Patents by Inventor Serapion C. Daof

Serapion C. Daof has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140341796
    Abstract: A dual-side wafer bar grinding method and apparatus is disclosed herein that slices wafer bars from a wafer block for use in manufacturing thin film magnetic heads, for example. By grinding opposing faces of the wafer bars sliced from the wafer block, variations in flatness, perpendicularity, surface finish, and/or overall dimensions are improved.
    Type: Application
    Filed: May 20, 2013
    Publication date: November 20, 2014
    Applicant: Veeco Instruments, Inc.
    Inventors: Jianmin Wang, Serapion C. Daof, Senghong Chua, Meng Lee