Abstract: Provided are: a culture fluid composition for delaying the ripening of kimchi, which contains a mixed lactic acid bacterial culture fluid with which a culture fluid containing six types of lactic acid bacteria is mixed to be capable of specifically inhibiting the proliferation of lactic acid bacteria in fermented kimchi; vitamin B1; and lactic acid and a method for making kimchi using same for delaying the ripening of kimchi.

Abstract: An LED package includes a package body having a well formed in its upper surface, where the well is configured to receive a light emitting chip. An optical lens is disposed above the package body and includes a hollow dome structure located above and encompassing the lateral extent of the light emitting chip within the well of the package body. In one implementation, the package body and the optical lens collectively include at least one protrusion and concave, where the protrusion is aligned with the concave so that the optical lens mates with the package body, thereby causing the optical lens to self align with the package body. In another implementation, a protruding inner portion of the upper surface of the package body mates with the hollow dome structure, achieving a similar purpose. Consequently, generation of an eccentric fault between the optical lens and the package body is prevented.

Abstract: The present invention relates to a light emitting diode package which can reduce a wire length, and can improve heat and light resistance. The light emitting diode package includes a molded portion having a housing, a plurality of light emitting chips housed in the housing, a plurality of main lead portions having the plurality of light emitting chips mounted thereto respectively, at least one sub-lead portion formed spaced from the main lead portions and electrically connected to at least any one of the plurality of main lead portions and the plurality of light emitting chips with a wire for electrically connecting the plurality of light emitting chips each other.

Abstract: Disclosed is a hybrid LED chip: comprising a first clad layer of P-type semiconductor material; a second clad layer of N-type semiconductor material; an active layer between the first and second clad layers; a first bonding metal layer on the first clad layer; a second bonding metal layer on the second clad layer; a ceramic substrate positioned on and bonded to the first and second bonding metal layers, wherein the ceramic substrate includes at least one first via hole to expose the first bonding metal layer, and at least one second via hole to expose the second bonding metal layer; a P-type electrode formed by burying a conductive material in the at least one first via hole; and an N-type electrode formed by burying a conductive material in the at least one second via hole, wherein the first and second via holes in the ceramic substrate are formed in cylindrical shapes, and the circumferential surface of each cylindrical shape is provided with an intaglio pattern.

Abstract: A light emitting diode (LED) package and a method of manufacturing a LED package is provided. The LED package includes a case having first and second lead frames disposed through the case; an LED chip disposed on the case, the LED chip having first and second electrodes directly connected to the first and second lead frames through a eutectic bond, respectively; and a lens disposed over the case covering the LED chip.

Abstract: The present invention relates to a light emitting diode package which can reduce a wire length, and can improve heat and light resistance. The light emitting diode package includes a molded portion having a housing, a plurality of light emitting chips housed in the housing, a plurality of main lead portions having the plurality of light emitting chips mounted thereto respectively, at least one sub-lead portion formed spaced from the main lead portions and electrically connected to at least any one of the plurality of main lead portions and the plurality of light emitting chips with a wire for electrically connecting the plurality of light emitting chips each other.

Abstract: An electronic circuit apparatus for compensating for a process variation of a resistor in an electronic circuit is provided. The electronic circuit includes a detecting part for generating a tune voltage corresponding to a process variation value of the at least one resistor, and a compensating part for compensating for a process variation of the at least one resistor using the tune voltage.

Abstract: A field mounting-type test apparatus and method for enhancing competitiveness of a product by simulating various test conditions including a mounting environment for improving quality reliability of a memory device and by minimizing overall loss due to change in a mounting environment thus reducing testing time and cost. The field mounting-type test apparatus includes a mass storage device configured to store logic data simulating a mounting environment of a device under test (DUT) and a tester main frame configured to test the DUT using the logic data.

Abstract: Disclosed is a hybrid LED chip: comprising a first clad layer of P-type semiconductor material; a second clad layer of N-type semiconductor material; an active layer between the first and second clad layers; a first bonding metal layer on the first clad layer; a second bonding metal layer on the second clad layer; a ceramic substrate positioned on and bonded to the first and second bonding metal layers, wherein the ceramic substrate includes at least one first via hole to expose the first bonding metal layer, and at least one second via hole to expose the second bonding metal layer; a P-type electrode formed by burying a conductive material in the at least one first via hole; and an N-type electrode formed by burying a conductive material in the at least one second via hole, wherein the first and second via holes in the ceramic substrate are formed in cylindrical shapes, and the circumferential surface of each cylindrical shape is provided with an intaglio pattern.

Abstract: A light emitting diode (LED) package and a method of manufacturing a LED package is provided. The LED package includes a case having first and second lead frames disposed through the case; an LED chip disposed on the case, the LED chip having first and second electrodes directly connected to the first and second lead frames through a eutectic bond, respectively; and a lens disposed over the case covering the LED chip.

Abstract: A display device capable of reducing afterimage, and an afterimage reduction method used by the display device. One or more afterimage reduction patterns having one or more opaque areas, and/or one or more semi-transparent areas and one or more non-opaque areas are stored in a storage unit. A composition unit outputs a final image composed of a displayed main image and afterimage reduction patterns output from the storage unit. A control unit causes afterimage reduction patterns selected by a user from the storage unit to be input to the composition unit, and a final image in which only pixels corresponding to opaque areas and/or semi-transparent areas in the main image are replaced by color of the opaque areas and/or semi-transparent areas in the afterimage reduction patterns to be output from the composition unit. Accordingly, it is possible to view a received main image while reducing afterimage using images of various patterns for afterimage reduction.

Abstract: The present invention relates to Tc-labeled arylpiperazine derivatives for imaging serotonin receptor and, more particularly, to arylpiperazine derivatives coupled with MAMA-disulfide, N2S2 or dimethyl-N2S2 chelating ligand represented by the following chemical formula (1). New arylpiperazine derivatives according to the present invention have no problem of amide hydrolysis in metabolism and have a high affinity for serotonin receptors, and can be labeled with an optimum radionuclide of technetium, thereby being usefully applied for monitoring neurodegenerative diseases or neurological diseases of a mammal.

Abstract: Disclosed relates to an ionic liquid type crown ether derivative, expressed by Chemical Formula 1 below, for isolating metal ions, a method for preparing the same and a method for isolating selectively the metal ions using the cycle size of the same. The present invention can provide the ionic liquid type crown ether and isolate metal ions including radioactive isotopes efficiently using the same. Furthermore, the prevent invention provides crown ether valuably used as a recyclable and environment-friendly isolating medium by preparing crown ether of ionic liquid type. wherein m, n, X? and R are identical with those in the description.

Abstract: Automatic test equipment is capable of performing a high-speed test of semiconductor devices, with a low cost and high efficiency. The automatic test equipment (ATE) comprises: an ATE body configured to electrically test semiconductor devices; a field programmable gate array (FPGA) controlling drivers and comparators on the ATE; an accelerator connected to an output terminal of the FPGA and that doubles an operating frequency of the FPGA; and a decelerator connected to an output terminal of the FPGA and that converts an operating frequency of data transferred from the semiconductor device to the operating frequency of the FPGA.