Patents by Inventor Seong Hwan Park
Seong Hwan Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12666901Abstract: The present invention relates to an etching device and an etching method thereof, the etching device comprising: an etchant supply unit for supplying an etchant to an etching chamber, a rinsing liquid supply unit for supplying a rinsing liquid to the etching chamber; a cleaning liquid supply unit for supplying a cleaning liquid to the etching chamber; and a first pressurization maintaining unit for maintaining at least one of the etching chamber and the etchant supply unit in a pressurized atmosphere.Type: GrantFiled: September 5, 2024Date of Patent: June 23, 2026Assignee: ZEUS CO., LTD.Inventors: Seung Hoon Lee, Sung Won Mo, Yang Ho Lee, Jeong Hyun Bae, Seong Hwan Park, Hyun Dong Cho
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Publication number: 20260148540Abstract: A memory in which a training program for identifying concepts that degrade the performance of a concept bottleneck model and training the concept bottleneck model is stored; and a processor configured to execute the training program, wherein the training program: receives a training image set, trains a first concept bottleneck model to infer at least one class using the training image set, trains a second concept bottleneck model by applying a predetermined ratio of noise to the training image set, evaluates the first concept bottleneck model and the second concept bottleneck model using a test image set, and selects concepts that degrade the prediction accuracy of the concept bottleneck model for a specific class using weight information for each concept included in the evaluation results, and wherein the training image set includes: a target label representing a specific class and a concept label corresponding to the target label.Type: ApplicationFiled: November 29, 2024Publication date: May 28, 2026Inventors: Nam Hoon LEE, Seong Hwan PARK, Ju Eun MOON
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Patent number: 12573560Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, the body having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction, and first and second external electrodes respectively disposed on the third and fourth surfaces, and a ceramic chip including a ceramic substrate and first and second terminal electrodes disposed on the ceramic substrate and respectively connected to the first and second external electrodes, the ceramic chip disposed on the first surface of the body. The ceramic substrate includes Mg2SiO4.Type: GrantFiled: September 8, 2023Date of Patent: March 10, 2026Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyung Moon Jung, Seong Hwan Park, Dong Hyeon Lee
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Patent number: 12532697Abstract: The present invention relates to an etching device and an etching method thereof, the etching device comprising: an etchant supply unit for supplying an etchant to an etching chamber; a rinsing liquid supply unit for supplying a rinsing liquid to the etching chamber, a cleaning liquid supply unit for supplying a cleaning liquid to the etching chamber, and a first pressurization maintaining unit for maintaining at least one of the etching chamber and the etchant supply unit in a pressurized atmosphere.Type: GrantFiled: April 22, 2020Date of Patent: January 20, 2026Assignee: ZEUS CO., LTD.Inventors: Seung Hoon Lee, Sung Won Mo, Yang Ho Lee, Jeong Hyun Bae, Seong Hwan Park, Hyun Dong Cho
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Publication number: 20250361354Abstract: A resin composition for encapsulating an electronic device according to an embodiment includes an epoxy compound, an inorganic filler, a (meth)acrylamide compound containing an alkoxysilyl group, and a release agent. The release agent may include a wax having an average acid value of 15 mgKOH/g to 200 mgKOH/g. An electronic device may include a sealant formed of the resin composition.Type: ApplicationFiled: May 19, 2025Publication date: November 27, 2025Inventors: YU MI AHN, MIN SEOK KI, SU SEONG KIM, SEONG HWAN PARK
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Publication number: 20250333619Abstract: A resin composition for sealing an electronic device includes epoxy compounds including a biphenyl-based epoxy compound and a biphenyl-aralkyl-based epoxy compound, and an inorganic filler containing alumina particles surface treated with a silane agent containing an alkyl group having 7 or more carbon atoms. The weight ratio of the biphenyl-based compound to the biphenyl-aralkyl-based compound from among the epoxy compounds is from 1:1.4 to 1:4.5.Type: ApplicationFiled: July 9, 2025Publication date: October 30, 2025Inventors: YU MI AHN, JEONG MIN KANG, SU SEONG KIM, SEONG HWAN PARK, DONG CHAN LEE
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Patent number: 12260994Abstract: A composite electronic component includes a ceramic electronic component including a body, comprising a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode; and an interposer including a substrate, disposed below the body, and a connection electrode disposed on the substrate and connected to the external electrode by a connection member. The external electrode includes a first electrode layer including metal particles and an insulating resin.Type: GrantFiled: April 12, 2022Date of Patent: March 25, 2025Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyung Moon Jung, Seong Hwan Park, Sung Jun Lim
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Patent number: 12183515Abstract: A ceramic electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; a first band electrode disposed on a portion of the first surface adjacent to the third surface; a second band electrode disposed on another portion of the first surface adjacent to the fourth surface; and insulating members disposed between the first and second band electrodes disposed on the first surface and spaced apart from each other, wherein the first surface is exposed through a space between the plurality of insulating members.Type: GrantFiled: March 28, 2022Date of Patent: December 31, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seong Hwan Park, Kyung Moon Jung, Sung Jun Lim
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Publication number: 20240429069Abstract: The present invention relates to an etching device and an etching method thereof, the etching device comprising: an etchant supply unit for supplying an etchant to an etching chamber, a rinsing liquid supply unit for supplying a rinsing liquid to the etching chamber; a cleaning liquid supply unit for supplying a cleaning liquid to the etching chamber; and a first pressurization maintaining unit for maintaining at least one of the etching chamber and the etchant supply unit in a pressurized atmosphere.Type: ApplicationFiled: September 5, 2024Publication date: December 26, 2024Applicant: ZEUS CO., LTD.Inventors: Seung Hoon LEE, Sung Won MO, Yang Ho LEE, Jeong Hyun BAE, Seong Hwan PARK, Hyun Dong CHO
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Publication number: 20240212939Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, the body having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction, and first and second external electrodes respectively disposed on the third and fourth surfaces, and a ceramic chip including a ceramic substrate and first and second terminal electrodes disposed on the ceramic substrate and respectively connected to the first and second external electrodes, the ceramic chip disposed on the first surface of the body. The ceramic substrate includes Mg2SiO4.Type: ApplicationFiled: September 8, 2023Publication date: June 27, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyung Moon JUNG, Seong Hwan PARK, Dong Hyeon LEE
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Patent number: 12013327Abstract: A flow cell device of the present invention comprises a flow path part in which a flow medium flows, and a flow cell part in which a flow path is formed.Type: GrantFiled: March 20, 2020Date of Patent: June 18, 2024Assignees: ZEUS CO., LTD., ZEUS ENP CO., LTD.Inventors: Hyun Kook Park, Seong Hwan Park
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Publication number: 20230197342Abstract: A ceramic electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; a first band electrode disposed on a portion of the first surface adjacent to the third surface; a second band electrode disposed on another portion of the first surface adjacent to the fourth surface; and insulating members disposed between the first and second band electrodes disposed on the first surface and spaced apart from each other, wherein the first surface is exposed through a space between the plurality of insulating members.Type: ApplicationFiled: March 28, 2022Publication date: June 22, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seong Hwan PARK, Kyung Moon JUNG, Sung Jun LIM
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Patent number: 11674875Abstract: A fluid medium monitoring apparatus of the present invention comprises: a light source unit for irradiating light; a first collimator unit for collimating light irradiated from the light source unit; a flow cell unit in which a fluid medium flows and light is allowed to absorb the wavelength of the fluid medium while proceeding along the moving direction of the fluid medium; and a light detection unit for detecting the wavelength of the light passing through the flow cell unit.Type: GrantFiled: March 20, 2020Date of Patent: June 13, 2023Assignees: ZEUS CO., LTD., ZEUS ENP CO., LTD.Inventors: Hyun Kook Park, Chang Ho Choi, Seong Hwan Park
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Publication number: 20230141373Abstract: A composite electronic component includes a ceramic electronic component including a body, comprising a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode; and an interposer including a substrate, disposed below the body, and a connection electrode disposed on the substrate and connected to the external electrode by a connection member. The external electrode includes a first electrode layer including metal particles and an insulating resin.Type: ApplicationFiled: April 12, 2022Publication date: May 11, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyung Moon Jung, Seong Hwan Park, Sung Jun Lim
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Publication number: 20220349814Abstract: A flow cell device of the present invention comprises a flow path part in which a flow medium flows, and a flow cell part in which a flow path is formed.Type: ApplicationFiled: March 20, 2020Publication date: November 3, 2022Applicants: ZEUS CO., LTD., ZEUS ENP CO., LTD.Inventors: Hyun Kook PARK, Seong Hwan PARK
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Publication number: 20220189796Abstract: The present invention relates to an etching device and an etching method thereof, the etching device comprising: an etchant supply unit for supplying an etchant to an etching chamber; a rinsing liquid supply unit for supplying a rinsing liquid to the etching chamber; a cleaning liquid supply unit for supplying a cleaning liquid to the etching chamber; and a first pressurization maintaining unit for maintaining at least one of the etching chamber and the etchant supply unit in a pressurized atmosphere.Type: ApplicationFiled: April 22, 2020Publication date: June 16, 2022Applicant: ZEUS CO., LTD.Inventors: Seung Hoon LEE, Sung Won MO, Yang Ho LEE, Jeong Hyun BAE, Seong Hwan PARK, Hyun Dong CHO
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Publication number: 20220115248Abstract: The present invention relates to an etching device using an etching chamber, comprising: an etchant storage chamber in which an etchant is stored; a connection unit communicating with the etching liquid storage chamber; an etching chamber which is connected with the etching liquid storage chamber through the connection unit, and in which an object is etched; and a pressurization maintaining unit for maintaining the etching liquid storage chamber and/or the etching chamber in a pressurized atmosphere.Type: ApplicationFiled: April 22, 2020Publication date: April 14, 2022Applicant: ZEUS CO., LTD.Inventors: Seung Hoon LEE, Sung Won MO, Yang Ho LEE, Jeong Hyun BAE, Seong Hwan PARK, Hyun Dong CHO
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Publication number: 20220108897Abstract: The present invention relates to an etching device comprising: an etching chamber; an opening/closing unit for opening/closing the etching chamber; and a locking unit for selectively locking the opening/closing unit.Type: ApplicationFiled: April 22, 2020Publication date: April 7, 2022Applicant: ZEUS CO., LTD.Inventors: Seung Hoon LEE, Sung Won MO, Joo Hyoung LEE, Beom Su KI, Seong Hwan PARK, Hyun Dong CHO
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Publication number: 20220057314Abstract: A fluid medium monitoring apparatus of the present invention comprises: a light source unit for irradiating light; a first collimator unit for collimating light irradiated from the light source unit; a flow cell unit in which a fluid medium flows and light is allowed to absorb the wavelength of the fluid medium while proceeding along the moving direction of the fluid medium; and a light detection unit for detecting the wavelength of the light passing through the flow cell unit.Type: ApplicationFiled: March 20, 2020Publication date: February 24, 2022Applicants: ZEUS CO., LTD., ZEUS ENP CO., LTD.Inventors: Hyun Kook PARK, Chang Ho CHOI, Seong Hwan PARK
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Patent number: 11244921Abstract: A semiconductor package is provided. The semiconductor package includes a connection structure, a semiconductor chip, and a connection metal. The connection structure includes a redistribution layer and a connection via layer. The semiconductor chip is disposed on the connection structure, and includes a connection pad. The connection metal is disposed on the connection structure and is electrically connected to the connection pad by the connection structure. The connection via layer includes a connection via having a major axis and a minor axis, and in a plan view, the minor axis of the connection via intersects with the connection metal.Type: GrantFiled: December 20, 2019Date of Patent: February 8, 2022Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Chang Eun Joo, Sung Hoan Kim, Kyung Moon Jung, Yong Hwan Kwon, Young Kyu Lim, Seong Hwan Park