Patents by Inventor Seong Hwan Park

Seong Hwan Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12666901
    Abstract: The present invention relates to an etching device and an etching method thereof, the etching device comprising: an etchant supply unit for supplying an etchant to an etching chamber, a rinsing liquid supply unit for supplying a rinsing liquid to the etching chamber; a cleaning liquid supply unit for supplying a cleaning liquid to the etching chamber; and a first pressurization maintaining unit for maintaining at least one of the etching chamber and the etchant supply unit in a pressurized atmosphere.
    Type: Grant
    Filed: September 5, 2024
    Date of Patent: June 23, 2026
    Assignee: ZEUS CO., LTD.
    Inventors: Seung Hoon Lee, Sung Won Mo, Yang Ho Lee, Jeong Hyun Bae, Seong Hwan Park, Hyun Dong Cho
  • Publication number: 20260148540
    Abstract: A memory in which a training program for identifying concepts that degrade the performance of a concept bottleneck model and training the concept bottleneck model is stored; and a processor configured to execute the training program, wherein the training program: receives a training image set, trains a first concept bottleneck model to infer at least one class using the training image set, trains a second concept bottleneck model by applying a predetermined ratio of noise to the training image set, evaluates the first concept bottleneck model and the second concept bottleneck model using a test image set, and selects concepts that degrade the prediction accuracy of the concept bottleneck model for a specific class using weight information for each concept included in the evaluation results, and wherein the training image set includes: a target label representing a specific class and a concept label corresponding to the target label.
    Type: Application
    Filed: November 29, 2024
    Publication date: May 28, 2026
    Inventors: Nam Hoon LEE, Seong Hwan PARK, Ju Eun MOON
  • Patent number: 12573560
    Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, the body having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction, and first and second external electrodes respectively disposed on the third and fourth surfaces, and a ceramic chip including a ceramic substrate and first and second terminal electrodes disposed on the ceramic substrate and respectively connected to the first and second external electrodes, the ceramic chip disposed on the first surface of the body. The ceramic substrate includes Mg2SiO4.
    Type: Grant
    Filed: September 8, 2023
    Date of Patent: March 10, 2026
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyung Moon Jung, Seong Hwan Park, Dong Hyeon Lee
  • Patent number: 12532697
    Abstract: The present invention relates to an etching device and an etching method thereof, the etching device comprising: an etchant supply unit for supplying an etchant to an etching chamber; a rinsing liquid supply unit for supplying a rinsing liquid to the etching chamber, a cleaning liquid supply unit for supplying a cleaning liquid to the etching chamber, and a first pressurization maintaining unit for maintaining at least one of the etching chamber and the etchant supply unit in a pressurized atmosphere.
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: January 20, 2026
    Assignee: ZEUS CO., LTD.
    Inventors: Seung Hoon Lee, Sung Won Mo, Yang Ho Lee, Jeong Hyun Bae, Seong Hwan Park, Hyun Dong Cho
  • Publication number: 20250361354
    Abstract: A resin composition for encapsulating an electronic device according to an embodiment includes an epoxy compound, an inorganic filler, a (meth)acrylamide compound containing an alkoxysilyl group, and a release agent. The release agent may include a wax having an average acid value of 15 mgKOH/g to 200 mgKOH/g. An electronic device may include a sealant formed of the resin composition.
    Type: Application
    Filed: May 19, 2025
    Publication date: November 27, 2025
    Inventors: YU MI AHN, MIN SEOK KI, SU SEONG KIM, SEONG HWAN PARK
  • Publication number: 20250333619
    Abstract: A resin composition for sealing an electronic device includes epoxy compounds including a biphenyl-based epoxy compound and a biphenyl-aralkyl-based epoxy compound, and an inorganic filler containing alumina particles surface treated with a silane agent containing an alkyl group having 7 or more carbon atoms. The weight ratio of the biphenyl-based compound to the biphenyl-aralkyl-based compound from among the epoxy compounds is from 1:1.4 to 1:4.5.
    Type: Application
    Filed: July 9, 2025
    Publication date: October 30, 2025
    Inventors: YU MI AHN, JEONG MIN KANG, SU SEONG KIM, SEONG HWAN PARK, DONG CHAN LEE
  • Patent number: 12260994
    Abstract: A composite electronic component includes a ceramic electronic component including a body, comprising a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode; and an interposer including a substrate, disposed below the body, and a connection electrode disposed on the substrate and connected to the external electrode by a connection member. The external electrode includes a first electrode layer including metal particles and an insulating resin.
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: March 25, 2025
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyung Moon Jung, Seong Hwan Park, Sung Jun Lim
  • Patent number: 12183515
    Abstract: A ceramic electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; a first band electrode disposed on a portion of the first surface adjacent to the third surface; a second band electrode disposed on another portion of the first surface adjacent to the fourth surface; and insulating members disposed between the first and second band electrodes disposed on the first surface and spaced apart from each other, wherein the first surface is exposed through a space between the plurality of insulating members.
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: December 31, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seong Hwan Park, Kyung Moon Jung, Sung Jun Lim
  • Publication number: 20240429069
    Abstract: The present invention relates to an etching device and an etching method thereof, the etching device comprising: an etchant supply unit for supplying an etchant to an etching chamber, a rinsing liquid supply unit for supplying a rinsing liquid to the etching chamber; a cleaning liquid supply unit for supplying a cleaning liquid to the etching chamber; and a first pressurization maintaining unit for maintaining at least one of the etching chamber and the etchant supply unit in a pressurized atmosphere.
    Type: Application
    Filed: September 5, 2024
    Publication date: December 26, 2024
    Applicant: ZEUS CO., LTD.
    Inventors: Seung Hoon LEE, Sung Won MO, Yang Ho LEE, Jeong Hyun BAE, Seong Hwan PARK, Hyun Dong CHO
  • Publication number: 20240212939
    Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, the body having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction, and first and second external electrodes respectively disposed on the third and fourth surfaces, and a ceramic chip including a ceramic substrate and first and second terminal electrodes disposed on the ceramic substrate and respectively connected to the first and second external electrodes, the ceramic chip disposed on the first surface of the body. The ceramic substrate includes Mg2SiO4.
    Type: Application
    Filed: September 8, 2023
    Publication date: June 27, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyung Moon JUNG, Seong Hwan PARK, Dong Hyeon LEE
  • Patent number: 12013327
    Abstract: A flow cell device of the present invention comprises a flow path part in which a flow medium flows, and a flow cell part in which a flow path is formed.
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: June 18, 2024
    Assignees: ZEUS CO., LTD., ZEUS ENP CO., LTD.
    Inventors: Hyun Kook Park, Seong Hwan Park
  • Publication number: 20230197342
    Abstract: A ceramic electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; a first band electrode disposed on a portion of the first surface adjacent to the third surface; a second band electrode disposed on another portion of the first surface adjacent to the fourth surface; and insulating members disposed between the first and second band electrodes disposed on the first surface and spaced apart from each other, wherein the first surface is exposed through a space between the plurality of insulating members.
    Type: Application
    Filed: March 28, 2022
    Publication date: June 22, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seong Hwan PARK, Kyung Moon JUNG, Sung Jun LIM
  • Patent number: 11674875
    Abstract: A fluid medium monitoring apparatus of the present invention comprises: a light source unit for irradiating light; a first collimator unit for collimating light irradiated from the light source unit; a flow cell unit in which a fluid medium flows and light is allowed to absorb the wavelength of the fluid medium while proceeding along the moving direction of the fluid medium; and a light detection unit for detecting the wavelength of the light passing through the flow cell unit.
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: June 13, 2023
    Assignees: ZEUS CO., LTD., ZEUS ENP CO., LTD.
    Inventors: Hyun Kook Park, Chang Ho Choi, Seong Hwan Park
  • Publication number: 20230141373
    Abstract: A composite electronic component includes a ceramic electronic component including a body, comprising a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode; and an interposer including a substrate, disposed below the body, and a connection electrode disposed on the substrate and connected to the external electrode by a connection member. The external electrode includes a first electrode layer including metal particles and an insulating resin.
    Type: Application
    Filed: April 12, 2022
    Publication date: May 11, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyung Moon Jung, Seong Hwan Park, Sung Jun Lim
  • Publication number: 20220349814
    Abstract: A flow cell device of the present invention comprises a flow path part in which a flow medium flows, and a flow cell part in which a flow path is formed.
    Type: Application
    Filed: March 20, 2020
    Publication date: November 3, 2022
    Applicants: ZEUS CO., LTD., ZEUS ENP CO., LTD.
    Inventors: Hyun Kook PARK, Seong Hwan PARK
  • Publication number: 20220189796
    Abstract: The present invention relates to an etching device and an etching method thereof, the etching device comprising: an etchant supply unit for supplying an etchant to an etching chamber; a rinsing liquid supply unit for supplying a rinsing liquid to the etching chamber; a cleaning liquid supply unit for supplying a cleaning liquid to the etching chamber; and a first pressurization maintaining unit for maintaining at least one of the etching chamber and the etchant supply unit in a pressurized atmosphere.
    Type: Application
    Filed: April 22, 2020
    Publication date: June 16, 2022
    Applicant: ZEUS CO., LTD.
    Inventors: Seung Hoon LEE, Sung Won MO, Yang Ho LEE, Jeong Hyun BAE, Seong Hwan PARK, Hyun Dong CHO
  • Publication number: 20220115248
    Abstract: The present invention relates to an etching device using an etching chamber, comprising: an etchant storage chamber in which an etchant is stored; a connection unit communicating with the etching liquid storage chamber; an etching chamber which is connected with the etching liquid storage chamber through the connection unit, and in which an object is etched; and a pressurization maintaining unit for maintaining the etching liquid storage chamber and/or the etching chamber in a pressurized atmosphere.
    Type: Application
    Filed: April 22, 2020
    Publication date: April 14, 2022
    Applicant: ZEUS CO., LTD.
    Inventors: Seung Hoon LEE, Sung Won MO, Yang Ho LEE, Jeong Hyun BAE, Seong Hwan PARK, Hyun Dong CHO
  • Publication number: 20220108897
    Abstract: The present invention relates to an etching device comprising: an etching chamber; an opening/closing unit for opening/closing the etching chamber; and a locking unit for selectively locking the opening/closing unit.
    Type: Application
    Filed: April 22, 2020
    Publication date: April 7, 2022
    Applicant: ZEUS CO., LTD.
    Inventors: Seung Hoon LEE, Sung Won MO, Joo Hyoung LEE, Beom Su KI, Seong Hwan PARK, Hyun Dong CHO
  • Publication number: 20220057314
    Abstract: A fluid medium monitoring apparatus of the present invention comprises: a light source unit for irradiating light; a first collimator unit for collimating light irradiated from the light source unit; a flow cell unit in which a fluid medium flows and light is allowed to absorb the wavelength of the fluid medium while proceeding along the moving direction of the fluid medium; and a light detection unit for detecting the wavelength of the light passing through the flow cell unit.
    Type: Application
    Filed: March 20, 2020
    Publication date: February 24, 2022
    Applicants: ZEUS CO., LTD., ZEUS ENP CO., LTD.
    Inventors: Hyun Kook PARK, Chang Ho CHOI, Seong Hwan PARK
  • Patent number: 11244921
    Abstract: A semiconductor package is provided. The semiconductor package includes a connection structure, a semiconductor chip, and a connection metal. The connection structure includes a redistribution layer and a connection via layer. The semiconductor chip is disposed on the connection structure, and includes a connection pad. The connection metal is disposed on the connection structure and is electrically connected to the connection pad by the connection structure. The connection via layer includes a connection via having a major axis and a minor axis, and in a plan view, the minor axis of the connection via intersects with the connection metal.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: February 8, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chang Eun Joo, Sung Hoan Kim, Kyung Moon Jung, Yong Hwan Kwon, Young Kyu Lim, Seong Hwan Park