Abstract: A liquefied gas storage tank includes a corner block disposed on a corner portion, wherein the corner block includes a lower block, an upper block and an upper connecting block, the upper block includes a first inner fixing unit and a second inner fixing unit respectively provided inside a first surface and a second surface, bonded and connected to a secondary barrier, and each having a structure in which a primary inner plywood, a primary corner insulating material, and a primary outer plywood are stacked, and an inner bent portion installed at a corner spatial portion between the first inner fixing unit and the second inner fixing unit, and both side surfaces of the inner bent portion that are perpendicular to the secondary barrier each have a height reduced from a total height of each of the first and second inner fixing units.

Abstract: An electronic pedal apparatus includes a pad that rectilinearly moves and rotates along a pad guide while being kept in line contact with the pad guide including a shape of an arc when a driver operates the pad, an acceleration signal or a braking signal for a vehicle is generated by operation of the single pad, and a movement direction of the pad at the time of generating the acceleration signal is different from a movement direction of the pad at the time of generating the braking signal.

Abstract: An embodiment electronic pedal apparatus includes a pedal housing and an accelerator pedal assembly and a brake pedal assembly coupled to the pedal housing and configured to move along different movement trajectories when the accelerator pedal assembly and the brake pedal assembly are operated. In an embodiment, the accelerator pedal assembly is compressed and moved upward when the accelerator pedal assembly is operated, and the brake pedal assembly is compressed and moved downward when the brake pedal assembly is operated.

Abstract: The liquefied gas storage tank includes a primary barrier, a primary insulation wall, a secondary barrier, and a secondary insulation wall. In a state where unit elements are arranged adjacent to each other, each of the unit elements being formed by stacking the secondary insulation wall, the secondary barrier, and a fixed insulation wall which is a part of the primary insulation wall, the primary insulation wall may comprise: a connection insulation wall provided in the space between the adjacent fixed insulation walls; first slits formed between the fixed insulation walls and the connection insulation wall when the connection insulation wall is inserted and installed between the adjacent fixed insulation walls; a plurality of second slits formed in a lengthwise direction and a widthwise direction of the fixed insulation walls; and a first insulating filler material for filling the first slits.

Abstract: Provided are an efficient quantum modular multiplier using characteristics of a modular operation, that is, a quantum modular multiplier having low quantum circuit complexity, and a quantum modular multiplication method. A quantum modular multiplier according to one embodiment of the present invention is a quantum modular multiplier for multiplying first qubits having N digits by second qubits having N digits (N is a natural number that is greater than or equal to 2) and includes a first auxiliary register setting unit, a second auxiliary register setting unit, an addition unit, and an auxiliary register initialization unit.

Abstract: A light emitting display device includes: a display area; a first component area positioned within the display area and that includes a plurality of pixels, each pixel of the plurality of pixels respectively includes a pixel circuit part, and the first component area further includes a first photosensor area and a second photosensor area between the plurality of pixels. The first photosensor area includes: a first sub-photosensor area positioned between adjacent pixel circuit parts; and a light blocking layer positioned on a front surface of the first sub-photosensor area and that includes an opening that overlaps the first sub-photosensor area on a plane. The second photosensor area includes: a second sub-photosensor area positioned between the adjacent pixel circuit parts; and the light blocking layer positioned on a front surface of the second sub-photosensor area and that overlaps the second sub-photosensor area.

Abstract: A particle measuring device includes a probe including a nozzle spraying a gas on a surface of an object and an inlet inhaling the gas and particles scattered from the surface by the gas; a main pipe including an inflow hole through which the gas flows and a discharge hole through which the gas is discharged; a first manifold provided to connect the main pipe to the nozzle, and supplying the gas to the nozzle; a second manifold provided to connect the main pipe to the inlet between a connecting portion of the first manifold and the discharge hole, and supplying the particles and the gas to the main pipe; a third manifold branched from the second manifold and supplying the particles and the gas; and a particle counter connected to the third manifold, and counting the particles included in the gas supplied through the third manifold.

Abstract: A light emitting display device includes a substrate, an organic layer, a conductor, an anode, and a pixel definition layer. The organic layer overlaps the substrate and has a connection opening. The conductor is positioned between the substrate and the organic layer. The anode is positioned on the organic layer and is partially positioned inside the connection opening. The pixel definition layer exposes an exposed portion of the anode. The organic layer has a halftone exposure portion and a neighboring portion. The halftone exposure portion overlaps the exposed portion of the anode and overlaps the conductor. The neighboring portion neighbors the halftone exposure portion. A face of the halftone exposure portion and a face of the neighboring portion are spaced from the substrate by a first distance and a second distance, respectively. A difference between the first distance and the second distance is 30 nm or less.

Abstract: The battery case according to one embodiment may comprise: a base plate member; a support member which surrounds the base plate member, has a closed cross-section, and supports the base plate member; and an absorption member which is coupled to the outside of the support member so as to form a closed cross-section and absorbs external impacts.

Abstract: A display device may include a sensor layer, a substrate, a pixel layer, and a black matrix. The sensor layer may include photo sensors. The substrate may be positioned on the sensor layer. The pixel layer may be positioned on the substrate and may include pixels. The substrate may be positioned between the sensor layer and the pixel layer. The pixels may include pixel electrodes. The black matrix may be positioned on the pixel layer, may include first-set openings respectively overlapping with the pixel electrodes, and may include second-set openings not overlapping with any pixel electrodes of the display device in a direction perpendicular to the substrate. The pixel layer may be positioned between the substrate and the black matrix.

Abstract: A coil component includes a body, a coil portion embedded in the body, and external electrodes electrically connected to the coil portion. The coil portion includes coil patterns having trenches formed in surfaces thereof. The trenches extend through a partial thickness of the coil portion, and are located at aligned locations in adjacent windings of the coil portion. A method of forming the coil component includes forming a mask pattern having a coil shaped opening and including a plurality of bridges extending across the coil shaped opening in the mask pattern.

Abstract: A coil component includes a magnetic body and a coil portion embedded in the magnetic body. The coil portion includes an internal insulating layer, coil patterns disposed on opposite surfaces of the internal insulating layer, an insulating wall disposed between turns of a coil pattern, an external insulating layer disposed on the insulating wall and the coil pattern, and a connection portion including a first conductive layer and a second conductive layer having a melting point lower than a melting point of the first conductive layer, and penetrating through the internal insulating layer to connect the coil patterns disposed on the opposite surfaces of the internal insulating layer to each other.

Abstract: A display device according to an exemplary embodiment includes: a substrate including a display area and a transmission area; a metal blocking layer disposed in the display area of the substrate; an inorganic insulating layer disposed on the metal blocking film; a transistor disposed on the inorganic insulating layer; an emission layer connected to the transistor; and a light blocking layer and a color filter disposed on the emission layer of the display area, wherein the edge of the light blocking layer is protruded toward the transmission area more than the edge of the metal blocking layer.

Abstract: A display device includes: a first electrode; a second electrode overlapping the first electrode; a light emission layer disposed between the first electrode and the second electrode; a partition wall overlapping a portion of the first electrode; and an inorganic layer disposed between the partition wall and the first electrode, wherein the inorganic layer covers an end of the first electrode.

Abstract: A light emitting display device includes a substrate including a display area and a non-display area adjacent to the display area; a lower pad electrode on the substrate in the non-display area; a planarization layer overlapping the lower electrode; an upper pad electrode on the lower pad electrode and overlapping at least a portion of the lower planarization layer. The planarization layer includes an opening exposing an upper surface of the lower pad electrode, the lower pad electrode and the upper pad electrode are electrically connected to each other through the opening, the lower planarization layer includes an exposed portion exposing an upper surface of the lower planarization layer, and an overlapping portion overlapping at least a portion of the upper pad electrode, and a height of the upper surface of the exposed portion is lower than a height of an upper surface of the overlapping portion.

Abstract: A display device includes: a first electrode; a second electrode overlapping the first electrode; a light emission layer disposed between the first electrode and the second electrode; a partition wall overlapping a portion of the first electrode; and an inorganic layer disposed between the partition wall and the first electrode, wherein the inorganic layer covers an end of the first electrode.

Abstract: Provided are a low-cost semiconductor device manufacturing method and a semiconductor device made using the method. The method includes forming multiple body regions in a semiconductor substrate, forming multiple gate insulating layers and multiple gate electrodes in the body region; implementing a blanket ion implantation in an entire surface of the substrate to form a low concentration doping region (LDD region) in the body region without a mask, forming a spacer at a side wall of the gate electrode, and implementing a high concentration ion implantation to form a high concentration source region and a high concentration drain region around the LDD region. According to the examples, devices have favorable electrical characteristics and at the same time, manufacturing costs are reduced. Since, when forming high concentration source region and drain regions, tilt and rotation co-implants are applied, an LDD masking step is potentially omitted.

Abstract: A coil component includes a magnetic body and a coil portion embedded in the magnetic body. The coil portion includes an internal insulating layer, coil patterns disposed on opposite surfaces of the internal insulating layer, an insulating wall disposed between turns of a coil pattern, an external insulating layer disposed on the insulating wall and the coil pattern, and a connection portion including a first conductive layer and a second conductive layer having a melting point lower than a melting point of the first conductive layer, and penetrating through the internal insulating layer to connect the coil patterns disposed on the opposite surfaces of the internal insulating layer to each other.

Abstract: The present invention relates to a preparing method of a polyolefin resin mono chip including: forming a thermoplastic resin composite by impregnating a fiber reinforcing agent having a length of 5 mm to 20 mm into a molten mixture including a propylene homopolymer of which a molecular weight distribution Is 3 to 6, and a colorant, wherein a cooling speed at room temperature of the thermoplastic resin composite is 19° C./min or more. In addition, the present invention relates to a polyolefin resin mono chip including: a thermoplastic resin composite including a polymer substrate including a propylene homopolymer of which a molecular weight distribution is 3 to 6, and a colorant; and a fiber reinforcing agent having a length of 5 mm to 20 mm and impregnated into the polymer substrate, wherein an impact strength measured according to ASTM D256 is 200 J/m or more.

Abstract: A coil component includes a body, a coil portion embedded in the body, and external electrodes electrically connected to the coil portion. The coil portion includes coil patterns having trenches formed in surfaces thereof. The trenches extend through a partial thickness of the coil portion, and are located at aligned locations in adjacent windings of the coil portion. A method of forming the coil component includes forming a mask pattern having a coil shaped opening and including a plurality of bridges extending across the coil shaped opening in the mask pattern.