact plug. The data storage structure includes a bottom electrode, a magnetic tunnel junction pattern, and a top electrode that are sequentially stacked on the lower contact plug. The lower contact plug and the data storage structure have a first thickness and a second thickness, respectively, in a first direction perpendicular to a top surface of the substrate. The first thickness of the lower contact plug is about 2.0 to 3.6 times the second thickness of the data storage structure.

Abstract: A method of manufacturing a chip assembly comprises joining an in-process unit to a printed circuit board; reflowing a bonding material disposed between and electrically connecting the in-process unit with the printed circuit board, the bonding material having a first reflow temperature; and then joining a heat distribution device to the plurality of semiconductor chips using a thermal interface material (“TIM”) having a second reflow temperature that is lower than the first reflow temperature. The in-process unit further comprises a substrate having an active surface, a passive surface, and contacts exposed at the active surface; an interposer electrically connected to the substrate; a plurality of semiconductor chips overlying the substrate and electrically connected to the substrate through the interposer, and a stiffener overlying the substrate and having an aperture extending therethrough, the plurality of semiconductor chips being positioned within the aperture.