Abstract: A method and an apparatus for providing a message notification service based on spatial information are disclosed. A method for providing a message notification service from a server may include: receiving current circumstance information from a user terminal; if there exists a notification condition matching the current circumstance information, then extracting the message corresponding to the notification condition that matches the current circumstance information; and transmitting the extracted message to the user terminal.

Abstract: A fuel cell and a membrane electrode assembly used therein. The membrane electrode assembly is a three-dimensional membrane electrode assembly for fuel cell configured as a three-dimensional thin film structure in which an inner space is divided into two intertwined subvolumes by an interface, and the interface is configured as an MEA thin film and a first subvolume of the two subvolumes is provided as a channel for fuel and a second subvolume is provided as a channel for an oxidizer. The fuel cell includes a casing which accommodates the three-dimensional membrane electrode assembly therein and independently communicates with the first subvolume and the second subvolume and includes inlets and outlets for the fuel and the oxidizer.

Abstract: Disclosed are a malicious code deactivating apparatus and a method of operating the same. The malicious code deactivating apparatus and the method of operating the same provide a high security malicious code deactivating apparatus for preliminarily performing a malicious code inspection on a target process and then executing the target process in a terminal unit, by including a monitor, a comparator, a controller, an analyzer, and a storage.

Abstract: A semiconductor device with thin redistribution layers is disclosed and may include forming a first redistribution layer on a dummy substrate, electrically coupling a semiconductor die to the first redistribution layer, and forming a first encapsulant layer on the redistribution layer and around the semiconductor die. The dummy substrate may be removed thereby exposing a second surface of the first redistribution layer. A dummy film may be temporarily affixed to the exposed second surface of the redistribution layer and a second encapsulant layer may be formed on the exposed top surface of the semiconductor die, a top surface and side edges of the first encapsulant layer, and side edges of the first redistribution layer. The dummy film may be removed to again expose the second surface of the first redistribution layer, and a second redistribution layer may be formed on the first redistribution layer and on the second encapsulant layer.

Abstract: A semiconductor package using a coreless signal distribution structure (CSDS) is disclosed and may include a CSDS comprising at least one dielectric layer, at least one conductive layer, a first surface, and a second surface opposite to the first surface. The semiconductor package may also include a first semiconductor die having a first bond pad on a first die surface, where the first semiconductor die is bonded to the first surface of the CSDS via the first bond pad, and a second semiconductor die having a second bond pad on a second die surface, where the second semiconductor die is bonded to the second surface of the CSDS via the second bond pad. The semiconductor package may further include a metal post electrically coupled to the first surface of the CSDS, and a first encapsulant material encapsulating side surfaces and a surface opposite the first die surface of the first semiconductor die, the metal post, and a portion of the first surface of the CSDS.

Abstract: A semiconductor device with thin redistribution layers is disclosed and may include forming a first redistribution layer on a dummy substrate, electrically coupling a semiconductor die to the first redistribution layer, and forming a first encapsulant layer on the redistribution layer and around the semiconductor die. The dummy substrate may be removed thereby exposing a second surface of the first redistribution layer. A dummy film may be temporarily affixed to the exposed second surface of the redistribution layer and a second encapsulant layer may be formed on the exposed top surface of the semiconductor die, a top surface and side edges of the first encapsulant layer, and side edges of the first redistribution layer. The dummy film may be removed to again expose the second surface of the first redistribution layer, and a second redistribution layer may be formed on the first redistribution layer and on the second encapsulant layer.

Abstract: A semiconductor device and manufacturing method thereof. Various aspects of the disclosure may, for example, comprise connection verification for a first one or more mounted components prior to additional assembly.

Abstract: A semiconductor package using a coreless signal distribution structure (CSDS) is disclosed and may include a CSDS comprising at least one dielectric layer, at least one conductive layer, a first surface, and a second surface opposite to the first surface. The semiconductor package may also include a first semiconductor die having a first bond pad on a first die surface, where the first semiconductor die is bonded to the first surface of the CSDS via the first bond pad, and a second semiconductor die having a second bond pad on a second die surface, where the second semiconductor die is bonded to the second surface of the CSDS via the second bond pad. The semiconductor package may further include a metal post electrically coupled to the first surface of the CSDS, and a first encapsulant material encapsulating side surfaces and a surface opposite the first die surface of the first semiconductor die, the metal post, and a portion of the first surface of the CSDS.

Abstract: Disclosed are a system and a method for detecting a malicious code using visualization in order to allow a user to intuitively detect behavior of client terminals infected with a malicious code. The system for detecting a malicious code using visualization includes a data collection module which collects DNS packets, a parameter extraction module which extracts parameters for visualization from the collected DNS packets, a data loading module which loads the extracted parameters; a blacklist management module which manages blacklist domain, a filter module which filters unnecessary data from the loaded data, and a visualization generation module which generates visualization patterns using the extracted parameters.

Abstract: A semiconductor device with thin redistribution layers is disclosed and may include forming a first redistribution layer on a dummy substrate, electrically coupling a semiconductor die to the first redistribution layer, and forming a first encapsulant layer on the redistribution layer and around the semiconductor die. The dummy substrate may be removed thereby exposing a second surface of the first redistribution layer. A dummy film may be temporarily affixed to the exposed second surface of the redistribution layer and a second encapsulant layer may be formed on the exposed top surface of the semiconductor die, a top surface and side edges of the first encapsulant layer, and side edges of the first redistribution layer. The dummy film may be removed to again expose the second surface of the first redistribution layer, and a second redistribution layer may be formed on the first redistribution layer and on the second encapsulant layer.

Abstract: The present invention relates to an assistant robot for spine surgery, including: a surgical tool support provided with a rotating body to which the surgical tool is penetratingly coupled; a handle provided at one side of the surgical tool support; a driving member configured to rotate the rotating body; and a linear guide provided at the other side of the surgical tool support so as to move the surgical tool forward and backward. Accordingly, the surgical tool can smoothly move without vibration when moving forward and backward, and can be automatically rotated with uniform force so as to enable sophisticated surgery.

Abstract: A semiconductor device and a manufacturing method thereof, which can reduce a number of manufacturing processes and/or can reduce a thickness of the semiconductor device. As a non-limiting example, various aspects of this disclosure provide for the elimination process steps and/or a reduction in package size based on dielectric layer characteristics.

Abstract: A semiconductor device with thin redistribution layers is disclosed and may include forming a first redistribution layer on a dummy substrate, electrically coupling a semiconductor die to the first redistribution layer, and forming a first encapsulant layer on the redistribution layer and around the semiconductor die. The dummy substrate may be removed thereby exposing a second surface of the first redistribution layer. A dummy film may be temporarily affixed to the exposed second surface of the redistribution layer and a second encapsulant layer may be formed on the exposed top surface of the semiconductor die, a top surface and side edges of the first encapsulant layer, and side edges of the first redistribution layer. The dummy film may be removed to again expose the second surface of the first redistribution layer, and a second redistribution layer may be formed on the first redistribution layer and on the second encapsulant layer.

Abstract: The present invention is for preventing a mobile terminal from being hacked and relates to a system and method for identifying whether link information is safe. A system including a mobile terminal and an external server capable of being connected to the mobile terminal comprises: a mobile terminal for, when a web connection for any web site has been selected, extracting link information on the web site to transmit the link information to the external server, receiving a result of performing the web connection from the external server, and outputting the result; and an external server for, when the link information has been received, performing a web connection according to the link information using a preconfigured virtual execution means, and transmitting a result obtained by performing the web connection to the mobile terminal in response to the link information transmission.

Abstract: A semiconductor package using a coreless signal distribution structure (CSDS) is disclosed and may include a CSDS comprising at least one dielectric layer, at least one conductive layer, a first surface, and a second surface opposite to the first surface. The semiconductor package may also include a first semiconductor die having a first bond pad on a first die surface, where the first semiconductor die is bonded to the first surface of the CSDS via the first bond pad, and a second semiconductor die having a second bond pad on a second die surface, where the second semiconductor die is bonded to the second surface of the CSDS via the second bond pad. The semiconductor package may further include a metal post electrically coupled to the first surface of the CSDS, and a first encapsulant material encapsulating side surfaces and a surface opposite the first die surface of the first semiconductor die, the metal post, and a portion of the first surface of the CSDS.

Abstract: In one embodiment, a method for forming an electronic device includes providing a substrate having a plurality of electronic devices formed therein, forming a protective layer over a major surface of the substrate containing the plurality of electronic devices, forming a mold layer over the protective layer, thinning a major surface of the substrate opposite to the major surface containing the plurality of electronic devices, and removing the adhesive layer and the mold layer. In another embodiment, a zone coating layer can be included between the protective layer and the mold layer.